Abstract: A conductive contact (5) includes a right base portion (51), a securing portion (51) extending from a lower end of the base portion (51), wherein the securing portion (53) defines at least one barb (531) with a side of the securing portion (53) angled an angle less than 90 to a vertical direction, providing a more strengthened engagement between the housing and the contact (5).

Abstract: A socket for a semiconductor package comprises an insulating base containing a plurality of contacts, a floating board received in the insulating base, a plurality of spring members located between the insulating base and the floating board, a bottom cover pivotally assembled to an end of the insulating base, a top cover pivotally assembled to an edge of the bottom cover, a pressing board retained to the bottom cover, a heat sink module disposed on the bottom cover, and a fan mounted on the top cover.

Abstract: A socket for a semiconductor package comprises an insulating base containing a plurality of contacts, a floating board received in the insulating base, a plurality of spring members located between the insulating base and the floating board, a bottom cover pivotally assembled to an end of the insulating base, a top cover pivotally assembled to an edge of the bottom cover, a pressing board retained to the bottom cover, a heat sink module disposed on the bottom cover, and a fan mounted on the top cover.

Abstract: A test socket includes a socket body (20) having a passageway (42), and a terminal (30) insertable into the passageway. The passageway has a portion with an interior contour (421) in a predetermined plane along a length axis of said passageway. The terminal includes a resilient end (33) resiliently movable relative to the passageway. The resilient end has an exterior contour (331) in a common plane of the passageway, with the exterior contour in shape different from that of the interior contour of the passageway, such that during the movement of the resilient end, the exterior contour of the resilient end forms in point-to-point contact with the interior contour of the passageway. As compared with the prior art, the point-to-point contact between the terminal and the passageway can effectively reduce the abrasion of the terminal.

Abstract: A conductive contact (5) includes a right base portion (51), a securing portion (51) extending from a lower end of the base portion (51), wherein the securing portion (53) defines at least one barb (531) with a side of the securing portion (53) angled an angle less than 90 to a vertical direction, providing a more strengthened engagement between the housing and the contact (5).

Abstract: A heat sink dissipating device (1) includes a heat sink assembly (20), a first attachment frame (100) and a second attachment frame (110). The first attachment frame defines a region (113) for the heat sink assembly to be retained thereon. The second attachment frame includes a plurality frame pieces (101) to be engaged on the first attachment frame and configured for surrounding a peripheral portion of the heat sink assembly. A heat dissipating recess (102) extends transversely of at least one frame piece towards the peripheral portion of the heat sink assembly so as to allow heat air to be dissipated from the heat sink assembly through the heat dissipating recess. As such, the inclusion of the air flowing opening of the mating frame piece can provide heat dissipation in a lateral direction from the peripheral portion of the heat sink assembly.

Abstract: The present invention provides a joining structure of heat-radiating plate and optoelectronic heat-emitting device, which comprises an optoelectronic heat-emitting device, a heat radiator, and a thermal conductive material. The top face of the optoelectronic heat-emitting device is joined with the bottom face of the heat radiator. A receiving space is disposed on the bottom face of the heat radiator. The thermal conductive material is placed in the receiving space. The area of the top face of the optoelectronic heat-emitting device is smaller than that of the receiving space so that the top face of the optoelectronic heat-emitting device can contact the thermal conductive material in the receiving space. The thermal conductive material can melt into liquid to have good fluidity after being uniformly heated to fill up the gap between the heat radiator and the optoelectronic heat-emitting device, thereby effectively helping the optoelectronic heat-emitting device quickly radiate out heat.