Patents by Inventor Wayne G. Renken
Wayne G. Renken has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9165846Abstract: A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device.Type: GrantFiled: October 25, 2010Date of Patent: October 20, 2015Assignee: KLA-Tencor CorporationInventor: Wayne G. Renken
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Publication number: 20150006108Abstract: A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device.Type: ApplicationFiled: October 25, 2010Publication date: January 1, 2015Applicant: KLA-Tencor CorporationInventor: WAYNE G. RENKEN
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Publication number: 20130029433Abstract: An instrument comprises a substrate, a plurality of sensors distributed at positions across the substrate's surface, at least one electronic processing component on the surface, electrical conductors extending across the surface and connected to the sensors and processing component, and a cover disposed over the sensors, processing component and conductors. The cover and substrate have similar material properties to a production substrate. The cover is configured to electromagnetically shield the sensors, conductors, or processing component. The instrument has approximately the same thickness and/or flatness as the production substrate. It is emphasized that this abstract is provided to comply with rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.Type: ApplicationFiled: January 30, 2012Publication date: January 31, 2013Applicant: KLA-Tencor CorporationInventors: Mei H. Sun, Mark Wiltse, Wayne G. Renken, Zachary Reid, Tony Dibiase
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Patent number: 8104342Abstract: An instrument for measuring a parameter comprises a substrate, a plurality of sensors carried by and distributed across a surface of the substrate that individually measure the parameter at different positions, an electronic processing component carried by the substrate surface, electrical conductors extending across the surface connected to the sensors and the electronic processing component, and a cover disposed over the sensors, electronic processing component and conductors. The cover and substrate have similar material properties to a production substrate processed by a substrate processing cell. The instrument has approximately the same thickness and/or flatness as the production substrate. The instrument may be subjected a substrate process and one or more parameters may be measured with the instrument during the process. The behavior of a production wafer in the substrate process may be characterized based on measurements of the parameters made with the one or more sensors.Type: GrantFiled: February 20, 2008Date of Patent: January 31, 2012Assignee: KLA-Tencor CorporationInventors: Mei H. Sun, Mark Wiltse, Wayne G. Renken, Zachary Reid, Tony DiBiase
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Patent number: 8046193Abstract: A sensor network collects time-series data from a process tool and supplies the data to an analysis system where pattern analysis techniques are used to identify structures and to monitor subsequent data based on analysis instructions or a composite model. Time-series data from multiple process runs are used to form a composite model of a data structure including variation. Comparison with the composite model gives an indication of tool health. A sensor network may have distributed memory for a more simplified configuration.Type: GrantFiled: April 21, 2008Date of Patent: October 25, 2011Assignee: KLA-Tencor CorporationInventors: Forrest Gilbert Yetter, Jr., Jeffrey M. Parker, Wayne G. Renken, John B. Pieper
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Patent number: 8033190Abstract: A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device. Isolation may be provided by vacuum or suitable material and phase change material may be located adjacent to electronics to maintain a low temperature.Type: GrantFiled: May 25, 2010Date of Patent: October 11, 2011Assignee: KLA-Tencor Technologies CorporationInventors: Wayne G. Renken, Mei H. Sun
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Publication number: 20110040527Abstract: A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device.Type: ApplicationFiled: October 25, 2010Publication date: February 17, 2011Applicant: KLA-Tencor CorporationInventor: WAYNE G. RENKEN
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Publication number: 20100294051Abstract: A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device. Isolation may be provided by vacuum or suitable material and phase change material may be located adjacent to electronics to maintain a low temperature.Type: ApplicationFiled: May 25, 2010Publication date: November 25, 2010Applicant: KLA-TENCOR CORPORATIONInventors: Wayne G. Renken, Mei H. Sun
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Patent number: 7819033Abstract: A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device.Type: GrantFiled: April 21, 2008Date of Patent: October 26, 2010Inventor: Wayne G. Renken
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Patent number: 7757574Abstract: A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device. Isolation may be provided by vacuum or suitable material and phase change material may be located adjacent to electronics to maintain a low temperature.Type: GrantFiled: December 13, 2005Date of Patent: July 20, 2010Assignee: KLA-Tencor CorporationInventors: Wayne G. Renken, Mei H. Sun
