Patents by Inventor Wayne P. Duncan, Jr.

Wayne P. Duncan, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Non-occluding mounting hole with solder pad for printed circuit boards
    Patent number: 4851614
    Abstract: A novel solder pad configuration for printed circuit boards is disclosed which is resistant to solder occlusion upon wave soldering. On the solder side of the circuit board the solder pad is substantially C-shaped and partially surrounds a non-plated through-hole. Via holes prvide electrical connection between the pad on the solder side of the board and the corresponding pad on the component side of the circuit boards. The invention is particularly applicable to the chassis ground mounting holes of PCB's.
    Type: Grant
    Filed: August 24, 1988
    Date of Patent: July 25, 1989
    Assignee: Compaq Computer Corporation
    Inventor: Wayne P. Duncan, Jr.