Abstract: The disclosure describes, in one aspect, an implement control system that includes a controller operatively connected to an implement. The controller is adapted to receive a signal from an input device indicative of a desired implement movement by an operator and to receive an automatically generated signal indicative of an automatically determined implement movement. The controller is further adapted to determine whether to move the implement based on the input device signal or the automatically generated signal. The controller is adapted to generate a control signal to move the implement based on the input device signal when a portion of the implement is above a desired cutting plane.

Abstract: The disclosure describes, in one aspect, an implement control system that includes a controller operatively connected to an implement. The controller is adapted to receive a signal from an input device indicative of a desired implement movement by an operator and to receive an automatically generated signal indicative of an automatically determined implement movement. The controller is further adapted to determine whether to move the implement based on the input device signal or the automatically generated signal. The controller is adapted to generate a control signal to move the implement based on the input device signal when a portion of the implement is above a desired cutting plane.

Abstract: The disclosure describes, in one aspect, an implement control system including a controller operatively connected to an implement. The controller is adapted to receive a first signal and a second signal from a system in operative communication with the implement. The first signal is indicative of a desired load control condition and the second signal is indicative of a desired grade control condition. The controller is further adapted to determine a first target position having a first comparable characteristic associated with the first signal and to determine a second target position having a second comparable characteristic associated with the second signal. The controller is also adapted to generate a control signal to move the implement to the first target position or to the second target position based in part on the first comparable characteristic and the second comparable characteristic.

Abstract: A method of incorporating compliant pins in a pressure sensor that uses PCB (printed circuit board) and is press fitted into the compliant pins. The compliant pins are made in the leadframe and the leadframes are molded into the plastic housing. The PCB is press fitted to the leadframe/housing assembly.

Abstract: A method of incorporating compliant pins in a pressure sensor that uses PCB (printed circuit board) and is press fitted into the compliant pins. The compliant pins are made in the leadframe and the leadframes are molded into the plastic housing. The PCB is press fitted to the leadframe/housing assembly.

Abstract: A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical components to the lead frame substrate, wherein the lead frame substrate is encapsulated by a thermoset plastic to protect the plurality of wire bonds and at least one electrical component, thereby providing a sensor package apparatus comprising the lead frame substrate, the electrical component(s), and the wire bonds, while eliminating a need for a Printed Circuit Board (PCB) or a ceramic substrate in place of the lead frame substrate as a part of the sensor package apparatus. A conductive epoxy can also be provided for maintaining a connection of the electrical component(s) to the lead frame substrate. The electrical components can constitute, for example, an IC chip and/or a sensing element (e.g., a magnetoresistive component) or sense die.

Abstract: A pressure sensor apparatus and a method of forming the same. A substrate (e.g., PCB) can be provided that includes a top side and a bottom side. A pressure transducer can be directly bonded to the top side of the substrate, wherein the substrate comprises substrate walls forming a plated through-hole that allows for the passage of a sensed media to contact a back side of the pressure transducer. Thereafter, a metal carrier with an integral port is bonded to the bottom side of the substrate, thereby forming a chip-on-board pressure sensor in which the need for a plating or coating to allow adhesion between the pressure transducer and the metal carrier is eliminated. The pressure transducer may comprise, for example, silicon or silicon bonded to glass. The metal carrier can be provided with a feature that mates with a valve such as a Schrader valve.

Abstract: A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical components to the lead frame substrate, wherein the lead frame substrate is encapsulated by a thermoset plastic to protect the plurality of wire bonds and at least one electrical component, thereby providing a sensor package apparatus comprising the lead frame substrate, the electrical component(s), and the wire bonds, while eliminating a need for a Printed Circuit Board (PCB) or a ceramic substrate in place of the lead frame substrate as a part of the sensor package apparatus. A conductive epoxy and/or solder can also be provided for maintaining a connection of the electrical component(s) to the lead frame substrate. The electrical components can constitute, for example, an IC chip and/or a sensing element (e.g.

