Abstract: The present disclosure relates to a semiconductor device and a manufacturing method, and more particularly to forming via rail and deep via structures to reduce parasitic capacitances in standard cell structures. Via rail structures are formed in a level different from the conductive lines. The via rail structure can reduce the number of conductive lines and provide larger separations between conductive lines that are on the same interconnect level and thus reduce parasitic capacitance between conductive lines.

Abstract: The present disclosure relates to a semiconductor device and a manufacturing method, and more particularly to forming via rail and deep via structures to reduce parasitic capacitances in standard cell structures. Via rail structures are formed in a level different from the conductive lines. The via rail structure can reduce the number of conductive lines and provide larger separations between conductive lines that are on the same interconnect level and thus reduce parasitic capacitance between conductive lines.

Abstract: The present disclosure relates to a semiconductor device and a manufacturing method, and more particularly to forming via rail and deep via structures to reduce parasitic capacitances in standard cell structures. Via rail structures are formed in a level different from the conductive lines. The via rail structure can reduce the number of conductive lines and provide larger separations between conductive lines that are on the same interconnect level and thus reduce parasitic capacitance between conductive lines.

Abstract: The present disclosure relates to a semiconductor device and a manufacturing method, and more particularly to forming via rail and deep via structures to reduce parasitic capacitances in standard cell structures. Via rail structures are formed in a level different from the conductive lines. The via rail structure can reduce the number of conductive lines and provide larger separations between conductive lines that are on the same interconnect level and thus reduce parasitic capacitance between conductive lines.

Abstract: A general method for vaccinating against any pathogen is presented. The method utilizes expression library immunization, where an animal is inoculated with an expression library constructed from fragmented genomic DNA of the pathogen. All potential epitopes of the pathogen's proteins are encoded in its DNA, and genetic immunization is used to directly introduce one or more expression library clones to the immune system, producing an immune response to the encoded protein. Inoculation of expression libraries representing portions of the Mycoplasma pulmonis genome was shown to protect mice from subsequent challenge by this natural pathogen. Protection against Listeria was also obtained using the method.