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Patent number: 7698952Abstract: At least one pair of capacitively coupled electrodes contained in a structure is used to sense the deflection of a diaphragm in a pressure or force sensor for measuring the pressure or force exerted on the diaphragm. Preferably the structure has properties (such as one or more of the following: dimensions, hardness, area and flexibility) that are substantially the same as those of a real substrate, such as a semiconductor wafer or flat panel display panel.Type: GrantFiled: September 25, 2007Date of Patent: April 20, 2010Assignee: KLA-Tencor CorporationInventors: Wayne G. Renken, Mei H. Sun, Aron Abramowski Mason, Lynn Karl Wiese
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Publication number: 20090056441Abstract: An instrument for measuring a parameter comprises a substrate, a plurality of sensors carried by and distributed across a surface of the substrate that individually measure the parameter at different positions, an electronic processing component carried by the substrate surface, electrical conductors extending across the surface connected to the sensors and the electronic processing component, and a cover disposed over the sensors, electronic processing component and conductors. The cover and substrate have similar material properties to a production substrate processed by a substrate processing cell. The instrument has approximately the same thickness and/or flatness as the production substrate. The instrument may be subjected a substrate process and one or more parameters may be measured with the instrument during the process. The behavior of a production wafer in the substrate process may be characterized based on measurements of the parameters made with the one or more sensors.Type: ApplicationFiled: February 20, 2008Publication date: March 5, 2009Applicant: KLA-Tencor CorporationInventors: Mei H. Sun, Mark Wiltse, Wayne G. Renken, Zachary Reid, Tony DiBiase
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Patent number: 7497134Abstract: At least one shear force sensor is used to measure the shear force on a member, when the member is in contact with and pressed against a polishing or planarization surface and a lateral force is applied between the two surfaces. Preferably the structure and the surface of the structure have properties (such as one or more of the following: dimensions and coefficient of friction) that are substantially the same as those of a real substrate, such as a semiconductor wafer or flat panel display panel.Type: GrantFiled: September 25, 2007Date of Patent: March 3, 2009Assignee: KLA-Tencor CorporationInventors: Wayne G. Renken, Mei H. Sun, Aron Abramowski Mason
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Publication number: 20080228306Abstract: A sensor network collects time-series data from a process tool and supplies the data to an analysis system where pattern analysis techniques are used to identify structures and to monitor subsequent data based on analysis instructions or a composite model. Time-series data from multiple process runs are used to form a composite model of a data structure including variation. Comparison with the composite model gives an indication of tool health. A sensor network may have distributed memory for easy configuration.Type: ApplicationFiled: April 21, 2008Publication date: September 18, 2008Applicant: SENSARRAY CORPORATIONInventors: Forrest Gilbert Yetter, Jeffrey M. Parker, Wayne G. Renken, John B. Pieper
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Publication number: 20080228419Abstract: A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device.Type: ApplicationFiled: April 21, 2008Publication date: September 18, 2008Applicant: SENSARRAY CORPORATIONInventor: Wayne G. Renken
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Patent number: 7363195Abstract: A sensor network collects time-series data from a process tool and supplies the data to an analysis system where pattern analysis techniques are used to identify structures and to monitor subsequent data based on analysis instructions or a composite model. Time-series data from multiple process runs are used to form a composite model of a data structure including variation. Comparison with the composite model gives an indication of tool health. A sensor network may have distributed memory for network configuration.Type: GrantFiled: July 1, 2005Date of Patent: April 22, 2008Assignee: Sensarray CorporationInventors: Forrest Gilbert Yetter, Jr., Jeffrey M. Parker, Wayne G. Renken, John B. Pieper
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Patent number: 7360463Abstract: A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device.Type: GrantFiled: October 14, 2003Date of Patent: April 22, 2008Assignee: Sensarray CorporationInventor: Wayne G. Renken
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Patent number: 6915589Abstract: Multiple sensors may be attached to a substrate to measure conditions at different points. Positioning the sensors accurately may be achieved using a template to establish sensor position. A pre-fabricated kit including a template, sensors and a cable assembly may be easily transported so that sensors may be attached in the field.Type: GrantFiled: October 16, 2003Date of Patent: July 12, 2005Assignee: SensArray CorporationInventors: Mei H. Sun, Richard Schwaninger, Wayne G. Renken
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Patent number: 6889568Abstract: A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device.Type: GrantFiled: January 24, 2002Date of Patent: May 10, 2005Assignee: SensArray CorporationInventor: Wayne G. Renken
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Publication number: 20040074323Abstract: A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device.Type: ApplicationFiled: October 14, 2003Publication date: April 22, 2004Inventor: Wayne G. Renken