Patents by Inventor Wayne Swart

Wayne Swart has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Carbonation of pH controlled KOH solution for improved polishing of oxide films on semiconductor wafers
    Patent number: 7040966
    Abstract: A method and polishing system for planarizing a substrate having one or more materials formed thereon. The method generally includes positioning the substrate in proximity with a polishing pad, dispensing a polishing fluid to the polishing pad, the polishing fluid being subjected to carbonation prior to being dispensed to the polishing pad, and polishing the substrate. The polishing system generally includes a polishing platen having a polishing pad disposed thereon and in proximity to the substrate, a controller configured to cause the polishing pad to contact the substrate, and a polishing fluid delivery system to deliver a polishing fluid to the polishing pad, the polishing fluid delivery system including a carbonation system.
    Type: Grant
    Filed: April 16, 2004
    Date of Patent: May 9, 2006
    Assignees: Applied Materials, International Business Machine Corporation
    Inventors: Joseph F. Salfelder, Wayne Swart, Gopalakrishna B. Prabhu, Srinivas R. Mirmira, Laertis Economikos, Fen Fen Jamin, Donald J. Delehanty, Daniel Heenan, Joseph M. Danza
  • Carbonation of pH controlled KOH solution for improved polishing of oxide films on semiconductor wafers
    Publication number: 20050042877
    Abstract: A method and polishing system for planarizing a substrate having one or more materials formed thereon. The method generally includes positioning the substrate in proximity with a polishing pad, dispensing a polishing fluid to the polishing pad, the polishing fluid being subjected to carbonation prior to being dispensed to the polishing pad, and polishing the substrate. The polishing system generally includes a polishing platen having a polishing pad disposed thereon and in proximity to the substrate, a controller configured to cause the polishing pad to contact the substrate, and a polishing fluid delivery system to deliver a polishing fluid to the polishing pad, the polishing fluid delivery system including a carbonation system.
    Type: Application
    Filed: April 16, 2004
    Publication date: February 24, 2005
    Inventors: Joseph Salfelder, Wayne Swart, Gopalakrishna Prabhu, Srinivas Mirmira, Laertis Economikos, Fen Jamin, Donald Delehanty, Daniel Heenan, Joseph Danza