Patents by Inventor Wayne L. Ehlers

Wayne L. Ehlers has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7165298
    Abstract: A surface acoustic wave die system and method are disclosed herein, including a surface acoustic wave sensor comprising one or more surface acoustic wave die disposed and hermetically sealed between a base and a cover. An adhesive is generally for securing one or more of the surface acoustic wave die to the base, which is configured with a pattern of cross hatches formed thereon in order to permit the adhesive to adhere to the base. The adhesive is placed under a location wherein surface acoustic wave die is to be located. The surface acoustic wave die is thereafter pressed into the adhesive, whereby upon a subsequent curing of the adhesive, the surface acoustic wave die is held securely in place, while remaining flexible as required by sensing applications associated with the surface acoustic save sensor.
    Type: Grant
    Filed: September 14, 2004
    Date of Patent: January 23, 2007
    Assignee: Honeywell International Inc.
    Inventors: Wayne L. Ehlers, Gary W. Eisenhower, Jr., Brian J. Marsh, James D. Cook
  • Patent number: 7070086
    Abstract: A sensor pre-load and welding apparatus and method are disclosed. A weld fixture apparatus includes a fixture base upon which a sensor package having a sensor base and a sensor cover is located, and a load bar associated with a spring, wherein the load bar provides a specific weight to the fixture base in order to assist in maintaining the sensor cover and the sensor base parallel to one another upon the fixture base. An adjustable load foot is generally located above the fixture base, such that the adjustable load foot applies a pre-determined load with a specific weight to the sensor base in order to maintain the sensor cover and the sensor base securely in place as the sensor base and the sensor cover are welded to one another in order to configure the sensor package.
    Type: Grant
    Filed: March 3, 2004
    Date of Patent: July 4, 2006
    Assignee: Honeywell International Inc.
    Inventors: Gary W. Eisenhower, Jr., Wayne L. Ehlers, Brian J. Marsh
  • Patent number: 7059511
    Abstract: A pre-load weld fixture apparatus and method are disclosed, which include a stationary pivot block attached to a base, wherein the stationary pivot block is located adjacent to a nest for maintaining an object to be welded. Additionally a pivot arm is associated with a pivot arm insert, wherein the pivot arm rotates about a pivot point provided by a pin press component associated with the stationary pivot block, such that the pivot point is fixed to the stationary pivot block in relation to the object to be welded and wherein the pivot arm is positioned parallel to the nest. A spring block can be connected to the stationary pivot block, wherein the spring block provides tension to the pivot arm in order to permit a user to maintain the object upon the base with a desired tension for welding thereof. Finally, a torsion spring can be maintained by the spring block, wherein the torsion spring allows the spring block to provide tension to the pivot arm.
    Type: Grant
    Filed: March 15, 2004
    Date of Patent: June 13, 2006
    Assignee: Honeywell International Inc.
    Inventors: Gary W. Eisenhower, Jr., Wayne L. Ehlers, Brian J. Marsh
  • Patent number: 7023695
    Abstract: A packaging system for electronic circuitry is provided. The electronic circuitry may be disposed upon a substrate, which can be encased or otherwise surrounded by one or more components of the packaging system. The packaging system may include (i) an inner housing that can encase or otherwise enclose the substrate within its confines; (ii) an outer housing that in turn encases or encloses the combination of the inner housing and the substrate within its confines; and (iii) one or more gaps positioned between the electronic circuitry, inner housing and outer housing. The gaps may be filled with fluid or solid insulating media. The combination of the inner housing, outer housing, and gaps can insulate the electronic circuitry from the detrimental and destructive heating effects when the packaging system experiences short-term exposure to a high temperature, which thereby allows operability before, during and after such exposure.
    Type: Grant
    Filed: September 8, 2003
    Date of Patent: April 4, 2006
    Assignee: Honeywell International, Inc.
