Abstract: Yaw estimation systems and methods for an earthmoving machine and control architecture to receive roll and pitch input from an engine end frame (EEF) inertial motion unite (IMU) and from a non-engine end frame (NEEF) IMU, estimate a yaw articulation angle of the NEEF relative to the EEF by at least two different estimation methods based on the received roll and pitch input, fuse the at least two different estimation methods to generate an updated yaw articulation angle, calculate a yaw articulation rate based on the received roll and pitch input, integrate as an integration the updated yaw articulation angle and the yaw articulation rate, generate a real-time yaw articulation angle estimate of the NEEF relative to the EEF based on the integration, and operate the earthmoving machine based on the real-time yaw articulation angle estimate.

Abstract: The disclosure describes, in one aspect, an implement control system that includes a controller operatively connected to an implement. The controller is adapted to receive a signal from an input device indicative of a desired implement movement by an operator and to receive an automatically generated signal indicative of an automatically determined implement movement. The controller is further adapted to determine whether to move the implement based on the input device signal or the automatically generated signal. The controller is adapted to generate a control signal to move the implement based on the input device signal when a portion of the implement is above a desired cutting plane.

Abstract: The disclosure describes, in one aspect, an implement control system that includes a controller operatively connected to an implement. The controller is adapted to receive a signal from an input device indicative of a desired implement movement by an operator and to receive an automatically generated signal indicative of an automatically determined implement movement. The controller is further adapted to determine whether to move the implement based on the input device signal or the automatically generated signal. The controller is adapted to generate a control signal to move the implement based on the input device signal when a portion of the implement is above a desired cutting plane.

Abstract: The disclosure describes, in one aspect, an implement control system including a controller operatively connected to an implement. The controller is adapted to receive a first signal and a second signal from a system in operative communication with the implement. The first signal is indicative of a desired load control condition and the second signal is indicative of a desired grade control condition. The controller is further adapted to determine a first target position having a first comparable characteristic associated with the first signal and to determine a second target position having a second comparable characteristic associated with the second signal. The controller is also adapted to generate a control signal to move the implement to the first target position or to the second target position based in part on the first comparable characteristic and the second comparable characteristic.

Abstract: A method of incorporating compliant pins in a pressure sensor that uses PCB (printed circuit board) and is press fitted into the compliant pins. The compliant pins are made in the leadframe and the leadframes are molded into the plastic housing. The PCB is press fitted to the leadframe/housing assembly.

Abstract: A method of incorporating compliant pins in a pressure sensor that uses PCB (printed circuit board) and is press fitted into the compliant pins. The compliant pins are made in the leadframe and the leadframes are molded into the plastic housing. The PCB is press fitted to the leadframe/housing assembly.

Abstract: A pressure sensor apparatus and a method of forming the same. A substrate (e.g., PCB) can be provided that includes a top side and a bottom side. A pressure transducer can be directly bonded to the top side of the substrate, wherein the substrate comprises substrate walls forming a plated through-hole that allows for the passage of a sensed media to contact a back side of the pressure transducer. Thereafter, a metal carrier with an integral port is bonded to the bottom side of the substrate, thereby forming a chip-on-board pressure sensor in which the need for a plating or coating to allow adhesion between the pressure transducer and the metal carrier is eliminated. The pressure transducer may comprise, for example, silicon or silicon bonded to glass. The metal carrier can be provided with a feature that mates with a valve such as a Schrader valve.

Abstract: A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical components to the lead frame substrate, wherein the lead frame substrate is encapsulated by a thermoset plastic to protect the plurality of wire bonds and at least one electrical component, thereby providing a sensor package apparatus comprising the lead frame substrate, the electrical component(s), and the wire bonds, while eliminating a need for a Printed Circuit Board (PCB) or a ceramic substrate in place of the lead frame substrate as a part of the sensor package apparatus. A conductive epoxy can also be provided for maintaining a connection of the electrical component(s) to the lead frame substrate. The electrical components can constitute, for example, an IC chip and/or a sensing element (e.g., a magnetoresistive component) or sense die.

Abstract: A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical components to the lead frame substrate, wherein the lead frame substrate is encapsulated by a thermoset plastic to protect the plurality of wire bonds and at least one electrical component, thereby providing a sensor package apparatus comprising the lead frame substrate, the electrical component(s), and the wire bonds, while eliminating a need for a Printed Circuit Board (PCB) or a ceramic substrate in place of the lead frame substrate as a part of the sensor package apparatus. A conductive epoxy and/or solder can also be provided for maintaining a connection of the electrical component(s) to the lead frame substrate. The electrical components can constitute, for example, an IC chip and/or a sensing element (e.g.

Abstract: A method and system for orienting and calibrating a magnet for use with a speed sensor. A magnet can be mapped two or more planes thereof in order to locate the magnet accurately relative to one or more magnetoresistive elements maintained within a speed sensor housing. An optical location of the magnet with respect to the magnetoresistive element and the sensor housing can then be identified in response to mapping of the magnet. Thereafter, the magnet can be bonded to the speed sensor housing in order to implement a speed sensor thereof maintained by the speed sensor housing for use in speed detection operations.

