Abstract: A first overvoltage protection and reporting system comprises input and output transceivers and input and output surge protection devices coupled respectively to the input and output transceivers. The input surge protection device includes first and second gas discharge tubes coupled to the input transceiver only at, respectively, a first input and a second input. The output surge protection device includes third and fourth gas discharge tubes coupled to the output transceiver only at, respectively, a first and a second output. A second overvoltage protection and reporting system comprises input and output transceivers, a processor coupled between the input and output transceivers, and an output surge protection system that includes a surge protection device coupled to the output transceiver and a sensor receiver coupled between the output transceiver and the processor. The processor detects a failure of the surge protection device based on a signal received from the sensor receiver.

Abstract: A first overvoltage protection and reporting system comprises input and output transceivers and input and output surge protection devices coupled respectively to the input and output transceivers. The input surge protection device includes first and second gas discharge tubes coupled to the input transceiver only at, respectively, a first input and a second input. The output surge protection device includes third and fourth gas discharge tubes coupled to the output transceiver only at, respectively, a first and a second output. A second overvoltage protection and reporting system comprises input and output transceivers, a processor coupled between the input and output transceivers, and an output surge protection system that includes a surge protection device coupled to the output transceiver and a sensor receiver coupled between the output transceiver and the processor. The processor detects a failure of the surge protection device based on a signal received from the sensor receiver.

Abstract: A plurality of semiconductor devices are provided on a carrier for testing or burning-in. The carrier is then cut up to provide single chip-on-carrier components or multi-chip-on-carrier components. The carrier is used as a first level package for each chip. Thus, the carrier serves a dual purpose for test and burn-in and for packaging. A lead reduction mechanism, such as a built-in self-test engine, can be provided on each chip or on the carrier and is connected to contacts of the carrier for the testing and burn-in steps. The final package after cutting includes at least one known good die and may include an array of chips on the carrier, such as a SIMM or a DIMM. The final package can also be a stack of chips each mounted on a separate carrier. The carriers of the stack are connected to each other through a substrate mounted along a side face of the stack that is electrically connected to a line of pads along an edge of each carrier.

Abstract: A method of accurately controlling at least one of an intensity, brightness, dimming or color mixing of a LED, the method comprising monitoring an actual current flowing through the LED, selecting a specific current based on at least one of a desired illumination intensity, a desired brightness, a desired dimming, or a desired color mixing, comparing said actual current and said specific current, and if a difference exists between said actual current and said specific current, adjusting said actual current to agree with said specific current.

Abstract: A semiconductor structure including a first substrate and a second substrate joined to the first substrate. A plurality of contacts extend between the first substrate and the second substrate. A plurality of first solder bumps are connected between the first substrate and the second substrate for aligning the contacts.

Abstract: A semiconductor structure including a first substrate and a second substrate joined to the first substrate. A plurality of contacts extend between the first substrate and the second substrate. A plurality of first solder bumps are connected between the first substrate and the second substrate for aligning the contacts.