    Inventors: Dave R. McCollum, Wayne L. Ehlers, Michael J. Skarlupka
  • Patent number: 6850136
    Abstract: A magnetoresistive-based electronic switching apparatus and method. A housing having a first compartment contains switching electronics and a second compartment contains an actuation assembly. A barrier can separate the first compartment from the second compartment. An actuating magnet can be associated with the actuation assembly within the second compartment. The actuating magnet provides a magnetic field that can activate a magnetoresistive device located within the first compartment. Additionally, a magnetoresistive device responsive to the magnetic field of the actuating magnet can be utilized, wherein the magnetoresistive device located within the first compartment in association with the switching electronics provides a solid-state magnetoresistive switch thereof.
    Type: Grant
    Filed: September 4, 2002
    Date of Patent: February 1, 2005
    Assignee: Honeywell International Inc.
    Inventors: David R. McCollum, Wayne L. Ehlers, Michael J. Skarlupka
  • Publication number: 20040041685
    Abstract: A magnetoresistive-based electronic switching apparatus and method. A housing having a first compartment contains switching electronics and a second compartment contains an actuation assembly. A barrier can separate the first compartment from the second compartment. An actuating magnet can be associated with the actuation assembly within the second compartment. The actuating magnet provides a magnetic field that can activate a magnetoresistive device located within the first compartment. Additionally, a magnetoresistive device responsive to the magnetic field of the actuating magnet can be utilized, wherein the magnetoresistive device located within the first compartment in association with the switching electronics provides a solid-state magnetoresistive switch thereof.
    Type: Application
    Filed: September 4, 2002
    Publication date: March 4, 2004
    Inventors: David R. McCollum, Wayne L. Ehlers, Michael J. Skarlupka
  • Patent number: 5648719
    Abstract: A sensor is provided for changing an operational characteristic of a circuit within a housing structure of the sensor to a preselected stimulus. The circuit within the housing structure is provided with magnetically sensitive components to change an operational parameter thereof. An object is provided to change the status of the magnetically sensitive component. The present invention incorporates a Hall effect element within the housing structure that is placed proximate a permanent magnet. Between the magnet and the Hall effect element a depression is formed to permit the insertion of a magnetically permeable object to change the magnetic field. The change in the magnetic field creates a change in the status of the Hall effect element and permits the circuit to change its operational characteristic.
    Type: Grant
    Filed: June 19, 1992
    Date of Patent: July 15, 1997
    Assignee: Honeywell Inc.
    Inventors: Timothy A. Christensen, Wayne L. Ehlers, Kenneth L. Eichholz, Jr., Thomas A. Fletcher
  • Patent number: 5619188
    Abstract: A proximity sensor is provided with a means for sensing an attempt to tamper with the normal operation of a proximity sensor. An Eddy current killed oscillator is used to sense the presence of an undulating magnetic field provided by a coil and a monolithic timing circuit that periodically energizes and deenergizes the coil. A sensing coil is association with an Eddy current killed oscillator to provide an output signal that undulates in response to the undulations of the magnetic field provided by the stationary coil. If the output signal from the Eddy current killed oscillator changes states at a sufficient frequency to continually refresh a retriggerable resettable multivibrator, an output from the multivibrator will remain in a high condition and represent the coincident positions of the zones proximate the output coil and sensing coil.
    Type: Grant
    Filed: October 20, 1995
    Date of Patent: April 8, 1997
    Assignee: Honeywell Inc.
    Inventor: Wayne L. Ehlers
  • Patent number: 5588202
    Abstract: A method is described for manufacturing a plurality of proximity sensors which are attached to a printed circuit board during the manufacturing steps and subsequently severed from the printed circuit board by shearing. Each of the proximity sensors comprises a core and coil assembly, a plurality of electronic components and an electrical connector. These components of each of the proximity sensors is encapsulated during an overmolding process and the encapsulations are removed from the printed circuit board by a shearing step. Each of the encapsulations can be inserted into a cylindrical housing.
    Type: Grant
    Filed: March 17, 1995
    Date of Patent: December 31, 1996
    Assignee: Honeywell Inc.
    Inventors: Wayne L. Ehlers, Kenneth L. Eichholz, Jr., Mark F. Johnston
  • Patent number: D611075
    Type: Grant
    Filed: August 8, 2007
    Date of Patent: March 2, 2010
    Assignee: Honeywell International Inc.
    Inventors: James D. Cook, Brian J. Marsh, Wayne L. Ehlers, Gary W. Eisenhower, Jr.