Patents by Inventor Wayne C. Long
Wayne C. Long has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10662057Abstract: A method of attaching a MEMS die to a surface includes centering and rotationally aligning a solder perform on a solder surface of a body, centering and rotationally aligning a MEMS die on the solder preform, and heating the solder perform in a reflow process until the solder is molten and surface tension of the molten solder moves the MEMS die to a position where the surface tensions balance, and the MEMS die is centered on, and rotationally aligned with, the solder surface of the body.Type: GrantFiled: November 29, 2018Date of Patent: May 26, 2020Assignee: DunAn Microstaq, Inc.Inventors: Wayne C. Long, Joe A. Ojeda, Gengxun K. Gurley, Joseph L. Nguyen
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Patent number: 10640374Abstract: A method of attaching a MEMS die to a base includes selecting an attachment material (x), determining a maximum acceptable change in pressure due to mounting stress (dPtarget) transmitted to a MEMS die, determining a worst-case pressure difference transfer function of the attachment material (x) over a thickness (h) variation of the attachment material (x) using the equation: dPmaxx=h*Bx+Cx, wherein B=pressure variation/thickness (h), and C=pressure variation, substituting dPtarget for dPmaxx in the pressure difference transfer function and solving the equation for h, wherein h=(dPtarget?Cx)/Bx, and attaching the MEMS die to a base using the selected attachment material (x) having at least the calculated thickness (h).Type: GrantFiled: February 14, 2018Date of Patent: May 5, 2020Assignee: Dunan Microstaq, Inc.Inventors: Wayne C. Long, Joseph L. Nguyen
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Patent number: 10563896Abstract: A manifold assembly is configured to calibrate and test one or more superheat controllers and includes a manifold frame, a manifold having a plurality of fluid conduits mounted to the manifold frame, and a plurality of superheat controller fittings mounted to the fluid conduits, each superheat controller fitting configured to have a superheat controller attached thereto.Type: GrantFiled: January 10, 2019Date of Patent: February 18, 2020Assignee: DunAn Microstaq, Inc.Inventors: Buu C. Chung, Wayne C. Long, Arvind Rao, Chen Yang, Joseph Nguyen, Joe A. Ojeda, Sr., Colin B. Bingle
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Patent number: 10556072Abstract: An improved aerosol dispensing apparatus includes an aerosol container, a discharge piece, an actuator, a flow control canister valve assembly attached to the aerosol container, a battery, and an electronically controlled flow control valve electronically connected to the battery and in fluid communication with the flow control canister valve assembly. The aerosol container and the attached flow control canister valve assembly are further attached to the actuator and the actuator is mounted for slidable movement within the discharge piece. The flow control canister valve assembly is movable between an open position wherein a volume of an aerosol formulation is directed from the aerosol container through the flow control canister valve assembly to the electronically controlled flow control valve, and a closed position wherein the aerosol formulation is not permitted to flow through the flow control canister valve assembly to the electronically controlled flow control valve.Type: GrantFiled: July 25, 2017Date of Patent: February 11, 2020Assignee: DunAn Microstaq, Inc.Inventors: E. Nelson Fuller, Parthiban Arunasalam, Joseph L. Nguyen, Joe A. Ojeda, Wayne C. Long
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Method and structure for preventing solder flow into a MEMS pressure port during MEMS die attachment
Patent number: 10544040Abstract: A method of attaching a MEMS die to a mounting surface includes coating an inside surface of a pressure port of a fluid inlet member with a layer of solder mask, the fluid inlet member having a first axial end, a second axial end, and a port opening of the pressure port formed in the second axial end of the fluid inlet member. A solder preform is disposed on the mounting surface of the fluid inlet member and a MEMS die is disposed on the solder preform. The solder preform is heated in a re-flow operation to attach the MEMS die to the mounting surface, wherein the solder mask within the pressure port prevents molten solder from entering the pressure port during the re-flow operation.Type: GrantFiled: March 1, 2018Date of Patent: January 28, 2020Assignee: DunAn Microstaq, Inc.Inventors: Wayne C. Long, Joe A. Ojeda, Joseph L. Nguyen -
Patent number: 10457547Abstract: A multi-layer, stress-isolation platform configured for attaching a MEMS die to a base includes a first platform, a first layer of attachment material between the base and the first platform and attaching the first platform to the base, a MEMS die, and a second layer of attachment material between the first platform and the MEMS die and attaching the MEMS die to the first platform.Type: GrantFiled: February 14, 2018Date of Patent: October 29, 2019Assignee: DunAn Microstaq, Inc.Inventors: Wayne C. Long, Joseph L. Nguyen
