Abstract: The present invention relates to a multilayered structure including at least one diamond layer and methods of making the multilayered structures. The multilayered structure includes a diamond layer having a top surface and a bottom surface, and when desired at least one metal filled via in the diamond layer, a first thin adhesion layer on the top surface, a second thin adhesion layer on the bottom surface, a first metal layer having a thermal conductivity greater than 200 W/m-K and a coefficient of thermal expansion greater than 12 ppm/K, wherein the first metal layer is deposited on the first thin adhesion layer, and a second metal layer having a thermal conductivity greater than 200 W/m-K and a coefficient of thermal expansion greater than 12 ppm/K, wherein the second metal layer is deposited on the second thin adhesion layer.

Abstract: The present invention relates to a multilayered structure including at least one diamond layer and methods of making the multilayered structures. The multilayered structure includes a diamond layer having a top surface and a bottom surface, and when desired at least one metal filled via in the diamond layer, a first thin adhesion layer on the top surface, a second thin adhesion layer on the bottom surface, a first metal layer having a thermal conductivity greater than 200 W/m-K and a coefficient of thermal expansion greater than 12 ppm/K, wherein the first metal layer is deposited on the first thin adhesion layer, and a second metal layer having a thermal conductivity greater than 200 W/m-K and a coefficient of thermal expansion greater than 12 ppm/K, wherein the second metal layer is deposited on the second thin adhesion layer.

Abstract: The present invention relates to a multilayered structure including at least one diamond layer and methods of making the multilayered structures. The multilayered structure includes a diamond layer having a top surface and a bottom surface, a first thin adhesion layer on the top surface, a second thin adhesion layer on the bottom surface, a first metal layer having a thermal conductivity greater than 200 W/m-K and a coefficient of thermal expansion greater than 12 ppm/K, wherein the first metal layer is deposited on the first thin adhesion layer, and a second metal layer having a thermal conductivity greater than 200 W/m-K and a coefficient of thermal expansion greater than 12 ppm/K, wherein the second metal layer is deposited on the second thin adhesion layer.

Abstract: The present invention relates to a multilayered structure including at least one diamond layer and methods of making the multilayered structures. The multilayered structure includes a diamond layer having a top surface and a bottom surface, a first thin adhesion layer on the top surface, a second thin adhesion layer on the bottom surface, a first metal layer having a thermal conductivity greater than 200 W/m-K and a coefficient of thermal expansion greater than 12 ppm/K, wherein the first metal layer is deposited on the first thin adhesion layer, and a second metal layer having a thermal conductivity greater than 200 W/m-K and a coefficient of thermal expansion greater than 12 ppm/K, wherein the second metal layer is deposited on the second thin adhesion layer.

Abstract: The present invention relates to a multilayered structure including at least one diamond layer and methods of making the multilayered structures. The multilayered structure includes a diamond layer having a top surface and a bottom surface, a first thin adhesion layer on the top surface, a second thin adhesion layer on the bottom surface, a first metal layer having a thermal conductivity greater than 200 W/m-K and a coefficient of thermal expansion greater than 12 ppm/K, wherein the first metal layer is deposited on the first thin adhesion layer, and a second metal layer having a thermal conductivity greater than 200 W/m-K and a coefficient of thermal expansion greater than 12 ppm/K, wherein the second metal layer is deposited on the second thin adhesion layer.

Abstract: The present invention relates to a multilayered structure including at least one diamond layer and methods of making the multilayered structures. The multilayered structure includes a diamond layer having a top surface and a bottom surface, a first thin adhesion layer on the top surface, a second thin adhesion layer on the bottom surface, a first metal layer having a thermal conductivity greater than 200 W/m-K and a coefficient of thermal expansion greater than 12 ppm/K, wherein the first metal layer is deposited on the first thin adhesion layer, and a second metal layer having a thermal conductivity greater than 200 W/m-K and a coefficient of thermal expansion greater than 12 ppm/K, wherein the second metal layer is deposited on the second thin adhesion layer.

Abstract: Seedlings are typically grown in trays of soil plugs. Once the seedlings have attained a predetermined size, they may be transplanted to the ground for continued seedling growth and development. Several machines are known in the art, which allow automated seedling transplantation. The present invention provides a device that significantly improves the accuracy of automated transplantation of seedlings. The device encompasses, at least in preferred aspects, a ski-like apparatus including a defined planting slot for receiving the seedlings to be planted. Furthermore, a blade extending in front of the device cuts open the ground in preparation for plantation. The configuration of the device enables seedlings to be planted accurately to a desired planting depth. The device is particularly suited for use in connection with coniferous tree seedlings, and enables automated transplantation of such seedlings at high speed.

Abstract: Seedlings are typically grown in trays of soil plugs. Once the seedlings have attained a predetermined size, they may be transplanted to the ground for continued seedling growth and development. Several machines are known in the art, which allow automated seedling transplantation. The present invention provides a device that significantly improves the accuracy of automated transplantation of seedlings. The device encompasses, at least in preferred aspects, a ski-like apparatus including a defined planting slot for receiving the seedlings to be planted. Furthermore, a blade extending in front of the device cuts open the ground in preparation for plantation. The configuration of the device enables seedlings to be planted accurately to a desired planting depth. The device is particularly suited for use in connection with coniferous tree seedlings, and enables automated transplantation of such seedlings at high speed.

Abstract: Seedlings are typically grown in trays of soil plugs. Once the seedlings have attained a predetermined size, they may be transplanted to the ground for continued seedling growth and development. Several machines are known in the art, which allow automated seedling transplantation. The present invention provides a device that significantly improves the accuracy of automated transplantation of seedlings. The device encompasses, at least in preferred aspects, a ski-like apparatus including a defined planting slot for receiving the seedlings to be planted. Furthermore, a blade extending in front of the device cuts open the ground in preparation for plantation. The configuration of the device enables seedlings to be planted accurately to a desired planting depth. The device is particularly suited for use in connection with coniferous tree seedlings, and enables automated transplantation of such seedlings at high speed.

Abstract: Seedlings are typically grown in trays of soil plugs. Once the seedlings have attained a predetermined size, they may be transplanted to the ground for continued seedling growth and development. Several machines are known in the art, which allow automated seedling transplantation. The present invention provides a device that significantly improves the accuracy of automated transplantation of seedlings. The device encompasses, at least in preferred aspects, a ski-like apparatus including a defined planting slot for receiving the seedlings to be planted. Furthermore, a blade extending in front of the device cuts open the ground in preparation for plantation. The configuration of the device enables seedlings to be planted accurately to a desired planting depth. The device is particularly suited for use in connection with coniferous tree seedlings, and enables automated transplantation of such seedlings at high speed.