Patents by Inventor Wayne E. Jones

Wayne E. Jones has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9920220
    Abstract: Embodiments of films and material layers comprising PEDOT. These embodiments are the result of methods that utilize polymerization processes including vapor phase polymerization (VPP) to form the conductive film comprising PEDOT. In one embodiment, the film can result from a method that includes steps for depositing a coating solution onto a substrate, exposing the substrate to a monomer source, and cleaning the substrate after polymerization. The coating solution can comprise an initiating oxidant, which facilitates growth of PEDOT from 3,4 ethylenedioxythiophene (EDOT), as well as a quenching agent that neutralizes acid that results from polymerization.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: March 20, 2018
    Assignee: The Research Foundation of State University of New York
    Inventors: William E. Bernier, Nicholas A. Ravvin, Wayne E. Jones, Jr., Kenneth H. Skorenko
  • Patent number: 9915757
    Abstract: Compositions for increasing the thermal stability of optical absorbers are provided as well as methods of making and using the resulting compositions. The compositions or complexes of the present teachings generally include an optical absorber bound to a metal or a metal oxide through one or more linkers, which contain a metal binding moiety.
    Type: Grant
    Filed: June 24, 2014
    Date of Patent: March 13, 2018
    Assignee: The Research Foundation for the State University of New York
    Inventors: William E. Bernier, Megan Fegley, Bradley Galusha, Francis D. Goroleski, Wayne E. Jones, Jr., Kenneth H. Skorenko
  • Publication number: 20170056873
    Abstract: Mixed-phase TiO2 nanofibers prepared via a sol-gel technique followed by electrospinning and calcination are provided as photocatalysts. The calcination temperature is adjusted to control the rutile phase fraction in TiO2 nanofibers relative to the anatase phase. Post-calcined TiO2 nanofibers composed of 38 wt % rutile and 62 wt % anatase exhibited the highest initial rate constant of UV photocatalysis. This can be attributed to the combined influences of the fibers' specific surface areas and their phase compositions.
    Type: Application
    Filed: March 14, 2016
    Publication date: March 2, 2017
    Inventors: Wayne E. Jones, Jian Liu, William E. Bernier, Julia B. Tollin, Danielle McCarthy, Emilly Obuya, Jared DeCoste
  • Publication number: 20140272342
    Abstract: Embodiments of films and material layers comprising PEDOT. These embodiments are the result of methods that utilize polymerization processes including vapor phase polymerization (VPP) to form the conductive film comprising PEDOT. In one embodiment, the film can result from a method that includes steps for depositing a coating solution onto a substrate, exposing the substrate to a monomer source, and cleaning the subsrate after polymerization. The coating solution can comprise an initiating oxidant, which facilitates growth of PEDOT from 3,4 ethylenedioxythiophene (EDOT), as well as a quenching agent that neutralizes acid that results from polymerization.
    Type: Application
    Filed: March 14, 2014
    Publication date: September 18, 2014
    Applicant: THE RESEARCH FOUNDATION OF STATE UNIVERSITY OF NEW YORK
    Inventors: William E. Bernier, Nicholas A. Ravvin, Wayne E. Jones, JR., Kenneth H. Skorenko
  • Patent number: 8518304
    Abstract: The present invention features additions of nanostructures to interconnect conductor particles to: (1) reduce thermal interface resistance by using thermal interposers that have high thermal conductivity nanostructures at their surfaces; (2) improve the anisotropic conductive adhesive interconnection conductivity with microcircuit contact pads; and (3) allow lower compression forces to be applied during the microcircuit fabrication processes which then results in reduced deflection or circuit damage. When pressure is applied during fabrication to spread and compress anisotropic conductive adhesive and the matrix of interconnect particles and circuit conductors, the nano-structures mesh and compress into a more uniform connection than current technology provides, thereby eliminating voids, moisture and other contaminants, increasing the contact surfaces for better electrical and thermal conduction.
