Abstract: A system includes a contact center to provide an interaction between a customer and agent. A forms manager of the contact center generates a question for an evaluation form. A workforce management server connects with the forms manager, the workforce management server to schedule a work time for the agent. The workforce management server to schedule the forms manager to generate the evaluation form when the agent is working.

Abstract: A multi-charged particle beam tool for semiconductor wafer inspection or lithography includes an array of electron beam columns, each having its own electron or ion source. The objective lenses of the various electron beam columns, while each has its own pole piece, share a common single magnetic coil which generates a uniform magnetic field surrounding the entire array of electron beam columns. This advantageously improves the spacing between the beams while providing the superior optical properties of a strong magnetic objective lens. When used as an inspection tool, each column also has its own associated detector to detect secondary and back-scattered electrons from the wafer under inspection. In one version the gun lenses similarly have individual pole pieces for each column and share a common magnetic coil.

Abstract: A method of detecting defects in a patterned substrate includes positioning a charged-particle-beam optical column relative to a patterned substrate, the charged-particle-beam optical column having a field of view (FOV) with a substantially uniform resolution over the FOV; operating the charged-particle-beam optical column to acquire images of a region of the patterned substrate lying within the FOV by scanning the charged-particle beam over the patterned substrate; and comparing the acquired images to a reference to identify defects in the patterned substrate.

Abstract: A system and a method for organizing and retrieving information are provided. The system is running on a computer system accessible for interactive communication with users. The computer system runs a crosslink database stored therein. The crosslink database includes a crosslink data structure comprising at least a connecting node and at least a first element and a second element connected to the connecting node by a link; and a browser for interactively communicating with the users for organizing and retrieving/revising information in the cross link database. The first element is related to the second element and can be traced via the connecting node. The second element is related to the first element and can be traced via the connecting node. The connecting node may correspond to a context of information, and wherein the first element and the second element constitute different topics of information related to the context of information.

Abstract: A system and a method for organizing and retrieving information are provided. The system is running on a computer system accessible for interactive communication with users. The computer system runs a crosslink database stored therein. The crosslink database includes a crosslink data structure comprising at least a connecting node and at least a first element and a second element connected to the connecting node by a link; and a browser for interactively communicating with the users for organizing and retrieving/revising information in the cross link database. The first element is related to the second element and can be traced via the connecting node. The second element is related to the first element and can be traced via the connecting node. The connecting node may correspond to a context of information, and wherein the first element and the second element constitute different topics of information related to the context of information.

Abstract: A multi-charged particle beam tool for semiconductor wafer inspection or lithography includes an array of electron beam columns, each having its own electron or ion source. The objective lenses of the various electron beam columns, while each has its own pole piece, share a common single magnetic coil which generates a uniform magnetic field surrounding the entire array of electron beam columns. This advantageously improves the spacing between the beams while providing the superior optical properties of a strong magnetic objective lens. When used as an inspection tool, each column also has its own associated detector to detect secondary and back-scattered electrons from the wafer under inspection. In one version the gun lenses similarly have individual pole pieces for each column and share a common magnetic coil.

Abstract: One embodiment of the present invention is a method of detecting defects in a patterned substrate, including: (a) positioning a charged-particle-beam optical column relative to a patterned substrate, the charged-particle-beam optical column having a field of view (FOV) with a substantially uniform resolution over the FOV; (b) operating the charged-particle-beam optical column to acquire images of a region of the patterned substrate lying within the FOV by scanning the charged-particle beam over the patterned substrate; and (c) comparing the acquired images to a reference to identify defects in the patterned substrate.

Abstract: A multi-charged particle beam tool for semiconductor wafer inspection or lithography includes an array of electron beam columns, each having its own electron or ion source. The objective lenses of the various electron beam columns, while each has its own pole piece, share a common single magnetic coil which generates a uniform magnetic field surrounding the entire array of electron beam columns. This advantageously improves the spacing between the beams while providing the superior optical properties of a strong magnetic objective lens. When used as an inspection tool, each column also has its own associated detector to detect secondary and back-scattered electrons from the wafer under inspection. In one version the gun lenses similarly have individual pole pieces for each column and share a common magnetic coil.

