Abstract: A semiconductor device and method of making same which includes a semiconductor substrate having a moat region with an ion implant in the moat region and a window in the substrate spaced from the moat region, electrically decoupled therefrom and having an ion implant therein in the form of a predetermined pattern. The moat region can contain one or more active and/or passive components therein. The method of fabrication comprises providing a semiconductor wafer, forming a moat region and an associated window region on the wafer, forming at least portions of electrical devices in the moat region by implanting ions therein, forming a predetermined non-electrical component pattern in the window by implanting ions in the window concurrently with the implanting of ions in the moat and completing fabrication of at least one electrical component in the moat region.

Abstract: The method of this invention allows use of a smaller wordline voltage Vp1 during programming. In addition, the method results in a relatively narrow distribution of threshold voltages Vt when used to flash program an array of memory cells (10). The method of this invention increases compaction gate-current efficiency by reverse biasing the source (11)/substrate (23) junction of the cell being programmed. The reverse biasing is accomplished, for example, by applying a bias voltage to the source (11) or by placing a diode (27), a resistor (29) or other impedance in series with the source (11). The reverse biasing limits the source current (Is) of cell being programmed and of the entire array during flash-programming compaction.

Abstract: A semiconductor device and method of making same which includes a semiconductor substrate having a moat region with an ion implant in the moat region and a window in the substrate spaced from the moat region, electrically decoupled therefrom and having an ion implant therein in the form of a predetermined pattern. The moat region can contain one or more active and/or passive components therein. The method of fabrication comprises providing a semiconductor wafer, forming a moat region and an associated window region on the wafer, forming at least portions of electrical devices in the moat region by implanting ions therein, forming a predetermined non-electrical component pattern in the window by implanting ions in the window concurrently with the implanting of ions in the moat and completing fabrication of at least one electrical component in the moat region.

Abstract: The erasing method of this invention results in a relatively narrow distribution of threshold voltages when used to flash erase a group of floating-gate-type memory cells (10). Each cell includes a control gate (14), a source (11) and a drain (12). The method comprises connecting the control gates (14) to a control-gate voltage (Vg), connecting the sources (11) to a source voltage (Vs) having a higher potential than the control-gate voltage (Vg) and connecting the drains (12) to a drain subcircuit (DS) having, in at least one embodiment, a potential (Vd) between the control-gate voltage (Vg) and the source voltage (Vs), the drain subcircuit (DS) having a sufficiently low impedance to allow current flow between the sources (11) and drains (12) at a time during the erasing operation. The drain subcircuit (DS) allows for optimum threshold voltage distribution and a part of the drain potential (Vd) may be fed back to arrest the erase process at an optimum point.

Abstract: The method of this invention allows use of a smaller wordline voltage Vp1 during programming. In addition, the method results in a relatively narrow distribution of threshold voltages Vt when used to flash program an array of memory cells (10). The method of this invention increases compaction gate-current efficiency by reverse biasing the source (11)/substrate (23) junction of the cell being programmed. The reverse biasing is accomplished, for example, by applying a bias voltage to the source (11 ) or by placing a diode (27), a resistor (29) or other impedance in series with the source (11). The reverse biasing limits the source current (Is) of cell being programmed and of the entire array during flash-programming compaction.

Abstract: The erasing method of this invention results in a relatively narrow distribution of threshold voltages when used to flash erase a group of floating-gate-type memory cells (10). Each cell includes a control gate (14), a source (11 ) and a drain (12). The method comprises connecting the control gates (14) to a control-gate voltage (Vg), connecting the sources (11 ) to a source voltage (Vs) having a higher potential than the, control-gate voltage (Vg) and connecting the drains (12) to a drain subcircuit (DS) having, in at least one embodiment, a potential (Vd) between the control-gate voltage (Vg) and the source voltage (Vs), the drain subcircuit (DS) having a sufficiently low impedance to allow current flow between the sources (11) and drains (12) at a time during the erasing operation. The drain subcircuit (DS) allows for optimum threshold voltage distribution and a part of the drain potential (Vd) may be fed back to arrest the erase process at an optimum point.

Abstract: A semiconductor device and method of making same which includes a semiconductor substrate having a moat region with an ion implant in the moat region and a window in the substrate spaced from the moat region, electrically decoupled therefrom and having an ion implant therein in the form of a predetermined pattern. The moat region can contain one or more active and/or passive components therein. The method of fabrication comprises providing a semiconductor wafer, forming a moat region and an associated window region on the wafer, forming at least portions of electrical devices in the moat region by implanting ions therein, forming a predetermined non-electrical component pattern in the window by implanting ions in the window concurrently with the implanting of ions in the moat and completing fabrication of at least one electrical component in the moat region.

Abstract: One aspect of the present invention includes a circuit for detecting when an input voltage exceeds a predetermined threshold. The circuit for detecting includes an input for receiving the input voltage. Further, the circuit includes a plurality of switching devices, wherein each of the switching devices comprises a first and second terminal for defining a variable conductive path, and a third terminal for receiving a signal to control said variable conductive path. The plurality of switching devices includes three switching devices. The first switching device has a first terminal coupled to the input and a second terminal coupled to a first node. The second switching device has a first terminal coupled to the first node and a second terminal coupled to a second node. Finally, the third switching device has a first terminal coupled to the second node.