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Patent number: 10443712Abstract: A system for controlling fluid pressure to a transmission system through a MEMS microvalve includes a transmission controller configured to receive a target command pressure, a current system command pressure input signal, and a transmission system operating temperature. A power determination module determines a temperature-related power factor from the target command pressure, the current system command pressure input signal, the transmission system operating temperature received in the controller, and a look-up table within the controller. A power signal module adjusts the current system command pressure input signal by the temperature-related power factor and applies the adjusted current system command pressure input signal to the MEMS microvalve via the controller.Type: GrantFiled: October 30, 2017Date of Patent: October 15, 2019Assignee: DunAn Microstaq, Inc.Inventors: E. Nelson Fuller, Parthiban Arunasalam, Wayne C. Long, Arvind P. Rao, Kevin Sinkar, Gengxun K. Gurley
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Publication number: 20190145679Abstract: A manifold assembly is configured to calibrate and test one or more superheat controllers and includes a manifold frame, a manifold having a plurality of fluid conduits mounted to the manifold frame, and a plurality of superheat controller fittings mounted to the fluid conduits, each superheat controller fitting configured to have a superheat controller attached thereto.Type: ApplicationFiled: January 10, 2019Publication date: May 16, 2019Applicant: DunAn Microstaq, Inc.Inventors: Buu C. Chung, Wayne C. Long, Arvind Rao, Chen Yang, Joseph Nguyen, Joe A. Ojeda, Sr., Colin B. Bingle
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Publication number: 20190092629Abstract: A method of attaching a MEMS die to a surface includes centering and rotationally aligning a solder perform on a solder surface of a body, centering and rotationally aligning a MEMS die on the solder preform, and heating the solder perform in a reflow process until the solder is molten and surface tension of the molten solder moves the MEMS die to a position where the surface tensions balance, and the MEMS die is centered on, and rotationally aligned with, the solder surface of the body.Type: ApplicationFiled: November 29, 2018Publication date: March 28, 2019Applicant: DunAn Microstaq, Inc.Inventors: Wayne C. Long, Joe A. Ojeda, Gengxun K. Gurley, Joseph L. Nguyen
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Publication number: 20190092630Abstract: A method of attaching a MEMS die to a surface includes centering and rotationally aligning a solder perform on a solder surface of a body, centering and rotationally aligning a MEMS die on the solder preform, and heating the solder perform in a reflow process until the solder is molten and surface tension of the molten solder moves the MEMS die to a position where the surface tensions balance, and the MEMS die is centered on, and rotationally aligned with, the solder surface of the body.Type: ApplicationFiled: November 29, 2018Publication date: March 28, 2019Applicant: DunAn Microstaq, Inc.Inventors: Wayne C. Long, Joe A. Ojeda, Gengxun K. Gurley, Joseph L. Nguyen
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Patent number: 10189706Abstract: A method of attaching a MEMS die to a surface includes centering and rotationally aligning a solder perform on a solder surface of a body, centering and rotationally aligning a MEMS die on the solder preform, and heating the solder perform in a reflow process until the solder is molten and surface tension of the molten solder moves the MEMS die to a position where the surface tensions balance, and the MEMS die is centered on, and rotationally aligned with, the solder surface of the body.Type: GrantFiled: August 25, 2017Date of Patent: January 29, 2019Assignee: DunAn Microstaq, Inc.Inventors: Wayne C. Long, Joe A. Ojeda, Gengxun K. Gurley, Joseph L. Nguyen
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Publication number: 20180334382Abstract: A method of attaching a MEMS die to a base includes selecting an attachment material (x), determining a maximum acceptable change in pressure due to mounting stress (dPtarget) transmitted to a MEMS die, determining a worst-case pressure difference transfer function of the attachment material (x) over a thickness (h) variation of the attachment material (x) using the equation: dPmaxx=h*Bx+Cx, wherein B=pressure variation/thickness (h), and C=pressure variation, substituting dPtarget for dPmaxx in the pressure difference transfer function and solving the equation for h, wherein h=(dPtarget?Cx)/Bx, and attaching the MEMS die to a base using the selected attachment material (x) having at least the calculated thickness (h).Type: ApplicationFiled: February 14, 2018Publication date: November 22, 2018Applicant: DunAn Microstaq, Inc.Inventors: Wayne C. Long, Joseph L. Nguyen
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Publication number: 20180319654Abstract: A multi-layer, stress-isolation platform configured for attaching a MEMS die to a base includes a first platform, a first layer of attachment material between the base and the first platform and attaching the first platform to the base, a MEMS die, and a second layer of attachment material between the first platform and the MEMS die and attaching the MEMS die to the first platform.Type: ApplicationFiled: February 14, 2018Publication date: November 8, 2018Applicant: DunAn Microstaq, Inc.Inventors: Wayne C. Long, Joseph L. Nguyen
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METHOD AND STRUCTURE FOR PREVENTING SOLDER FLOW INTO A MEMS PRESSURE PORT DURING MEMS DIE ATTACHMENT
Publication number: 20180319656Abstract: A method of attaching a MEMS die to a mounting surface includes coating an inside surface of a pressure port of a fluid inlet member with a layer of solder mask, the fluid inlet member having a first axial end, a second axial end, and a port opening of the pressure port formed in the second axial end of the fluid inlet member. A solder preform is disposed on the mounting surface of the fluid inlet member and a MEMS die is disposed on the solder preform. The solder preform is heated in a re-flow operation to attach the MEMS die to the mounting surface, wherein the solder mask within the pressure port prevents molten solder from entering the pressure port during the re-flow operation.Type: ApplicationFiled: March 1, 2018Publication date: November 8, 2018Applicant: DunAn Microstaq, Inc.Inventors: Wayne C. Long, Joe A. Ojeda, Joseph L. Nguyen -