Abstract: Defects in a patterned substrate are detected by inspection with a charged particle beam inspection tool which generates an image of a portion of the patterned substrate and compares the image with a reference in order to identify any defects in the patterned substrate. Parameters of the tool are optimized to improve image uniformity and contrast, particularly voltage contrast. Prior to imaging an area of the substrate, the tool charges an area surrounding the image area to eliminate or reduce the effects caused by asymmetrical charging in the surrounding area. The tool alternates between charging the surrounding area and imaging the image area to produce a plurality of images of the image area, which are then averaged. The result is a highly uniform image with improved contrast for accurate defect detection.

Abstract: Methods and apparatus are provided for inspecting a patterned substrate, comprising: preparing a reference image and a test image, extracting features from the reference image and extracting features from the test image, matching features of the reference image and features of the test image; and comparing features of the reference image and of the test image to identify defects. Embodiments include apparatus for inspecting patterned substrates, computer-readable media containing instructions for controlling a system having a processor for inspecting patterned substrates, and computer program products comprising a computer usable media having computer-readable program code embodied therein for controlling a system for inspecting patterned substrates. The images can be electron-beam voltage-contrast images.

Abstract: Defects in a patterned substrate are detected by positioning a charged-particle-beam optical column relative to a patterned substrate, the charged-particle imaging system having a field of view (FOV) with a substantially uniform resolution over the FOV; operating the charged-particle-beam optical column to acquire images over multiple subareas of the patterned substrate lying within the FOV by scanning a charged-particle beam over the patterned substrate while maintaining the charged-particle-beam optical column fixed relative to the patterned substrate; and comparing the acquired images to a reference to identify defects in the patterned substrate. The use of a large-FOV imaging system with substantially uniform resolution over the FOV allows acquisition of images over a wide area of the patterned substrate without requiring mechanical stage moves, thereby reducing the time overhead associated with mechanical stage moves. Multiple columns can be ganged together to further improve throughput.

Abstract: A method of testing a semiconductor structure such as a finished or part-finished semiconductor wafer, a die on such a wafer, part of such a die, or even one functional element (e.g. a transistor or memory cell) of such a die. The method includes the steps of charging at least a part of the semiconductor structure; applying an electric field perpendicular to a surface of the structure while charging so as to determine charging potential and polarity (i.e. charging either positively or negatively); interrogating the structure including the charged part with a charged particle beam, such as an electron beam, so as to obtain voltage contrast data for the structure; and analyzing the data to determine the functionality of the element.

Abstract: A multi-charged particle beam tool for semiconductor wafer inspection or lithography includes an array of electron beam columns, each having its own electron or ion source. The objective lenses of the various electron beam columns, while each has its own pole piece, share a common single magnetic coil which generates a uniform magnetic field surrounding the entire array of electron beam columns. This advantageously improves the spacing between the beams while providing the superior optical properties of a strong magnetic objective lens. When used as an inspection tool, each column also has its own associated detector to detect secondary and back-scattered electrons from the wafer under inspection. In one version the gun lenses similarly have individual pole pieces for each column and share a common magnetic coil.

Abstract: Abstract of the Disclosure One embodiment of the present invention is a method of detecting defects in a patterned substrate, including: (a) positioning a charged-particle-beam optical column relative to a patterned substrate, the charged-particle-beam optical column having a field of view (FOV) with a substantially uniform resolution over the FOV;. (b) operating the charged-particle-beam optical column to acquire images of a region of the patterned substrate lying within the FOV by scanning the charged-particle beam over the patterned substrate; and (c) comparing the acquired images to a reference to identify defects in the patterned substrate.

