Patents by Inventor Wayne Glidden

Wayne Glidden has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6967829
    Abstract: Structures for serially connecting at least two capacitors together are described. Serially connecting capacitors together provides device manufactures, such as those selling implantable medical devices, with broad flexibility in terms of both how many capacitors are incorporated in the device and what configuration the capacitor assembly will assume.
    Type: Grant
    Filed: January 28, 2005
    Date of Patent: November 22, 2005
    Assignees: Greatbatch, Inc.
    Inventors: Keith W. Seitz, Kenneth Talamine, Laurie O'Connor, Michael Streun, Wayne Glidden, Barry Muffoletto
  • Publication number: 20050162810
    Abstract: Structures for serially connecting at least two capacitors together are described. Serially connecting capacitors together provides device manufactures, such as those selling implantable medical devices, with broad flexibility in terms of both how many capacitors are incorporated in the device and what configuration the capacitor assembly will assume.
    Type: Application
    Filed: January 28, 2005
    Publication date: July 28, 2005
    Inventors: Keith Seitz, Kenneth Talamine, Laurie O'Connor, Michael Streun, Wayne Glidden, Barry Muffoletto
  • Patent number: 5023544
    Abstract: The invention comprises an extended input system by which additional component supply stations are located out of reach of the pick and place heads of a machine for handling surface mountable components and are selectively addressable by a supply shuttle which fetches individual components and delivers each component selectively to a test pocket or a utility pocket of a transfer assembly, from which the components are retrievable by a pick and place head of the onserter. In a preferred embodiment, the transfer assembly provides a second shuttle on which the utility and test pockets are mounted for movement back and forth between the supply shuttle unload station to a pick-up station of the head, and the component testing occurs during transit of the transfer shuttle.
    Type: Grant
    Filed: November 20, 1990
    Date of Patent: June 11, 1991
    Assignee: Universal Instruments Corporation
    Inventors: Giacinto Vallone, Stanley W. Janisiewicz, Michael D. Snyder, Gerald B. Hemmelgarn, Wayne A. Glidden