Patents by Inventor Wee Gan
Wee Gan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11742283Abstract: The present disclosure relates to semiconductor structures and, more particularly, to an integrated thin film resistor with a memory device and methods of manufacture. The structure includes a memory device in back end of line (BEOL) materials and a thin film resistor located in the BEOL materials. The thin film resistor includes electrical resistive material, and an insulator material over the electrical resistive material is thicker than insulator material over the memory device.Type: GrantFiled: December 31, 2020Date of Patent: August 29, 2023Assignee: GLOBALFOUNDRIES SINGAPORE PTE. LTD.Inventors: Kah Wee Gan, Benfu Lin, Yun Ling Tan
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Patent number: 11504279Abstract: Disclosed is a device for incision and insertion of a ventilation tube during myringotomy, comprising a cutter member configured to make an incision; a holder member configured to dispose the ventilation tube in an orientation in which a longitudinal axis of the ventilation tube is substantially perpendicular to the cutter member; and a pusher member configured to apply a pushing force to a first end of the ventilation tube in a direction substantially perpendicular to the longitudinal axis, the first end of the ventilation tube being disposed closer to the cutter member than a second end of the ventilation tube; wherein the holder member comprises a pivot element configured to releasably engage the second end of the ventilation tube such that the ventilation tube is pivotable under the pushing force applied to the first end of the ventilation tube by the pusher member, for insertion of the first end of the ventilation tube into the incision.Type: GrantFiled: September 13, 2018Date of Patent: November 22, 2022Assignee: National University of SingaporeInventors: Cailin Ng, Wenyu Liang, Kok Kiong Tan, Chee Wee Gan, Lynne Hsueh Yee Lim
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Publication number: 20220208675Abstract: The present disclosure relates to semiconductor structures and, more particularly, to an integrated thin film resistor with a memory device and methods of manufacture. The structure includes: a memory device in back end of line (BEOL) materials; and a thin film resistor located in the BEOL materials.Type: ApplicationFiled: December 31, 2020Publication date: June 30, 2022Inventors: Kah Wee GAN, Benfu LIN, Yun Ling TAN
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Patent number: 11335635Abstract: A semiconductor device is provided. A semiconductor device includes a first and a second region, a dielectric layer, a capping layer, and a planar resistive layer. The dielectric layer is arranged over the first and second regions and the capping layer is arranged over the dielectric layer. The capping layer has a substantially planar top surface over the first and second regions. The planar resistive layer is encapsulated within the capping layer in the first device region.Type: GrantFiled: April 8, 2020Date of Patent: May 17, 2022Assignee: GlobalFoundries Singapore Pte. Ltd.Inventors: Benfu Lin, Kah Wee Gan, Cing Gie Lim, Chengang Feng
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Publication number: 20210320063Abstract: A semiconductor device is provided. A semiconductor device includes a first and a second region, a dielectric layer, a capping layer, and a planar resistive layer. The dielectric layer is arranged over the first and second regions and the capping layer is arranged over the dielectric layer. The capping layer has a substantially planar top surface over the first and second regions. The planar resistive layer is encapsulated within the capping layer in the first device region.Type: ApplicationFiled: April 8, 2020Publication date: October 14, 2021Inventors: BENFU LIN, KAH WEE GAN, CING GIE LIM, CHENGANG FENG
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Publication number: 20210248844Abstract: A battery health diagnostic system is disclosed, wherein the battery health diagnostic system comprises a battery, the battery configured to be provided in a vehicle having a vehicle state; a sampling device in electrical communication with the battery and configured to acquire battery characteristic data during a vehicle state; a processor in communication with the device, the processer configured to analyze battery characteristic data to produce a battery condition output; and an alert device configured to provide the battery condition output during regular use of a vehicle.Type: ApplicationFiled: August 14, 2019Publication date: August 12, 2021Inventors: Mark D. GUNDERSON, Diego Hernan DIAZ MARTINEZ, Samuel F. FREEMAN, Chee Wee GAN, Julie C. ROBERTS, Thomas M. WATSON, Sepehr SHIRAZI, Ingo KOCH, Markus HOH, Briana KELLY
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Publication number: 20210161718Abstract: Disclosed is a device for incision and insertion of a ventilation tube during myringotomy, comprising a cutter member configured to make an incision; a holder member configured to dispose the ventilation tube in an orientation in which a longitudinal axis of the ventilation tube is substantially perpendicular to the cutter member; and a pusher member configured to apply a pushing force to a first end of the ventilation tube in a direction substantially perpendicular to the longitudinal axis, the first end of the ventilation tube being disposed closer to the cutter member than a second end of the ventilation tube; wherein the holder member comprises a pivot element configured to releasably engage the second end of the ventilation tube such that the ventilation tube is pivotable under the pushing force applied to the first end of the ventilation tube by the pusher member, for insertion of the first end of the ventilation tube into the incision.Type: ApplicationFiled: September 13, 2018Publication date: June 3, 2021Inventors: Cailin Ng, Wenyu Liang, Kok Kiong Tan, Chee Wee Gan, Lynne Hsueh Yee Lim
