Patents by Inventor Wayne A. Earley

Wayne A. Earley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THERMALLY CONDUCTIVE POLYMER COMPOSITIONS TO REDUCE MOLDING CYCLE TIME
    Publication number: 20150034858
    Abstract: A thermally conductive polymer composition comprising (1) a polymer material, and (2) a thermally conductive filler. The thermally conductive filler can be boron nitride. The thermally conductive polymer composition can be used in a molding operation to form a molded article and can reduce the molding cycle time of a molding process. In one embodiment, increasing the thermal conductivity of a polymer material (as compared to the thermal conductivity of the material in the absence of a thermally conductive filler) increases the thermal diffusivity and reduces the cooling time of the article. The present invention also provides methods of forming molded articles from such compositions.
    Type: Application
    Filed: October 17, 2014
    Publication date: February 5, 2015
    Inventors: Chandrashekar Raman, Wayne A. Earley