Patents by Inventor We Ming Te

We Ming Te has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HALOGEN-FREE PHOSPHOROUS EPOXY RESIN COMPOSITION
    Publication number: 20100048766
    Abstract: The present invention relates to a polyphosphate-containing halogen-free adhesive, primarily used as an adhesive. The composition comprising the polyphosphate group compounds which effectively meets the needs for environmental protection and flame retardancy, and the high flexibility and flame retardancy of the adhesive made it suitable for using on printed circuit board, especially the flexible printed circuit board.
    Type: Application
    Filed: February 22, 2007
    Publication date: February 25, 2010
    Inventors: Yu Hsain Cheng, We Ming Te, Gary Yonggang Min
  • HALOGEN-FREE PHOSPHOROUS EPOXY RESIN COMPOSITION
    Publication number: 20090018241
    Abstract: The present invention relates to a halogen-free phosphorous epoxy resin composition, primarily used as an adhesive for the printed circuit board. The composition comprises a halogen-free phosphorous contained epoxy resin which reduces the addition amount of additional flame retardant; in order to offer flame retardancy while maintaining high flexibility of flexible printed circuit board.
    Type: Application
    Filed: February 22, 2007
    Publication date: January 15, 2009
    Inventors: Yu Hsain Cheng, We Ming Te