Abstract: A sputtering target assembly and a method for manufacturing are disclosed. The sputtering target assembly comprises a cylindrical sputtering target section having a length greater than approximately thirty-six inches and being comprised of one or more cylindrical ring targets; a cylindrical backing tube positioned inside of the cylindrical sputtering target; at least one electrically conductive shim that makes an electrical connection between the cylindrical sputtering target and the cylindrical backing tube; and an attachment layer comprised of an elastomer positioned between the cylindrical sputtering target and the cylindrical backing tube for attaching the cylindrical sputtering target to the cylindrical backing tube.

Abstract: An item, such as a sputtering target assembly or an electrostatic chuck, comprised of a first substrate; a metallization layer adhered to a surface of the first substrate; a second substrate; and an elastomer layer positioned between the metallization layer and the second substrate. In another embodiment, a debonding layer, such as a solder material, is positioned between the elastomer layer and the second substrate for allowing the item to be disassembled after use by heating the item up to the approximate melting point of the debonding layer.