Abstract: Interconnection apparatus is provided which is especially useful to mount and connect circuit boards having a contact assembly of resilient compressive contacts to a backplane or other mateable board or device. The apparatus includes an enclosure having guide channels for each board to be housed in the enclosure, a contact assembly for providing compressive contact between the contact ends of each board and corresponding contacts of the backplane, and elements for seating each board into engagement with the backplane.

Abstract: Interconnection apparatus is provided which is especially useful to mount and connect circuit boards having a contact assembly of resilient compressive contacts to a backplane or other mateable board or device. The apparatus includes an enclosure having guide channels for each board to be housed in the enclosure, a contact assembly for providing compressive contact between the contact ends of each board and corresponding contacts of the backplane, and elements for seating each board into engagement with the backplane.

Abstract: An improved securement device aligns adjacent printed circuit boards (“PCBs”) while simultaneously connecting all external hardware so as to prevent overcompression of elastomeric contacts positioned therebetween during assembly. The device supports a connector between a pair of PCBs in spaced parallel relation, wherein the connector itself supports a plurality of elastomeric contacts thereon for establishing electrical engagement between the PCBs. The PCBs and the connector each include aligned securement openings. The device includes an elongate fastener having a substantially cylindrical section positioned in the connector opening. The cylindrical section defines a pair of opposed, substantially planar spaced apart component landings for support of a similarly planar component thereupon. The landings are spaced apart a distance sufficient to place the PCBs in communication with the connector without overcompressing the elastomeric contacts therebetween.

Abstract: A high-speed connector for interconnecting circuit boards to a backplane or interconnecting a mother board to daughter board. The connector includes a housing, biasing elements, a flex film, conductive elastomeric contact modules and biasing modules. The conductive elastomeric contact modules comprise a substrate which includes a plurality of individual conductive elastomeric contacts such as Metallized Particle Interconnect (MPI), or a polymer containing a plurality of conductive particles disposed therein. The first side of the conductive elastomeric contact modules interface to the flex film, and the second side of the conductive elastomeric contact module interface to a printed circuit board (PCB) set of contacts. Alternately, the conductive elastomeric contacts could be molded directly onto the flex film to eliminate the conductive elastomeric contact modules.

Abstract: Several different types of electrical switches are disclosed. In one particular embodiment, an electrical switch is disclosed comprising: a molded case having a pair of conductive terminal contacts; and a molded actuator for mating with the case. The actuator is movable between a conducting position and a non-conducting position within the case, and the actuator has at least one spring member and a conductive contact surface. The spring member forces the actuator into the non-conducting position, and the conductive contact surface provides an electrical connection between the pair of conductive terminal contacts when the actuator is in the conducting position. The actuator is retained within the case by a retaining member and/or a snap member. The case and the actuator are molded about the conductive terminal contacts and the spring members, respectively. Furthermore, the conductive contact surface is formed of a conductive elastomer that is grafted to the actuator.

Abstract: The invention provides a socket for substrates such as single in-line memory modules, circuit boards, and similar components which are inserted into and rotated into fixed position on the socket. The socket housing includes end portions having improved structural integrity for externally mounting cooperative latch elements. The external mounting permits a greater variety of latch sizes and configurations to suit operational requirements. An exemplary latch is preferably metal and comprises a mounting collar having a compliant C-section which corresponds to a latch-receiving section or member on the socket housing, a detent for clasping a memory module, and a resilient section connected therebetween for biasing the detent so that it clasps the memory module in fixed position in the socket. The latch collar is mounted onto the cooperative section of the socket end portion, and the latch is thereby disposed exteriorly on the socket body.

Abstract: A test fixture for automatic testing equipment including short wire interface assembly which permits the interface assembly to be hard wired to a test head assembly with relative short interconnect wires. The interface SW assembly includes a base cover plate having a plurality of cavities formed therein, a plurality of individual interface strips having flexible vacuum seals affixed thereto and interface contacts disposed therethrough, and a plurality of floating captive contacts disposed in the base cover plate to provide mechanical and electrical interfacing between the interface contacts and spring-loaded probes electrically connected to the ATE. The individual interface strips are readily positionable adjacent the test head assembly and rotatable to facilitate hard wiring. The hard wired interface strips are suspended in respective cavities of the base cover plate with the flexible vacuum seals in contact with a surface of the base cover plate.

Abstract: An electrical test probe assembly for use with a leadless surface mounted device is provided which includes an array of resilient spring contacts in a pattern corresponding to the contacts of a leadless device. The array of spring contacts are configured to grip the peripheral edges of a surface mounted device, with each spring contact in biased engagement with a respective contact of the device.