Abstract: A method and system for orienting and calibrating a magnet for use with a speed sensor. A magnet can be mapped two or more planes thereof in order to locate the magnet accurately relative to one or more magnetoresistive elements maintained within a speed sensor housing. An optical location of the magnet with respect to the magnetoresistive element and the sensor housing can then be identified in response to mapping of the magnet. Thereafter, the magnet can be bonded to the speed sensor housing in order to implement a speed sensor thereof maintained by the speed sensor housing for use in speed detection operations.

Abstract: A door position sensing system includes a door claw having first and second magnets mounted thereon, and a Hall sensor mounted so as to sense the magnetic fields of the first and second magnets. The first magnet is mounted in a door half-latch position, and the second magnet is mounted in a door full-latch position. A processor is responsive to the Hall sensor to provide outputs indicating the half-latch and full-latch positions of a door. The processor may also be arranged to indicate a door open position when neither magnet is near the sensor.

Abstract: A door position sensing system includes a door claw having first and second magnets mounted thereon, and a Hall sensor mounted so as to sense the magnetic fields of the first and second magnets. The first magnet is mounted in a door half-latch position, and the second magnet is mounted in a door full-latch position. A processor is responsive to the Hall sensor to provide outputs indicating the half-latch and full-latch positions of a door. The processor may also be arranged to indicate a door open position when neither magnet is near the sensor.

Abstract: A door position sensing system includes a door claw having first and second magnets mounted thereon, and a Hall sensor mounted so as to sense the magnetic fields of the first and second magnets. The first magnet is mounted in a door half-latch position, and the second magnet is mounted in a door full-latch position. A processor is responsive to the Hall sensor to provide outputs indicating the half-latch and full-latch positions of a door. The processor may also be arranged to indicate a door open position when neither magnet is near the sensor.

Abstract: Angular position sensing apparatuses and methods are disclosed. An angular position sensing apparatus can include a rotatable base and two or more magnets located proximate to one another upon the rotatable base. The magnets are generally magnetized parallel and opposite to one another to create a uniform magnetic field thereof. Additionally, a sensor can be located external to the two magnets, such that the sensor comes into contact with the uniform magnetic field to sense a change in angular position associated with the rotatable base.

Abstract: A door position sensing system includes a door claw having first and second magnets mounted thereon, and a Hall sensor mounted so as to sense the magnetic fields of the first and second magnets. The first magnet is mounted in a door half-latch position, and the second magnet is mounted in a door full-latch position. A processor is responsive to the Hall sensor to provide outputs indicating the half-latch and full-latch positions of a door. The processor may also be arranged to indicate a door open position when neither magnet is near the sensor.

Abstract: Angular position sensing apparatuses and methods are disclosed. An angular position sensing apparatus can include a rotatable base and two or more magnets located proximate to one another upon the rotatable base. The magnets are generally magnetized parallel and opposite to one another to create a uniform magnetic field thereof. Additionally, a sensor can be located external to the two magnets, such that the sensor comes into contact with the uniform magnetic field to sense a change in angular position associated with the rotatable base.

Abstract: A sensor method and system for detecting linear position is disclosed. At least one sensing bridge circuit can be configured from at least two separate sensing bridges that share a common geometrical center and are rotated from one another to provide signal offsets thereof. At least one magnet has a north pole and a south pole thereof, such that the sensing bridge circuit is disposed a particular distance from the magnet to provide sinusoidal shaped signals, which can be utilized to determine travel and, thus, a linear position associated with the magnet.

Abstract: A geartooth sensor utilizes an algorithm for establishing an adaptive threshold for the switch point of the sensor to minimize drift in the point at which the sensor output changes in relation to the target features it is tracking. The algorithm utilizes measured waveform peak and average outputs and applies a separate empirically derived constant to each value to quickly obtain the major portion of the adaptive threshold value from the product of the first constant and the peak output, and to refine the threshold value further with the product of the second constant and the average output.