Abstract: A surface acoustic wave die system and method are disclosed herein, including a surface acoustic wave sensor comprising one or more surface acoustic wave die disposed and hermetically sealed between a base and a cover. An adhesive is generally for securing one or more of the surface acoustic wave die to the base, which is configured with a pattern of cross hatches formed thereon in order to permit the adhesive to adhere to the base. The adhesive is placed under a location wherein surface acoustic wave die is to be located. The surface acoustic wave die is thereafter pressed into the adhesive, whereby upon a subsequent curing of the adhesive, the surface acoustic wave die is held securely in place, while remaining flexible as required by sensing applications associated with the surface acoustic save sensor.

Abstract: A pre-load weld fixture apparatus and method are disclosed, which include a stationary pivot block attached to a base, wherein the stationary pivot block is located adjacent to a nest for maintaining an object to be welded. Additionally a pivot arm is associated with a pivot arm insert, wherein the pivot arm rotates about a pivot point provided by a pin press component associated with the stationary pivot block, such that the pivot point is fixed to the stationary pivot block in relation to the object to be welded and wherein the pivot arm is positioned parallel to the nest. A spring block can be connected to the stationary pivot block, wherein the spring block provides tension to the pivot arm in order to permit a user to maintain the object upon the base with a desired tension for welding thereof. Finally, a torsion spring can be maintained by the spring block, wherein the torsion spring allows the spring block to provide tension to the pivot arm.

Abstract: A sensor pre-load and welding apparatus and method are disclosed. A weld fixture apparatus includes a fixture base upon which a sensor package having a sensor base and a sensor cover is located, and a load bar associated with a spring, wherein the load bar provides a specific weight to the fixture base in order to assist in maintaining the sensor cover and the sensor base parallel to one another upon the fixture base. An adjustable load foot is generally located above the fixture base, such that the adjustable load foot applies a pre-determined load with a specific weight to the sensor base in order to maintain the sensor cover and the sensor base securely in place as the sensor base and the sensor cover are welded to one another in order to configure the sensor package.

Abstract: A packaging system for electronic circuitry is provided. The electronic circuitry may be disposed upon a substrate, which can be encased or otherwise surrounded by one or more components of the packaging system. The packaging system may include (i) an inner housing that can encase or otherwise enclose the substrate within its confines; (ii) an outer housing that in turn encases or encloses the combination of the inner housing and the substrate within its confines; and (iii) one or more gaps positioned between the electronic circuitry, inner housing and outer housing. The gaps may be filled with fluid or solid insulating media. The combination of the inner housing, outer housing, and gaps can insulate the electronic circuitry from the detrimental and destructive heating effects when the packaging system experiences short-term exposure to a high temperature, which thereby allows operability before, during and after such exposure.