Patents by Inventor Wayne Genetti

Wayne Genetti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10176143
    Abstract: Some embodiments include apparatus and methods having a circuit board, a device located on the circuit board, a first Peripheral Component Interconnect Express (PCIe) connector located on the circuit board and coupled to the device, and a second PCIe connector located on the circuit board and coupled to the device. The first PCIe connector is arranged to couple to a first connector of an additional circuit board. The second PCIe connector is arranged to couple to a second connector of the additional circuit board.
    Type: Grant
    Filed: June 13, 2017
    Date of Patent: January 8, 2019
    Assignee: Intel Corporation
    Inventors: Vladimir Tamarkin, Wayne Genetti, David Schweitzer
  • Patent number: 9954295
    Abstract: A cabled midplane interconnect system includes a cabled midplane interconnect having a first connection and a second connection. A first circuit board has a third connection configured to be coupled to the first connection. A second circuit board has a fourth connection configured to be coupled to the second connection. The connection orientations are assigned such that a midplane cable, having a plurality of conductors, couples the first connection to the second connection so that none of the plurality of conductors crosses another of the plurality of conductors.
    Type: Grant
    Filed: May 1, 2017
    Date of Patent: April 24, 2018
    Assignee: Intel Corporation
    Inventors: Wayne Genetti, Vladimir Tamarkin
  • Patent number: 9917392
    Abstract: A cabled midplane includes a first support plate along a plane between a first connector set and a second connector set that connect to line cards on either side of the cabled midplane. The first connector set and the second connector set include connector slices. A wiring sub-layer includes cable slices to provide a connection between the first connector slice of a connector of the first connector set to the first connector slice of a connector of the second connector set, such that the first wiring sub-layer connects each connector of the first connector set, through one cable slice, to a connector of the second connector set. Additional wiring sub-layers are added, and a second support plate, parallel to the first support plate, is provided to encase and support the wiring sub-layers between the first support plate and the second support plate. Other apparatuses and methods are described.
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: March 13, 2018
    Assignee: Intel Corporation
    Inventors: Vladimir Tamarkin, Wayne Genetti, Keith Mease, Mark Wessel
  • Publication number: 20170286353
    Abstract: Some embodiments include apparatus and methods having a circuit board, a device located on the circuit board, a first Peripheral Component Interconnect Express (PCIe) connector located on the circuit board and coupled to the device, and a second PCIe connector located on the circuit board and coupled to the device. The first PCIe connector is arranged to couple to a first connector of an additional circuit board. The second PCIe connector is arranged to couple to a second connector of the additional circuit board.
    Type: Application
    Filed: June 13, 2017
    Publication date: October 5, 2017
    Inventors: Vladimir Tamarkin, Wayne Genetti, David Schweitzer
  • Publication number: 20170237189
    Abstract: A cabled midplane interconnect system includes a cabled midplane interconnect having a first connection and a second connection. A first circuit board has a third connection configured to be coupled to the first connection. A second circuit board has a fourth connection configured to be coupled to the second connection. The connection orientations are assigned such that a midplane cable, having a plurality of conductors, couples the first connection to the second connection so that none of the plurality of conductors crosses another of the plurality of conductors.
    Type: Application
    Filed: May 1, 2017
    Publication date: August 17, 2017
    Inventors: Wayne Genetti, Vladimir Tamarkin
  • Patent number: 9710421
    Abstract: Some embodiments include apparatus and methods having a circuit board, a device located on the circuit board, a first Peripheral Component Interconnect Express (PCIe) connector located on the circuit board and coupled to the device, and a second PCIe connector located on the circuit board and coupled to the device. The first PCIe connector is arranged to couple to a first connector of an additional circuit board. The second PCIe connector is arranged to couple to a second connector of the additional circuit board.
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: July 18, 2017
    Assignee: Intel Corporation
    Inventors: Vladimir Tamarkin, Wayne Genetti, David Schweitzer
  • Patent number: 9697160
    Abstract: A cabled midplane interconnect system includes a cabled midplane interconnect having a first connection and a second connection. A first circuit board has a third connection configured to be coupled to the first connection. A second circuit board has a fourth connection configured to be coupled to the second connection. The connection orientations are assigned such that a midplane cable, having a plurality of conductors, couples the first connection to the second connection so that none of the plurality of conductors crosses another of the plurality of conductors.
