Abstract: This invention relates to holt melt adhesives for use in coating and/or laminating paper. Conventional hot melt adhesives used to manufacture a coated or laminated product with good vapor barrier characteristics are based on ingredients compounded with significantly lower proportions of inert low cost filler materials. The present invention provides a hot melt adhesive/coating blend which not only provides a moisture vapor barrier and/or bonding but also significantly reduces the quantity of more expensive ingredients through the use of a large quantity of a lower cost ultra fine ground inert inorganic filler material and a low cost modifying hydrocarbon resin. The blend or composition consists essentially of, in parts by weight, up to about 25 parts of a hi melt point paraffin wax, 10-30 parts of a modifying hydrocarbon resin, 1-20 parts of an elastomeric copolymer, and 20-85 parts of an inert inorganic filler material.