Patents by Inventor Way Lee Cheng

Way Lee Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal structure for integrated circuit package
    Patent number: 9741638
    Abstract: One or more heat pipes are utilized along with a substrate in order to provide heat dissipation through the substrate for heat that can build up at an interface between the substrate and one or more semiconductor chips in a package. In an embodiment the heat pipe may be positioned on a side of the substrate opposite the semiconductor chip and through-substrate vias may be utilized to dissipate heat through the substrate. In an alternative embodiment, the heat pipe may be positioned on a same side of the substrate as the semiconductor chip and may be thermally connected to the one or more semiconductor chips.
    Type: Grant
    Filed: May 9, 2016
    Date of Patent: August 22, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Chieh Hsieh, Shin-Puu Jeng, Shang-Yun Hou, Way Lee Cheng
  • Thermal Structure for Integrated Circuit Package
    Publication number: 20160254211
    Abstract: One or more heat pipes are utilized along with a substrate in order to provide heat dissipation through the substrate for heat that can build up at an interface between the substrate and one or more semiconductor chips in a package. In an embodiment the heat pipe may be positioned on a side of the substrate opposite the semiconductor chip and through-substrate vias may be utilized to dissipate heat through the substrate. In an alternative embodiment, the heat pipe may be positioned on a same side of the substrate as the semiconductor chip and may be thermally connected to the one or more semiconductor chips.
    Type: Application
    Filed: May 9, 2016
    Publication date: September 1, 2016
    Inventors: Cheng-Chieh Hsieh, Shin-Puu Jeng, Shang-Yun Hou, Way Lee Cheng
  • Thermal structure for integrated circuit package
    Patent number: 9337123
    Abstract: One or more heat pipes are utilized along with a substrate in order to provide heat dissipation through the substrate for heat that can build up at an interface between the substrate and one or more semiconductor chips in a package. In an embodiment the heat pipe may be positioned on a side of the substrate opposite the semiconductor chip and through-substrate vias may be utilized to dissipate heat through the substrate. In an alternative embodiment, the heat pipe may be positioned on a same side of the substrate as the semiconductor chip and may be thermally connected to the one or more semiconductor chips.
    Type: Grant
    Filed: July 11, 2012
    Date of Patent: May 10, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Chieh Hsieh, Way Lee Cheng, Shang-Yun Hou, Shin-Puu Jeng
  • Thermal Structure for Integrated Circuit Package
    Publication number: 20140015106
    Abstract: One or more heat pipes are utilized along with a substrate in order to provide heat dissipation through the substrate for heat that can build up at an interface between the substrate and one or more semiconductor chips in a package. In an embodiment the heat pipe may be positioned on a side of the substrate opposite the semiconductor chip and through-substrate vias may be utilized to dissipate heat through the substrate. In an alternative embodiment, the heat pipe may be positioned on a same side of the substrate as the semiconductor chip and may be thermally connected to the one or more semiconductor chips.
    Type: Application
    Filed: July 11, 2012
    Publication date: January 16, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Chieh Hsieh, Way Lee Cheng, Shang-Yun Hou, Shin-Puu Jeng