Abstract: One aspect of the instant application provides techniques to reduce the amount of crosstalk on single-ended signals in the pin field region of an integrated circuit device on a printed circuit board (PCB). The PCB can include a plurality of layers and an array of vias comprising a plurality of rows configured to route signals across layers. An inner layer of the PCB can include first and second signal traces positioned between first and second adjacent rows of the vias, the first signal trace positioned adjacent to the first row and the second signal trace positioned adjacent to the second row. The first signal trace can include at least one curved segment that curves around a substantial portion of a corresponding via in the first row such that separation between the first and second signal traces varies along the curved segment.

Abstract: One aspect of the instant application provides techniques to reduce the amount of crosstalk on single-ended signals in the pin field region of an integrated circuit device on a printed circuit board (PCB). The PCB can include a plurality of layers and an array of vias comprising a plurality of rows configured to route signals across layers. An inner layer of the PCB can include first and second signal traces positioned between first and second adjacent rows of the vias, the first signal trace positioned adjacent to the first row and the second signal trace positioned adjacent to the second row. The first signal trace can include at least one curved segment that curves around a substantial portion of a corresponding via in the first row such that separation between the first and second signal traces varies along the curved segment.