Abstract: The present development is an improved rheological additive for coating compositions comprising an organic solvent, a hydrocarbon wax thickener, and a dispersing agent. The dispersing agent is selected from oxidized, hyper-branched polyalphaolefins, polymeric amide-based hyperdispersants, and unsaturated fatty acids, and combinations thereof. The rheological additive can have a solids content of up to about 31 wt %. Further, these high solids content pourable additives can be prepare without adding water to the compositions.

Abstract: The present development an improved organoclay composition comprising a mixture of quaternary ammonium compounds, wherein varying ratios of dimethyl dialkyl ammonium compounds and trimethyl monoalkyl ammonium compounds are reacted with smectite clay. It has been surprisingly observed that using a mixture of these quaternary ammonium compounds results in an organoclay that has a lower organic content than conventional organoclays, but that maintains the ability to be filtered during the manufacturing process and that can be effectively dispersed in a non-aqueous system.

Abstract: The present development relates to an improved rheological additive for coating compositions comprising an aromatic organic solvent and an oxidized copolymer wax. An exemplary wax would be an oxidized ethylene-vinylacetate copolymer. The solvent is present at concentrations of from about 60 wt % about 90 wt % and the wax is present at concentrations of from about 10 wt % to about 40 wt %.

Abstract: Polishing of wafers, such as wafers of semiconductive material is carried out by mounting the wafer to a carrier, and pressing the wafer against a polishing pad carrying a polishing media. An antenna is placed beneath the polishing pad and electrical energization is applied between the carrier assembly and the antenna. The electrical energization preferably includes a direct current bias, but may also include ratio frequency carrier injection signal. The noise associated with ionic disassociation is monitored to assess ongoing polishing activity, on a real time basis.