Abstract: An ultrasonic cleaning tank for use in cleaning electronic parts having a top portion and a bottom portion operably divided by a perforated dispersion plate. The cleaning tank is assembled to avoid internal projections or obstructions within the top portion to create a piston-like, laminar flow region. The dispersion plate is constructed to provide a backpressure within the bottom portion so as to promote even flow of a cleaning fluid through the perforations. The cleaning fluid flows upward past an electronic part. At the same time, an ultrasonic transducer supplies ultrasonic energy within the cleaning fluid creating cavitation such that any particulate matter is scrubbed from the electronic parts. The particulates are subsequently carried upward by the laminar flow and over a tank lip. The cleaning tank can be used in either a batch or recirculating mode.

Abstract: An ultrasonic cleaning tank for use in cleaning electronic parts having a top portion and a bottom portion operably divided by a perforated dispersion plate. The cleaning tank is assembled to avoid internal projections or obstructions within the top portion to create a piston-like, laminar flow region. The dispersion plate is constructed to provide a backpressure within the bottom portion so as to promote even flow of a cleaning fluid through the perforations. The cleaning fluid flows upward past an electronic part. At the same time, an ultrasonic transducer supplies ultrasonic energy within the cleaning fluid creating cavitation such that any particulate matter is scrubbed from the electronic parts. The particulates are subsequently carried upward by the laminar flow and over a tank lip. The cleaning tank can be used in either a batch or recirculating mode.

Abstract: A bi-solvent cleaning system for cleaning precision components without the use of VOC solvents. The bi-solvent cleaning system provides for is a two mode operation for cleaning and rinsing precision components using VOC exempt solvents that is as effective as prior art VOC solvent based systems while subsequently allowing for recovery and reuse of a VOC exempt solvent.

Abstract: An ultrasonic cleaning tank for use in cleaning electronic parts having a top portion and a bottom portion operably divided by a perforated dispersion plate. The cleaning tank is assembled to avoid internal projections or obstructions within the top portion to create a piston-like, laminar flow region. The dispersion plate is constructed to provide a backpressure within the bottom portion so as to promote even flow of a cleaning fluid through the perforations. The cleaning fluid flows upward past an electronic part. At the same time, an ultrasonic transducer supplies ultrasonic energy within the cleaning fluid creating cavitation such that any particulate matter is scrubbed from the electronic parts. The particulates are subsequently carried upward by the laminar flow and over a tank lip. The cleaning tank can be used in either a batch or recirculating mode.

Abstract: An ultrasonic cleaning tank for use in cleaning electronic parts having a top portion and a bottom portion operably divided by a perforated dispersion plate. The cleaning tank is assembled to avoid internal projections or obstructions within the top portion to create a piston-like, laminar flow region. The dispersion plate is constructed to provide a backpressure within the bottom portion so as to promote even flow of a cleaning fluid through the perforations. The cleaning fluid flows upward past an electronic part. At the same time, an ultrasonic transducer supplies ultrasonic energy within the cleaning fluid creating cavitation such that any particulate matter is scrubbed from the electronic parts. The particulates are subsequently carried upward by the laminar flow and over a tank lip. The cleaning tank can be used in either a batch or recirculating mode.

Abstract: A chamber having selectable and controllable access through which a process part is placed within and removed from a processing system. The chamber is designed to selectively isolate the external and internal environments of the process system during delivery and removal of the process part.