Abstract: A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical components to the lead frame substrate, wherein the lead frame substrate is encapsulated by a thermoset plastic to protect the plurality of wire bonds and at least one electrical component, thereby providing a sensor package apparatus comprising the lead frame substrate, the electrical component(s), and the wire bonds, while eliminating a need for a Printed Circuit Board (PCB) or a ceramic substrate in place of the lead frame substrate as a part of the sensor package apparatus. A conductive epoxy and/or solder can also be provided for maintaining a connection of the electrical component(s) to the lead frame substrate. The electrical components can constitute, for example, an IC chip and/or a sensing element (e.g.

Abstract: A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical components to the lead frame substrate, wherein the lead frame substrate is encapsulated by a thermoset plastic to protect the plurality of wire bonds and at least one electrical component, thereby providing a sensor package apparatus comprising the lead frame substrate, the electrical component(s), and the wire bonds, while eliminating a need for a Printed Circuit Board (PCB) or a ceramic substrate in place of the lead frame substrate as a part of the sensor package apparatus. A conductive epoxy can also be provided for maintaining a connection of the electrical component(s) to the lead frame substrate. The electrical components can constitute, for example, an IC chip and/or a sensing element (e.g., a magnetoresistive component) or sense die.

Abstract: A method and system for orienting and calibrating a magnet for use with a speed sensor. A magnet can be mapped two or more planes thereof in order to locate the magnet accurately relative to one or more magnetoresistive elements maintained within a speed sensor housing. An optical location of the magnet with respect to the magnetoresistive element and the sensor housing can then be identified in response to mapping of the magnet. Thereafter, the magnet can be bonded to the speed sensor housing in order to implement a speed sensor thereof maintained by the speed sensor housing for use in speed detection operations.

Abstract: A door position sensing system includes a door claw having first and second magnets mounted thereon, and a Hall sensor mounted so as to sense the magnetic fields of the first and second magnets. The first magnet is mounted in a door half-latch position, and the second magnet is mounted in a door full-latch position. A processor is responsive to the Hall sensor to provide outputs indicating the half-latch and full-latch positions of a door. The processor may also be arranged to indicate a door open position when neither magnet is near the sensor.

Abstract: A door position sensing system includes a door claw having first and second magnets mounted thereon, and a Hall sensor mounted so as to sense the magnetic fields of the first and second magnets. The first magnet is mounted in a door half-latch position, and the second magnet is mounted in a door full-latch position. A processor is responsive to the Hall sensor to provide outputs indicating the half-latch and full-latch positions of a door. The processor may also be arranged to indicate a door open position when neither magnet is near the sensor.

Abstract: Eddy currents arise when a conductive material moves through a magnetic field. Eddy currents, like all electric currents, generate a magnetic field. The generated magnetic field can be detected and measured through use of one or more magnetically biased GMR elements. In general, an eddy current sensor can be configured, which includes a magnet, and a first giant magnetoresistive element placed such that the magnetic field from the magnet biases the giant magnetoresistive element along its primary axis.

Abstract: A methodology and system for balancing a centrifugal clutch can be implemented that includes a 3-dimensional model of a centrifugal clutch assembly in an engaged position thereof. A mass center of the centrifugal clutch assembly can be calculated, and a distance from the axis of rotation of the centrifugal clutch assembly can be determined. Thereafter, associated part features of the centrifugal clutch assembly can be modified in order to move the mass center; and repeating as necessary establishing a 3-dimensional model of a centrifugal clutch assembly in an engaged position thereof, calculating a mass center of the centrifugal clutch assembly, determining a particular distance from an axis of rotation of the centrifugal clutch assembly, and modifying part features of the centrifugal clutch assembly in order to move the mass center in order to verify the axis of rotation and thereby balance the centrifugal clutch assembly.

Abstract: An integrated circuit magnetoresistive speed and direction sensor generally utilizes an AMR bridge circuit thereby allowing for increased air gap performance as compared to conventional Hall-effect element based sensors. The AMR sensor is capable of sensing ring magnets or bar magnets magnetized with one or more magnet poles along the desired travel. The number of poles of the magnet should be optimized based upon the application design. In order to obtain speed and direction information, two bridge circuits can be placed within proximity (I.e., the exact location and shape of the bridge can be determined based upon the target and desired performance) of each other. The signals of the two bridge circuits can be compared on integrated electronics. The bridges are generally rotated 45 degrees to reduce and/or eliminate offsets, which provide the sensor with a large air gap performance.

Abstract: A door position sensing system includes a door claw having first and second magnets mounted thereon, and a Hall sensor mounted so as to sense the magnetic fields of the first and second magnets. The first magnet is mounted in a door half-latch position, and the second magnet is mounted in a door full-latch position. A processor is responsive to the Hall sensor to provide outputs indicating the half-latch and full-latch positions of a door. The processor may also be arranged to indicate a door open position when neither magnet is near the sensor.

Abstract: Angular position sensing apparatuses and methods are disclosed. An angular position sensing apparatus can include a rotatable base and two or more magnets located proximate to one another upon the rotatable base. The magnets are generally magnetized parallel and opposite to one another to create a uniform magnetic field thereof. Additionally, a sensor can be located external to the two magnets, such that the sensor comes into contact with the uniform magnetic field to sense a change in angular position associated with the rotatable base.