Patents by Inventor Wayne S. Berry
Wayne S. Berry has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8724365Abstract: A programmable device includes a substrate (10); an insulator (13) on the substrate; an elongated semiconductor material (12) on the insulator, the elongated semiconductor material having first and second ends, and an upper surface S; the first end (12a) is substantially wider than the second end (12b), and a metallic material is disposed on the upper surface; the metallic material being physically migratable along the upper surface responsive to an electrical current I flowable through the semiconductor material and the metallic material.Type: GrantFiled: March 22, 2012Date of Patent: May 13, 2014Assignee: International Business Machines CorporationInventors: William R. Tonti, Wayne S. Berry, John A. Fifield, William H. Guthrie, Richard S. Kontra
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Publication number: 20120178239Abstract: A programmable device includes a substrate (10); an insulator (13) on the substrate; an elongated semiconductor material (12) on the insulator, the elongated semiconductor material having first and second ends, and an upper surface S; the first end (12a) is substantially wider than the second end (12b), and a metallic material is disposed on the upper surface; the metallic material being physically migratable along the upper surface responsive to an electrical current I flowable through the semiconductor material and the metallic material.Type: ApplicationFiled: March 22, 2012Publication date: July 12, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: William R. Tonti, Wayne S. Berry, John A. Fifield, William H. Guthrie, Richard S. Kontra
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Patent number: 8184465Abstract: A programmable device includes a substrate (10); an insulator (13) on the substrate; an elongated semiconductor material (12) on the insulator, the elongated semiconductor material having first and second ends, and an upper surface S; the first end (12a) is substantially wider than the second end (12b), and a metallic material is disposed on the upper surface; the metallic material being physically migratable along the upper surface responsive to an electrical current I flowable through the semiconductor material and the metallic material.Type: GrantFiled: October 25, 2010Date of Patent: May 22, 2012Assignee: International Business Machines CorporationInventors: William R. Tonti, Wayne S. Berry, John A. Fifield, William H. Guthrie, Richard S. Kontra
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Publication number: 20110032025Abstract: A programmable device includes a substrate (10); an insulator (13) on the substrate; an elongated semiconductor material (12) on the insulator, the elongated semiconductor material having first and second ends, and an upper surface S; the first end (12a) is substantially wider than the second end (12b), and a metallic material is disposed on the upper surface; the metallic material being physically migratable along the upper surface responsive to an electrical current I flowable through the semiconductor material and the metallic material.Type: ApplicationFiled: October 25, 2010Publication date: February 10, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: William R. Tonti, Wayne S. Berry, John A. Fifield, William H. Guthrie, Richard S. Kontra
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Patent number: 7872897Abstract: A programmable device includes a substrate (10); an insulator (13) on the substrate; an elongated semiconductor material (12) on the insulator, the elongated semiconductor material having first and second ends, and an upper surface S; the first end (12a) is substantially wider than the second end (12b), and a metallic material is disposed on the upper surface; the metallic material being physically migratable along the upper surface responsive to an electrical current I flowable through the semiconductor material and the metallic material.Type: GrantFiled: April 30, 2003Date of Patent: January 18, 2011Assignee: International Business Machines CorporationInventors: William R. Tonti, Wayne S. Berry, John A. Fifield, William H. Guthrie, Richard S. Kontra
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Patent number: 6674134Abstract: The present invention provides an integrated circuit which comprises a substrate having a plurality of device regions formed therein, said plurality of device regions being electrically isolated from each other by shallow trench isolation (STI) regions and said plurality of device regions each having opposing edges abutting its corresponding STI region; selected ones of said devices regions having a preselected first device width such that an oxide layer formed thereon includes substantially thicker perimeter regions, along said opposing edges, compared to a thinner central region that does not abut its corresponding STI region; and selected other ones of the device regions having a preselected device width substantially narrower in width than the first device width such that an oxide layer formed thereon includes perimeter regions, along opposing edges, that abut each other over its central region thereby preventing formation of a corresponding thinner central region.Type: GrantFiled: October 15, 1998Date of Patent: January 6, 2004Assignee: International Business Machines CorporationInventors: Wayne S. Berry, Jeffrey P. Gambino, Jack A. Mandelman, William R. Tonti
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Patent number: 6344383Abstract: The present invention provides an integrated circuit which comprises a substrate having a plurality of device regions formed therein, said plurality of device regions being electrically isolated from each other by shallow trench isolation (STI) regions and said plurality of device regions each having opposing edges abutting its corresponding STI region; selected ones of said devices regions having a preselected first device width such that an oxide layer formed thereon includes substantially thicker perimeter regions, along said opposing edges, compared to a thinner central region that does not abut its corresponding STI region; and selected other ones of the device regions having a preselected device width substantially narrower in width than the first device width such that an oxide layer formed thereon includes perimeter regions, along opposing edges, that abut each other over its central region thereby preventing formation of a corresponding thinner central region.Type: GrantFiled: October 20, 1999Date of Patent: February 5, 2002Assignee: International Business Machines CorporationInventors: Wayne S. Berry, Jeffrey P. Gambino, Jack A. Mandelman, William R. Tonti