Abstract: Defects in a patterned substrate are detected by inspection with a charged particle beam inspection tool which generates an image of a portion of the patterned substrate and compares the image with a reference in order to identify any defects in the patterned substrate. Parameters of the tool are optimized to improve image uniformity and contrast, particularly voltage contrast. Prior to imaging an area of the substrate, the tool charges an area surrounding the image area to eliminate or reduce the effects caused by asymmetrical charging in the surrounding area. The tool alternates between charging the surrounding area and imaging the image area to produce a plurality of images of the image area, which are then averaged. The result is a highly uniform image with improved contrast for accurate defect detection.

Abstract: Defects in a patterned substrate are detected by inspection with a charged particle beam inspection tool which generates an image of a portion of the patterned substrate and compares the image with a reference in order to identify any defects in the patterned substrate. Parameters of the tool are optimized to improve image uniformity and contrast, particularly voltage contrast. Prior to imaging an area of the substrate, the tool charges an area surrounding the image area to eliminate or reduce the effects caused by asymmetrical charging in the surrounding area. The tool alternates between charging the surrounding area and imaging the image area to produce a plurality of images of the image area, which are then averaged. The result is a highly uniform image with improved contrast for accurate defect detection.

Abstract: Defects in a patterned substrate are detected by positioning a charged-particle-beam optical column relative to a patterned substrate, the charged-particle imaging system having a field of view (FOV) with a substantially uniform resolution over the FOV; operating the charged-particle-beam optical column to acquire images over multiple subareas of the patterned substrate lying within the FOV by scanning a charged-particle beam over the patterned substrate while maintaining the charged-particle-beam optical column fixed relative to the patterned substrate; and comparing the acquired images to a reference to identify defects in the patterned substrate. The use of a large- FOV imaging system with substantially uniform resolution over the FOV allows acquisition of images over a wide area of the patterned substrate without requiring mechanical stage moves, thereby reducing the time overhead associated with mechanical stage moves. Multiple columns can be ganged together to further improve throughput.

Abstract: A stage assembly for holding a work-piece in a charged particle microscopy system includes a magnetic motor (e.g., brushless linear servo motor) for driving an X-platform riding on a base along the X axis, a non-magnetic linear motor (e.g., piezoelectric motor) for driving a Y-platform riding on the X-platform along the Y axis, and a non-magnetic rotary motor (e.g., piezoelectric motor) for rotating a rotary platform over the Y-platform, wherein the duty cycle of the magnetic motor is substantially greater than the duty cycle of the non-magnetic linear and rotary motors. This along with the particular arrangement of the motors and the platforms yields a compact, durable, and vacuum compatible stage which has minimal mechanical vibrations, minimal interference with the charged particle microscope, minimal particle generation, and high speed area coverage.

Abstract: Methods of inspecting a microstructure comprise: applying charged particles to the wafer to negatively charge up the wafer over a region having contact or via holes, scanning a charged-particle beam over the region while detecting secondary particles so as to produce a detector signal, determining from the detector signal an apparent dimension of a contact hole, and comparing the apparent dimension of the contact hole with reference information to identify a defect. The reference information can be a conventional voltage-contrast image or can be design data indicating expected physical size of the contact hole and expected electrical connectivity of material within or beneath the contact hole. The wafer can be charged up by directing a flood of electrons toward a surface of the wafer and/or by controlling potential of an energy filter so as to direct secondary electrons back to the wafer while directing a charged-particle beam at the wafer.

Abstract: A method for detecting electrical defects in a semiconductor wafer, includes the steps of: a) applying charge to the wafer such that electrically isolated structures are raised to a voltage relative to electrically grounded structures; b) obtaining voltage contrast data for at least a portion of the wafer containing such structures using an electron beam; and c) analyzing the voltage contrast data to detect structures at voltages different from predetermined voltages for such structures. Voltage contrast data can take one of a number of forms. In a simple form, data for a number of positions on a line scan of an electron beam can be taken and displayed or stored as a series of voltage levels and scan positions. Alternatively, the data from a series of scans can be displayed as a voltage contrast image.