Publication number: 20180214646Abstract: An improved aerosol dispensing apparatus includes an aerosol container, a discharge piece, an actuator, a flow control canister valve assembly attached to the aerosol container, a battery, and an electronically controlled flow control valve electronically connected to the battery and in fluid communication with the flow control canister valve assembly. The aerosol container and the attached flow control canister valve assembly are further attached to the actuator and the actuator is mounted for slidable movement within the discharge piece. The flow control canister valve assembly is movable between an open position wherein a volume of an aerosol formulation is directed from the aerosol container through the flow control canister valve assembly to the electronically controlled flow control valve, and a closed position wherein the aerosol formulation is not permitted to flow through the flow control canister valve assembly to the electronically controlled flow control valve.Type: ApplicationFiled: July 25, 2017Publication date: August 2, 2018Applicant: DunAn Microstaq, Inc.Inventors: E. Nelson Fuller, Parthiban Arunasalam, Joseph L. Nguyen, Joe A. Ojeda, Wayne C. Long
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Publication number: 20180127269Abstract: A method of attaching a MEMS die to a surface includes centering and rotationally aligning a solder perform on a solder surface of a body, centering and rotationally aligning a MEMS die on the solder preform, and heating the solder perform in a reflow process until the solder is molten and surface tension of the molten solder moves the MEMS die to a position where the surface tensions balance, and the MEMS die is centered on, and rotationally aligned with, the solder surface of the body.Type: ApplicationFiled: August 25, 2017Publication date: May 10, 2018Applicant: DunAn Microstaq, Inc.Inventors: Wayne C. Long, Joe A. Ojeda, Gengxun K. Gurley, Joseph L. Nguyen
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Publication number: 20180119799Abstract: A system for controlling fluid pressure to a transmission system through a MEMS microvalve includes a transmission controller configured to receive a target command pressure, a current system command pressure input signal, and a transmission system operating temperature. A power determination module determines a temperature-related power factor from the target command pressure, the current system command pressure input signal, the transmission system operating temperature received in the controller, and a look-up table within the controller. A power signal module adjusts the current system command pressure input signal by the temperature-related power factor and applies the adjusted current system command pressure input signal to the MEMS microvalve via the controller.Type: ApplicationFiled: October 30, 2017Publication date: May 3, 2018Applicant: DunAn Microstaq, Inc.Inventors: E. Nelson Fuller, Parthiban Arunasalam, Wayne C. Long, Arvind P. Rao, Kevin Sinkar, Gengxun K. Gurley
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Patent number: 9772235Abstract: A method of sensing superheat includes the steps of: (a) connecting a fluid inlet member of a superheat sensor to one of a plurality of fluid systems; (b) allowing fluid to flow from the fluid system to which the superheat sensor is connected to the superheat sensor; (c) sensing a temperature of the fluid in the fluid system with one of an internal temperature sensor mounted within a housing of the superheat sensor and an external temperature sensor mounted outside of the housing of the superheat sensor; and (d) calculating a superheat of the fluid in the fluid system.Type: GrantFiled: December 30, 2014Date of Patent: September 26, 2017Assignee: Zhejiang DunAn Hetian Metal Co., Ltd.Inventors: Parthiban Arunasalam, Wayne C. Long
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Publication number: 20170097181Abstract: A method of calibrating a plurality of superheat controllers includes attaching a plurality of superheat controllers to a manifold assembly, enclosing the manifold assembly within an environmental chamber, and simultaneously calibrating a pressure sensor within each of the plurality of superheat controllers.Type: ApplicationFiled: August 17, 2016Publication date: April 6, 2017Applicant: DunAn Microstaq, Inc.Inventors: Buu C. Chung, Wayne C. Long, Arvind Rao, Chen Yang, Joseph Nguyen, Joe A. Ojeda, SR., Colin B. Bingle
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Patent number: 9404815Abstract: A superheat sensor includes a housing, a pressure sensor mounted within the housing, and a processor. A fluid passageway connects the pressure sensor to a source of superheat fluid. An external temperature sensor is located outside the housing of the superheat sensor and is electrically connected to the processor. The external temperature sensor is also electronically connected to a component of a fluid system to which the superheat sensor is attached and is configured to provide one of an internal temperature of the component, an external temperature of the component, and a temperature of fluid in the component.Type: GrantFiled: September 15, 2015Date of Patent: August 2, 2016Assignee: Zhejiang Dunan Hetian Metal Co., LTD.Inventors: Parthiban Arunasalam, Wayne C. Long