Patents by Inventor Wayne Hai-Wei Huang

Wayne Hai-Wei Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9153451
    Abstract: A method of forming a planar surface for a semiconductor device structure. The method comprises forming a particle film comprising a plurality of discrete particles on a non-planar surface of a semiconductor device structure. The semiconductor device structure is subjected to at least one chemical-mechanical polishing process after forming the particle film on the non-planar surface of the semiconductor device structure. Methods of forming a semiconductor device structure are also described.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: October 6, 2015
    Assignee: Micron Technology, Inc.
    Inventors: Andrew Dennis Watson Carswell, Wayne Hai-Wei Huang, Siddartha Kondoju, Jin Lu, Suresh Ramakrishnan, Kozaburo Sakai, Sony Varghese, Andrey V. Zagrebelny
  • Publication number: 20140162455
    Abstract: A method of forming a planar surface for a semiconductor device structure. The method comprises forming a particle film comprising a plurality of discrete particles on a non-planar surface of a semiconductor device structure. The semiconductor device structure is subjected to at least one chemical-mechanical polishing process after forming the particle film on the non-planar surface of the semiconductor device structure. Methods of forming a semiconductor device structure are also described.
    Type: Application
    Filed: December 12, 2012
    Publication date: June 12, 2014
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Andrew Dennis Watson Carswell, Wayne Hai-Wei Huang, Siddartha Kondoju, Jin Lu, Suresh Ramakrishnan, Kozaburo Sakai, Sony Varghese, Andrey V. Zagrebelny