Abstract: Systems and methods are disclosed for testing semiconductor devices, using a tester providing tested semiconductor devices to a device output track, which feeds the semiconductor devices into a storage tube. The tester selectively removes the storage tube from the output track when the tube is filled and when no device is in the output track proximate the semiconductor storage tube. In addition, the tester refrains from removing the storage tube from the output track when a semiconductor device is in the device output track proximate the storage tube, so as to prevent or reduce damage to semiconductor devices during removal of the storage tube from the output track.

Abstract: Aspects for detecting integrated circuit package orientation in carrier tape packing are described. In accordance with these aspects, a digital circuit is provided over a carrier rail of a tape and reel system. The digital circuit detects package orientation based on a chamfer side of packages within a tape on the carrier rail. The digital circuit further includes at least two optical sensors, where the optical sensors emit a light beam and sense reflection of the light beam for each package within the tape for use in determining package orientation in an automated manner.