Abstract: The present invention provides a system and method for packaging RFID device, in which a flexible mold with low surface energy having a mold cavity formed on a surface thereof is provided, an RFID device having RFID chip and antenna coupled thereto is then arranged in the mold cavity, a thermosetting material is filled in the mold cavity under a first atmospheric pressure produced by a pressure controlling device whereby the RFID device is completely covered by the thermosetting material, after that, the pressure controlling device provides a second atmospheric pressure higher than the first atmospheric pressure under a temperature lower than the curing temperature of the thermosetting material, and finally, the temperature is increased to the curing temperature under the second atmospheric pressure for curing the thermosetting material thereby forming an RFID package having the RFID device and the thermosetting material covered the RFID device.

Abstract: The present invention provides a system and method for packaging RFID device, in which a flexible mold with low surface energy having a mold cavity formed on a surface thereof is provided, an RFID device having RFID chip and antenna coupled thereto is then arranged in the mold cavity, a thermosetting material is filled in the mold cavity under a first atmospheric pressure produced by a pressure controlling device whereby the RFID device is completely covered by the thermosetting material, after that, the pressure controlling device provides a second atmospheric pressure higher than the first atmospheric pressure under a temperature lower than the curing temperature of the thermosetting material, and finally, the temperature is increased to the curing temperature under the second atmospheric pressure for curing the thermosetting material thereby forming an RFID package having the RFID device and the thermosetting material covered the RFID device.

Abstract: The present invention provides a radio frequency identification and sensing device comprising an antenna module, a RFID sensing module, and battery module. The antenna module has a first flexible substrate having an antenna circuit formed thereon. The RFID sensing module comprises a second flexible substrate, a RFID chip, a sensor formed on the second flexible substrate and a memory module formed on the second flexible substrate, wherein the sensor is utilized to detecting an environmental status for generating a plurality of sensing data, and the memory module is utilized to store the plurality of sensing data. The RFID chip is utilized to transfer the plurality of data to a reading device. The battery module is utilized to provide electrical power for operating the RFID sensing module.

Abstract: The present invention provides a radio frequency identification and sensing device comprising an antenna module, a RFID sensing module, and battery module. The antenna module has a first flexible substrate having an antenna circuit formed thereon. The RFID sensing module comprises a second flexible substrate, a RFID chip, a sensor formed on the second flexible substrate and a memory module formed on the second flexible substrate, wherein the sensor is utilized to detecting an environmental status for generating a plurality of sensing data, and the memory module is utilized to store the plurality of sensing data. The RFID chip is utilized to transfer the plurality of data to a reading device. The battery module is utilized to provide electrical power for operating the RFID sensing module.

Abstract: The present invention provides a radio frequency identification device comprising an antenna module and a substrate module. The antenna module has a flexible substrate having an antenna circuit forming thereon. A first surface of the flexible substrate further has a first and a second electrical connecting pads coupled to the antenna circuit, wherein the antenna circuit does not pass through a space between the first and second electrical connecting pads. The substrate module comprises a RFID chip and at least one passive element electrically coupled to a substrate having a pair of third electrical connecting pads. A conductive adhesive formed between the first and second electrical connecting pads and the third electrical connecting pads is utilized to couple the antenna module with the substrate module.