Abstract: A method (and structure) of manufacturing high power laser diode array modules provides multi kilowatts of power for a semiconductor-based laser. The method also provides an array module having lower flow requirements. The array module provides a controlled, closed environment for the arrays to operate within, as well as a back reflection shield behind the arrays, which yields protection between the array and the array module housing. The structure may include two different array module configurations, the first being one stackable array of one hundred and fifty laser diode bar packages, which includes a high-flow, low-pressure drop heatsink providing a large plenum size for the array, reducing turbulent flow and lowering the required pressure for the array. The second configuration is a multi-stringed array configuration, providing multi kilowatts of power within a shoebox-sized footprint, incorporating the high-flow, low-pressure drop end caps, providing smaller flow restrictions.