Abstract: A semiconductor package includes a leadframe including a diepad and a first row of leads, wherein at least one lead of the first row of leads is physically separated from the diepad by a gap. The semiconductor package further includes a semiconductor component arranged on the leadframe. The semiconductor package further includes an encapsulation material encapsulating the leadframe and the semiconductor component, wherein the encapsulation material includes a bottom surface arranged at a bottom surface of the semiconductor package, a top surface and a side surface extending from the bottom surface to the top surface. A side surface of at least one lead of the first row of leads is flush with the side surface of the encapsulation material. The flush side surface of the at least one lead is covered by an electroplated metal coating.

Abstract: An electrical connection structure includes a first metallic lead having a first contact area, a second metallic lead having a second contact area, and a connection region connecting the first and second leads with each other. The connection region includes a trench. The trench includes a planar rectangular horizontal floor surface and vertical walls adjacent to the planar rectangular floor surface.

Abstract: A molded semiconductor package arrangement may comprise a die pad configured to support a semiconductor; a set of leads; and a mold structure that is formed to enclose the semiconductor and the die pad within the mold structure. The set of leads and the die pad may be formed from a same piece of conductive material. An electrical contact plane of the set of leads may be offset from a bottom surface of the die pad. The mold structure may include a molded standoff that is beneath the die pad. A bottom surface of the molded standoff may extend below the electrical contact plane of the set of leads by a threshold distance that corresponds to a thickness of the molded standoff.

Abstract: A molded semiconductor package arrangement may comprise a die pad configured to support a semiconductor; a set of leads; and a mold structure that is formed to enclose the semiconductor and the die pad within the mold structure. The set of leads and the die pad may be formed from a same piece of conductive material. An electrical contact plane of the set of leads may be offset from a bottom surface of the die pad. The mold structure may include a molded standoff that is beneath the die pad. A bottom surface of the molded standoff may extend below the electrical contact plane of the set of leads by a threshold distance that corresponds to a thickness of the molded standoff.

Abstract: An interconnect clip includes a die contact portion having substantially planar upper and lower surfaces that are parallel to and opposite from one another, a bridge portion adjoining the die contact portion and having substantially planar upper and lower surfaces that are parallel to and opposite from one another, a lead contact portion adjoining the bridge portion and having a lead contact surface or contact point, and a bridge portion adjoining the die contact portion and having substantially planar upper and lower surfaces that are parallel to and opposite from one another. The lower surface of the die contact portion extends along a first plane. The lower surface of the bridge portion extends along a second plane that is completely above the first plane throughout a complete length of the bridge portion. The lead contact surface or contact point is disposed below the first plane.

Abstract: A semiconductor package includes a carrier having a recess, a semiconductor die arranged on the carrier such that a first side of the semiconductor die faces the carrier, and a contact clip arranged over a second side of the semiconductor die, opposite the first side. The contact clip includes a lowered part. The lowered part is arranged in the recess.

Abstract: A leadless package includes an at least partially electrically conductive carrier having a mounting section and a lead section, an electronic chip mounted on the mounting section, and an encapsulant at least partially encapsulating the electronic chip and partially encapsulating the carrier so that at least part of an interior sidewall of the lead section not forming part of an exterior sidewall of the package is exposed.

Abstract: An interconnect clip includes a die contact portion having planar upper and lower surfaces, a bridge portion adjoining the die contact portion and having planar upper and lower surfaces, a lead contact portion adjoining the bridge portion and having first and second planar lower surfaces that form an angled intersection with one another at a contact point, a first transition surface extending transversely from the lower surface of the bridge portion, and a second transition surface extending transversely from the lower surface of the bridge portion. The lower surface of the die contact portion extends along a first plane. The lower surface of the bridge portion extends from the first transition surface to the second transition surface along a second plane that is completely above the first plane. The first lower surface of the lead contact portion is tilted relative to the first plane.

Abstract: An interconnect clip includes a die contact portion having substantially planar upper and lower surfaces that are parallel to and opposite from one another, a bridge portion adjoining the die contact portion and having substantially planar upper and lower surfaces that are parallel to and opposite from one another, a lead contact portion adjoining the bridge portion and having a lead contact surface or contact point, and a bridge portion adjoining the die contact portion and having substantially planar upper and lower surfaces that are parallel to and opposite from one another. The lower surface of the die contact portion extends along a first plane. The lower surface of the bridge portion extends along a second plane that is completely above the first plane throughout a complete length of the bridge portion. The lead contact surface or contact point is disposed below the first plane.

Abstract: A leadless package includes an at least partially electrically conductive carrier having a mounting section and a lead section, an electronic chip mounted on the mounting section, and an encapsulant at least partially encapsulating the electronic chip and partially encapsulating the carrier so that at least part of an interior sidewall of the lead section not forming part of an exterior sidewall of the package is exposed.

Abstract: A semiconductor chip package includes a semiconductor chip, an encapsulation body encapsulating the semiconductor chip, a chip pad, and electrical contact elements connected with the semiconductor chip and extending outwardly. The encapsulation body has six side faces and the electrical contact elements extend exclusively through two opposing side faces which have the smallest surface areas from all the side faces. The semiconductor chip is disposed on the chip pad, and a main face of the chip pad remote from the semiconductor chip is at least partially exposed to the outside.

Abstract: A strip of semiconductor devices includes a plurality of leadframes electrically isolated from each other, a plurality of semiconductor chips, and an encapsulation material. Each leadframe has a first surface and a second surface opposite to the first surface. At least one semiconductor chip of the plurality of semiconductor chips is electrically coupled to the first surface of each leadframe. The encapsulation material encapsulates each semiconductor chip and at least portions of each leadframe.

Abstract: A semiconductor device includes a leadframe and a semiconductor chip including a contact. The contact faces the leadframe and is electrically coupled to the leadframe via solder. The semiconductor device includes a solder barrier adjacent to the first contact and an edge of the chip.

Abstract: A semiconductor chip package includes a semiconductor chip, an encapsulation body encapsulating the semiconductor chip, a chip pad, and electrical contact elements connected with the semiconductor chip and extending outwardly. The encapsulation body has six side faces and the electrical contact elements extend exclusively through two opposing side faces which have the smallest surface areas from all the side faces. The semiconductor chip is disposed on the chip pad, and a main face of the chip pad remote from the semiconductor chip is at least partially exposed to the outside.