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Publication number: 20210028349Abstract: Integrated circuits and methods of producing the same are provided. In an exemplary embodiment, an integrated circuit includes a contact overlying a substrate, and a bottom electrode overlying the contact. The bottom electrode is in electrical communication with the contact, and the bottom electrode has a bottom electrode upper surface with a bottom electrode upper surface area. A magnetic tunnel junction memory cell overlies the bottom electrode and is in electrical communication with the bottom electrode. The magnetic tunnel junction memory cell has an MTJ bottom surface with an MTJ bottom surface area that is greater than the bottom electrode surface area.Type: ApplicationFiled: July 24, 2019Publication date: January 28, 2021Inventors: Kah Wee Gan, Benfu Lin, Chim Seng Seet
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Patent number: 10468457Abstract: Spin transfer torque magnetic random access memory structures, integrated circuits, and methods for fabricating integrated circuits are provided. An exemplary spin transfer torque magnetic random access memory structure has a perpendicular magnetic orientation, and includes a bottom electrode and a base layer over the bottom electrode. The spin transfer torque magnetic random access memory structure further includes a fixed layer over the base layer. The fixed layer includes anti-parallel layers including cobalt tungsten/platinum (CoW/Pt) bilayers, cobalt molybdenum/platinum (CoMo/Pt) bilayers, or bilayers including a combination of at least two materials selected from cobalt (Co), tungsten (W), molybdenum (Mo), platinum (Pt), palladium (Pd) or iridium (Ir). Also, the spin transfer torque magnetic random access memory structure includes a magnetic tunnel junction (MTJ) element with a perpendicular orientation over the fixed layer and a top electrode over the MTJ element.Type: GrantFiled: July 5, 2018Date of Patent: November 5, 2019Assignee: GLOBALFOUNDRIES SINGAPORE PTE. LTD.Inventors: Dinggui Zeng, Kah Wee Gan, Kazutaka Yamane
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Patent number: 10307296Abstract: In various embodiments, a device for inserting an implant on a human or animal body may be provided. The device may include an operable portion configured to make an incision on the human or animal body and configured to hold the implant for insertion on the human or animal body. The device may further include an actuator mechanism coupled to the operable portion, the actuator mechanism configured to move the operable portion along a first axis and configured to vibrate the operable portion along a second axis substantially perpendicular to the first axis.Type: GrantFiled: September 10, 2013Date of Patent: June 4, 2019Assignee: National University of SingaporeInventors: Kok Kiong Tan, Wenyu Liang, Phuong Pham Le, Sunan Huang, Hsueh Yee Lynne Lim, Chee Wee Gan
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Publication number: 20180233661Abstract: Device and methods of forming a device are disclosed. The method includes providing a substrate and forming a dielectric layer over the substrate. An alignment mark opening which extends through the dielectric layer is formed. A conductive layer is deposited over the dielectric layer. A planarization process is performed to remove excess conductive material on the dielectric layer and recess a top surface of the conductive material in the alignment mark opening with respect to the dielectric layer, forming an alignment mark of the device. A first electrode layer may be formed over the dielectric layer, wherein a topography of the dielectric layer and the alignment mark in the dielectric layer is transferred to the first electrode layer.Type: ApplicationFiled: February 15, 2017Publication date: August 16, 2018Inventors: Benfu LIN, Kah Wee GAN, Chim Seng SEET
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Patent number: 9842989Abstract: A magnetic memory having a base layer with a wetting layer and seed layer is disclosed. The wetting layer and seed layer promotes FCC structure along the (111) orientation to improve PMA. The seed layer includes first and second seed layer separated by a surface smoother, such as a surfactant layer. This enhances the smoothness of the seed layer, resulting in smoother interface in the MTJ stack, which leads to improved thermal endurance.Type: GrantFiled: February 29, 2016Date of Patent: December 12, 2017Assignee: GLOBALFOUNDRIES SINGAPORE PTE. LTD.Inventors: Taiebeh Tahmasebi, Kah Wee Gan, Chim Seng Seet
