Patents by Inventor Watcharapong Nokde

Watcharapong Nokde has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming a surface-mount integrated circuit package with solder enhanced leadframe terminals
    Patent number: 11887864
    Abstract: Flat no-leads integrated circuit (IC) packages are formed with solder wettable leadframe terminals. Dies are mounted on die attach pads, bonded to adjacent leadframe terminal structures, and encapsulated in a mold compound. A laser grooving process removes mold compound from a leadframe terminal groove extending along a row of leadframe terminal structures. A saw step cut along the leadframe terminal groove extends partially through the leadframe thickness to define a saw step cut groove. Exposed leadframe surfaces, including surfaces exposed by the saw step cut, are plated with a solder-enhancing material. A singulation cut is performed along the saw step cut groove to define leadframe terminals with end surfaces plated with the solder-enhancing material. The laser grooving process may improve the results of the saw step cut, and the saw step cut may remove mold compound not removed by the laser grooving process.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: January 30, 2024
    Assignee: Microchip Technology Incorporated
    Inventors: Wichai Kovitsophon, Rangsun Kitnarong, Ekgachai Kenganantanon, Pattarapon Poolsup, Watcharapong Nokde, Chanyuth Junjuewong
  • METHOD OF FORMING A SURFACE-MOUNT INTEGRATED CIRCUIT PACKAGE WITH SOLDER ENHANCED LEADFRAME TERMINALS
    Publication number: 20220344173
    Abstract: Flat no-leads integrated circuit (IC) packages are formed with solder wettable leadframe terminals. Dies are mounted on die attach pads, bonded to adjacent leadframe terminal structures, and encapsulated in a mold compound. A laser grooving process removes mold compound from a leadframe terminal groove extending along a row of leadframe terminal structures. A saw step cut along the leadframe terminal groove extends partially through the leadframe thickness to define a saw step cut groove. Exposed leadframe surfaces, including surfaces exposed by the saw step cut, are plated with a solder-enhancing material. A singulation cut is performed along the saw step cut groove to define leadframe terminals with end surfaces plated with the solder-enhancing material. The laser grooving process may improve the results of the saw step cut, and the saw step cut may remove mold compound not removed by the laser grooving process.
    Type: Application
    Filed: May 21, 2021
    Publication date: October 27, 2022
    Applicant: Microchip Technology Incorporated
    Inventors: Wichai Kovitsophon, Rangsun Kitnarong, Ekgachai Kenganantanon, Pattarapon Poolsup, Watcharapong Nokde, Chanyuth Junjuewong