Patents by Inventor Wayne M. T. Wang

Wayne M. T. Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • POLYIMIDE RESINS FOR HIGH TEMPERATURE APPLICATIONS
    Publication number: 20130171391
    Abstract: Polyimide resin compositions that contain an aromatic polyimide, graphite, and acid-washed fibrous clay are found to exhibit high thermal oxidative stability. Such compositions are especially useful in molded articles that are exposed to high temperatures, such as bushings, bearings, and seal rings that are used in aerospace, transportation, and materials handling applications.
    Type: Application
    Filed: September 29, 2011
    Publication date: July 4, 2013
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: Susan H. Tilford, Yamaira Gonzales, Jesus G. Moralez, Wayne M. T. Wang
  • POLYIMIDE RESINS FOR HIGH TEMPERATURE APPLICATIONS
    Publication number: 20130171395
    Abstract: Polyimide resin compositions that contain an aromatic polyimide, graphite, and acid-washed kaolinite are found to exhibit high thermal oxidative stability. Such compositions are especially useful in molded articles that are exposed to high temperatures, such as bushings, bearings, and seal rings that are used in aerospace, transportation, and materials handling applications.
    Type: Application
    Filed: September 29, 2011
    Publication date: July 4, 2013
    Inventors: Yamaira Gonzalez, Jesus G. Moralez, Wayne M. T. Wang, Timothy D. Krizan