Abstract: The electroplating cell includes a reservoir of electroplating solution into which a workpiece supporting and locating structure is able to be lowered. The workpiece supporting structure supports and locates a plurality of semi-cylindrical bearing elements in a column around a cylindrical anode structure. A plating cavity is defined between the bearing elements and the anode structure. The anode structure includes a tubular anode basket having a plurality of apertures therein and a woven liner along its interior. A copper rod is attached to the anode basket and extends along its central axis for supplying electrical potential to pellets of the plating metal disposed within the anode basket and for rotating the anode basket. A plurality of vanes are attached to the exterior of the anode basket for rotation through the plating cavity to stir the plating solution.

Abstract: An electroplating apparatus comprises a plating tank, first, intermediate, and final rinse tanks, and a plurality of weirs which connect the plating tank and the first rinse tank, the first and intermediate rinse tanks, and the intermediate and final rinse tanks. The plating tank is filled to a predetermined level with a plating solution including plating chemicals and water. The rinse tanks are each filled to the predetermined level with rinse solution including water and plating chemicals which have been rinsed from preceding workpieces. The final rinse tank has an overflow outlet at the predetermined level and receives a continuous flow of water. As water evaporates from the plating tank, rinse solution flows by gravity through the connecting weir to the plating tank to replace it.

Abstract: A process is provided for electrodepositing a covering layer of lead-tin on the surface of a bearing structure formed by co-electrodepositing lead, copper and tin which process comprises providing a metallic substrate; placing said metallic substrate in an electroplating bath containing lead ions, tin ions and copper ions; passing electrical current through said bath to deposit a layer of lead-tin-copper on the surface of said substrate; removing said so-plated substrate from said bath; subjecting said so-plated substrate to an aqueous rinsing media to remove electrolyte drag-out from said plating bath from the said plated substrate; bring said aqueous rinse media into contact with a metal selected from the group consisting of lead, tin and alloys thereof for a period of time sufficient to cause copper ions in said media to be replaced by ions of said metal and said copper ions to deposit as copper metal on the remainder of said metal; placing said rinsed substrate in an electroplating bath which is essential

Abstract: A process is provided for plating a composite structure which includes one surface composed of an aluminum base metal and another surface composed of a ferrous base metal with a thin adherent layer of tin or an alloy of tin.