    Type: Grant
    Filed: January 12, 2010
    Date of Patent: August 27, 2013
    Assignee: The Research Foundation of State University of New York
    Inventors: Bahgat Sammakia, Wayne E. Jones, Jr., Ganesh Subbarayan
  • Patent number: 8173260
    Abstract: The present invention features additions of nano-structures to interconnect conductor fine particles (spheres) to: (1) reduce thermal interface resistance by using thermal interposers that have high thermal conductivity nano-structures at their surfaces; (2) improve the anisotropic conductive adhesive interconnection conductivity with microcircuit contact pads; and (3) allow lower compression forces to be applied during the microcircuit fabrication processes which then results in reduced deflection or circuit damage. When pressure is applied during fabrication to spread and compress anisotropic conductive adhesive and the matrix of interconnect particles and circuit conductors, the nano-structures mesh and compress into a more uniform connection than current technology provides, thereby eliminating voids, moisture and other contaminants, increasing the contact surfaces for better electrical and thermal conduction.
    Type: Grant
    Filed: January 12, 2010
    Date of Patent: May 8, 2012
    Assignee: The Research Foundation of State University of New York
    Inventors: Bahgat Sammakia, Wayne E. Jones, Ganesh Subbarayan
  • Patent number: 7645512
    Abstract: The present invention features additions of nano-structures to interconnect conductor fine particles (spheres) to: (1) reduce thermal interface resistance by using thermal interposers that have high thermal conductivity nano-structures at their surfaces; (2) improve the anisotropic conductive adhesive interconnection conductivity with microcircuit contact pads; and (3) allow lower compression forces to be applied during the microcircuit fabrication processes which then results in reduced deflection or circuit damage. When pressure is applied during fabrication to spread and compress anisotropic conductive adhesive and the matrix of interconnect particles and circuit conductors, the nano-structures mesh and compress into a more uniform connection than current technology provides, thereby eliminating voids, moisture and other contaminants, increasing the contact surfaces for better electrical and thermal conduction.
    Type: Grant
    Filed: March 31, 2003
    Date of Patent: January 12, 2010
    Assignee: The Research Foundation of the State University of New York
    Inventors: Bahgat Sammakia, Wayne E. Jones, Jr., Ganesh Subbarayan
  • Publication number: 20020006884
    Abstract: A high yield, low cost process for the preparation of essentially calcium-free lactobionic acid from calcium lactobionate is disclosed. In a preferred embodiment, a series of ion-exchange resins are used to convert a solution of the relatively inexpensive calcium lactobionate to its acid form. Accordingly, a pure lactobionic acid solution with negligible amounts of impurities may be obtained. The lactobionic acid solution is subjected to crystallization via rotary evaporation with heating, followed by vacuum drying without heat. This process can be used to generate higher product yields than conventional production and crystallization methods. At higher concentrations of lactobionic acid, however, the solution behaves differently, forming a glass-like structure that retains a substantial amount of water.
    Type: Application
    Filed: January 11, 2001
    Publication date: January 17, 2002
    Applicant: Biolife Solutions, Inc.
    Inventors: Wayne E. Jones, Chi Yan Ho
  • Patent number: 5930759
    Abstract: A system or network for assembling, filing and processing health care data transactions and insurance claims made by patients pursuant to health care policies issued to the patients by insurance companies or other carriers for service provided to the patients at health care facilities. The network comprises a multitude of participating patients, a multitude of health care facilities, and a plurality of insurance companies or other carriers. Each of the patients has a personal data file including a set of patient related data encoded in a machine readable format, and each of the health care facilities has a telecommunications unit and a file reader to read the data on the personal data files and to transmit the patient related data to the telecommunications unit at the facility. The network further includes a central claims processing unit connected to the telecommunications units of the health care facilities to receive the electronic claim forms from those facilities and to adjudicate those claims.
    Type: Grant
    Filed: April 30, 1996
    Date of Patent: July 27, 1999
    Assignees: Symbol Technologies, Inc., Optimum, Inc.
    Inventors: James G. Moore, Wayne E. Jones