    Type: Grant
    Filed: December 23, 2014
    Date of Patent: July 4, 2017
    Assignee: Intel Corporation
    Inventors: Wayne Genetti, Vladimir Tamarkin
  • Publication number: 20160352038
    Abstract: A cabled midplane includes a first support plate along a plane between a first connector set and a second connector set that connect to line cards on either side of the cabled midplane. The first connector set and the second connector set include connector slices. A wiring sub-layer includes cable slices to provide a connection between the first connector slice of a connector of the first connector set to the first connector slice of a connector of the second connector set, such that the first wiring sub-layer connects each connector of the first connector set, through one cable slice, to a connector of the second connector set. Additional wiring sub-layers are added, and a second support plate, parallel to the first support plate, is provided to encase and support the wiring sub-layers between the first support plate and the second support plate. Other apparatuses and methods are described.
    Type: Application
    Filed: August 8, 2016
    Publication date: December 1, 2016
    Inventors: Vladimir Tamarkin, Wayne Genetti, Keith Mease, Mark Wessel
  • Patent number: 9413097
    Abstract: A cabled midplane includes a first support plate along a plane between a first connector set and a second connector set that connect to line cards on either side of the cabled midplane. The first connector set and the second connector set include connector slices. A wiring sub-layer includes cable slices to provide a connection between the first connector slice of a connector of the first connector set to the first connector slice of a connector of the second connector set, such that the first wiring sub-layer connects each connector of the first connector set, through one cable slice, to a connector of the second connector set. Additional wiring sub-layers are added, and a second support plate, parallel to the first support plate, is provided to encase and support the wiring sub-layers between the first support plate and the second support plate. Other apparatuses and methods are described.
    Type: Grant
    Filed: December 22, 2014
    Date of Patent: August 9, 2016
    Assignee: Intel Corporation
    Inventors: Vladimir Tamarkin, Wayne Genetti, Keith Mease, Mark Wessel
  • Publication number: 20160181719
    Abstract: A cabled midplane includes a first support plate along a plane between a first connector set and a second connector set that connect to line cards on either side of the cabled midplane. The first connector set and the second connector set include connector slices. A wiring sub-layer includes cable slices to provide a connection between the first connector slice of a connector of the first connector set to the first connector slice of a connector of the second connector set, such that the first wiring sub-layer connects each connector of the first connector set, through one cable slice, to a connector of the second connector set. Additional wiring sub-layers are added, and a second support plate, parallel to the first support plate, is provided to encase and support the wiring sub-layers between the first support plate and the second support plate. Other apparatuses and methods are described.
    Type: Application
    Filed: December 22, 2014
    Publication date: June 23, 2016
    Inventors: Vladimir Tamarkin, Wayne Genetti, Keith Mease, Mark Wessel
  • Publication number: 20160181711
    Abstract: A cabled midplane interconnect system includes a cabled midplane interconnect having a first connection and a second connection. A first circuit board has a third connection configured to be coupled to the first connection. A second circuit board has a fourth connection configured to be coupled to the second connection. The connection orientations are assigned such that a midplane cable, having a plurality of conductors, couples the first connection to the second connection so that none of the plurality of conductors crosses another of the plurality of conductors.
    Type: Application
    Filed: December 23, 2014
    Publication date: June 23, 2016
    Inventors: Wayne Genetti, Vladimir Tamarkin
  • Publication number: 20160170928
    Abstract: Some embodiments include apparatus and methods having a circuit board, a device located on the circuit board, a first Peripheral Component Interconnect Express (PCIe) connector located on the circuit board and coupled to the device, and a second PCIe connector located on the circuit board and coupled to the device. The first PCIe connector is arranged to couple to a first connector of an additional circuit board. The second PCIe connector is arranged to couple to a second connector of the additional circuit board.
    Type: Application
    Filed: December 12, 2014
    Publication date: June 16, 2016
    Inventors: Vladimir Tamarkin, Wayne Genetti, David Schweitzer