Patents by Inventor Wayne E. Richter
Wayne E. Richter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 7453260Abstract: The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.Type: GrantFiled: July 24, 2006Date of Patent: November 18, 2008Assignee: Electroglas, Inc.Inventors: Timothy J. Boyle, Wayne E. Richter, Ladd T. Johnson, Lawrence A. Tom
-
Patent number: 7259548Abstract: The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.Type: GrantFiled: January 7, 2005Date of Patent: August 21, 2007Assignee: Electroglas, Inc.Inventors: Timothy J. Boyle, Wayne E. Richter, Ladd T. Johnson, Lawrence A. Tom
-
Patent number: 7180284Abstract: The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.Type: GrantFiled: October 4, 2005Date of Patent: February 20, 2007Assignee: Electroglas, Inc.Inventors: Timothy J. Boyle, Wayne E. Richter, Ladd T. Johnson, Lawrence A. Tom
-
Patent number: 7098649Abstract: The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.Type: GrantFiled: June 17, 2004Date of Patent: August 29, 2006Assignee: Electroglas, Inc.Inventors: Timothy J. Boyle, Wayne E. Richter, Ladd T. Johnson, Lawrence A. Tom
-
Patent number: 7002337Abstract: The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.Type: GrantFiled: July 27, 2004Date of Patent: February 21, 2006Assignee: Electroglas, Inc.Inventors: Timothy J. Boyle, Wayne E. Richter, Ladd T. Johnson, Lawrence A. Tom
-
Patent number: 6861859Abstract: The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contracts, and the substrate is removed from the test chuck.Type: GrantFiled: October 22, 2001Date of Patent: March 1, 2005Assignee: Electroglas, Inc.Inventors: Timothy J. Boyle, Wayne E. Richter, Ladd T. Johnson, Lawrence A. Tom
-
Publication number: 20040263153Abstract: The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.Type: ApplicationFiled: July 27, 2004Publication date: December 30, 2004Inventors: Timothy J. Boyle, Wayne E. Richter, Ladd T. Johnson, Lawrence A. Tom
-
Publication number: 20040232928Abstract: The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.Type: ApplicationFiled: June 17, 2004Publication date: November 25, 2004Inventors: Timothy J. Boyle, Wayne E. Richter, Ladd T. Johnson, Lawrence A. Tom
-
Patent number: 6781394Abstract: The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.Type: GrantFiled: October 22, 2001Date of Patent: August 24, 2004Assignee: Electroglas, Inc.Inventors: Timothy J. Boyle, Wayne E. Richter, Ladd T. Johnson, Lawrence A. Tom
-
Patent number: 6771060Abstract: The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.Type: GrantFiled: October 22, 2001Date of Patent: August 3, 2004Assignee: Electroglas, Inc.Inventors: Timothy J. Boyle, Wayne E. Richter, Ladd T. Johnson, Lawrence A. Tom
-
Patent number: 5591290Abstract: The adhesive bonding strength of a pressure sensitive adhesive on a laminate is selectively modified by applying a discontinuous layer of a non-adhesive material to the pressure sensitive adhesive. Preferably, the laminate is a preformed, label stock, including a label or substrate having a pressure sensitive adhesive on one surface thereof and a release sheet overlying the adhesive. The label is first delaminated from the release sheet to expose the oppositely facing surface of the label and the release sheet. A discontinuous layer of the non-adhesive material is then printed on either the release sheet or the adhesive. The release sheet is relaminated back onto the label to form a modified laminate with new adhesive properties. When the label is then separated from the release layer, the non-adhesive material adheres to the pressure sensitive adhesive to reduce the exposed surface area of the adhesive.Type: GrantFiled: January 23, 1995Date of Patent: January 7, 1997Assignee: Wallace Computer Services, Inc.Inventors: Peter A. Walter, Wayne E. Richter
-
Patent number: 5271787Abstract: A method of making a label-equipped sheet and product wherein the label is die-cut from base stock constituting the sheet and held in place by a pressure-sensitive adhesive-equipped release liner, the web patch constituting the release liner having a pattern of coatings thereon including a first pattern of release material so as to leave an uncoated perimeter and thereafter overcoated with pressure-sensitive adhesive.Type: GrantFiled: May 13, 1992Date of Patent: December 21, 1993Assignee: Wallace Computer Services, Inc.Inventors: Donald J. Hoffmann, Wayne E. Richter