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Publication number: 20010020724Abstract: The present invention provides an integrated circuit which comprises a substrate having a plurality of device regions formed therein, said plurality of device regions being electrically isolated from each other by shallow trench isolation (STI) regions and said plurality of device regions each having opposing edges abutting its corresponding STI region; selected ones of said devices regions having a preselected first device width such that an oxide layer formed thereon includes substantially thicker perimeter regions, along said opposing edges, compared to a thinner central region that does not abut its corresponding STI region; and selected other ones of the device regions having a preselected device width substantially narrower in width than the first device width such that an oxide layer formed thereon includes perimeter regions, along opposing edges, that abut each other over its central region thereby preventing formation of a corresponding thinner central region.Type: ApplicationFiled: October 15, 1998Publication date: September 13, 2001Inventors: WAYNE S. BERRY, JEFFREY P. GAMBINO, JACK A. MANDELMAN, WILLIAM R. TONTI
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Patent number: 6022796Abstract: Corner conduction in a conduction channel of a field effect transistor is controlled by the geometrical configuration of the gate oxide and gate electrode at the sides of the conduction channel. Rounding the corners of the conduction channel or forming depressions at edges of trench structures such as deep or shallow trench isolation structures and/or trench capacitors develop recesses in a surface of a substrate at an interface of active areas and trench structures in which a portion of the gate oxide and gate electrode are formed so that the gate oxide and gate electrode effectively wrap around a portion of the conduction channel of the transistor. Particularly when such transistors are formed in accordance with sub-micron design rules, the geometry of the gate electrode allows the electric field in the conduction channel to be modified without angled implantation to regulate the effects of corner conduction in the conduction channel.Type: GrantFiled: July 22, 1998Date of Patent: February 8, 2000Assignees: International Business Machines Corporation, Siemens AktiengesellschaftInventors: Wayne S. Berry, Juergen Faul, Wilfried Haensch, Rick L. Mohler
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Patent number: 5998852Abstract: Corner conduction in a conduction channel of a field effect transistor is controlled by the geometrical configuration of the gate oxide and gate electrode at the sides of the conduction channel. Rounding the corners of the conduction channel or forming depressions at edges of trench structures such as deep or shallow trench isolation structures and/or trench capacitors develop recesses in a surface of a substrate at an interface of active areas and trench structures in which a portion of the gate oxide and gate electrode are formed so that the gate oxide and gate electrode effectively wrap around a portion of the conduction channel of the transistor. Particularly when such transistors are formed in accordance with sub-micron design rules, the geometry of the gate electrode allows the electric field in the conduction channel to be modified without angled implantation to regulate the effects of corner conduction in the conduction channel.Type: GrantFiled: May 15, 1998Date of Patent: December 7, 1999Assignee: International Business Machines CorporationInventors: Wayne S. Berry, Juergen Faul, Wilfried Haensch, Rick L. Mohler
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Patent number: 5858866Abstract: Corner conduction in a conduction channel of a field effect transistor is controlled by the geometrical configuration of the gate oxide and gate electrode at the sides of the conduction channel. Rounding the corners of the conduction channel or forming depressions at edges of trench structures such as deep or shallow trench isolation structures and/or trench capacitors develop recesses in a surface of a substrate at an interface of active areas and trench structures in which a portion of the gate oxide and gate electrode are formed so that the gate oxide and gate electrode effectively wrap around a portion of the conduction channel of the transistor. Particularly when such transistors are formed in accordance with sub-micron design rules, the geometry of the gate electrode allows the electric field in the conduction channel to be modified without angled implantation to regulate the effects of corner conduction in the conduction channel.Type: GrantFiled: November 22, 1996Date of Patent: January 12, 1999Assignee: International Business Machines CorportationInventors: Wayne S. Berry, Juergen Faul, Wilfried Haensch, Rick L. Mohler
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Patent number: 5466626Abstract: The subject invention provides a method of forming recesses in a substrate such as a capacitor so as to increase the surface area thereof and therefore the charge storage capacity of the capacitor. This is accomplished by utilizing a micro mask formed by agglomeration on the surface of the substrate. The agglomerated material, such as gold, titanium nitride or titanium silicide, is used as a mask for selectively etching the substrate to form recesses therein. Alternatively, an oxide transfer mask can be utilized with the agglomerated material micro mask to etch the substrate.Type: GrantFiled: December 16, 1993Date of Patent: November 14, 1995Assignee: International Business Machines CorporationInventors: Michael Armacost, A. Richard Baker, Jr., Wayne S. Berry, Daniel A. Carl, Donald M. Kenney, Thomas J. Licata