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Publication number: 20160276580Abstract: Magnetic tunnel junction (MTJ) storage unit of a memory cell and method of forming thereof are disclosed. The method includes forming a composite bottom electrode on a substrate. The substrate is prepared with a back end dielectric layer. The composite bottom electrode includes a first conductive electrode layer C1 having a first thickness tBE1 and a second conductive electrode layer C2 having a second thickness tBE2. The first and second conductive electrode layers form a bilayer C1/C2. The bilayer is provided to form the composite bottom electrode which enables thinner layers to form the composite bottom electrode. This results in reduced surface roughness to increase tunnel magnetoresistance (TMR) and thermal budget. The method further includes forming a MTJ element. The MTJ element includes a fixed layer and a free layer separated by a tunneling barrier layer. The method also includes forming a top electrode over the MTJ element.Type: ApplicationFiled: March 21, 2016Publication date: September 22, 2016Inventors: Taiebeh TAHMASEBI, Kah Wee GAN, Chim Seng SEET
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Publication number: 20160254444Abstract: A magnetic memory having a base layer with a wetting layer and seed layer is disclosed. The wetting layer and seed layer promotes FCC structure along the (111) orientation to improve PMA. The seed layer includes first and second seed layer separated by a surface smoother, such as a surfactant layer. This enhances the smoothness of the seed layer, resulting in smoother interface in the MTJ stack, which leads to improved thermal endurance.Type: ApplicationFiled: February 29, 2016Publication date: September 1, 2016Inventors: Taiebeh TAHMASEBI, Kah Wee GAN, Chim Seng SEET
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Patent number: 9318459Abstract: An integrated circuit package includes an integrated circuit die in a reconstituted substrate. The active side is processed then covered in molding compound while the inactive side is processed. The molding compound on the active side is then partially removed and solder balls are placed on the active side.Type: GrantFiled: November 19, 2014Date of Patent: April 19, 2016Assignee: STMicroelectronics Pte Ltd.Inventors: How Yuan Hwang, Kah Wee Gan
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Publication number: 20150351967Abstract: The present disclosure relates to ventilation tubes used in the treatment of aural maladies such as, for example, otitis media. A bio-absorbable ventilation tube, optionally containing a medicament, is described for use in a land mammal. The bio-absorbable ventilation tube can be customized for both specific treatment and specific degradation rate based in part on the quantity and type of medicament added to a polymer forming the bio-absorbable ventilation tube. A method of preparing the bio-absorbable ventilation tube of the present disclosure is also provided.Type: ApplicationFiled: September 30, 2013Publication date: December 10, 2015Applicants: National University of Singapore, Nanyang Technological UniversityInventors: Hsueh Yee Lynne LIM, Chee Wee GAN, Wai Hon CHOOI, Subramanian VENKATRAMAN, Herr Cheun Anthony NG, Yee Shan WONG
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Publication number: 20150238363Abstract: In various embodiments, a device for inserting an implant on a human or animal body may be provided. The device may include an operable portion configured to make an incision on the human or animal body and configured to hold the implant for insertion on the human or animal body. The device may further include an actuator mechanism coupled to the operable portion, the actuator mechanism configured to move the operable portion along a first axis and configured to vibrate the operable portion along a second axis substantially perpendicular to the first axis.Type: ApplicationFiled: September 10, 2013Publication date: August 27, 2015Applicant: National University of SingaporeInventors: Kok Kiong Tan, Wenyu Liang, Phuong Pham Le, Sunan Huang, Hsueh Yee Lynne Lim, Chee Wee Gan
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Publication number: 20150069607Abstract: An integrated circuit package includes an integrated circuit die in a reconstituted substrate. The active side is processed then covered in molding compound while the inactive side is processed. The molding compound on the active side is then partially removed and solder balls are placed on the active side.Type: ApplicationFiled: November 19, 2014Publication date: March 12, 2015Inventors: How Yuan Hwang, Kah Wee Gan
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Patent number: 8922013Abstract: An integrated circuit package includes an integrated circuit die in a reconstituted substrate. The active side is processed then covered in molding compound while the inactive side is processed. The molding compound on the active side is then partially removed and solder balls are placed on the active side.Type: GrantFiled: November 8, 2011Date of Patent: December 30, 2014Assignee: STMicroelectronics Pte Ltd.Inventors: How Yuan Hwang, Kah Wee Gan
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Patent number: 8916481Abstract: A process for manufacturing a 3D or PoP semiconductor package includes forming a redistribution layer on a reconstituted wafer, then laser drilling a plurality of apertures in the reconstituted wafer, extending from an outer surface of the reconstituted wafer to intersect electrical traces in the first redistribution layer. A solder ball is then positioned adjacent to an opening of each of the apertures. The solder balls are melted and allowed to fill the apertures, making contact with the respective electrical traces and forming a plurality of solder columns. The outer surface of the reconstituted wafer is then planarized, and a second redistribution layer is formed on the planarized surface. The solder columns serve as through-vias, electrically coupling the first and second redistribution layers on opposite sides of the reconstituted wafer.Type: GrantFiled: December 6, 2011Date of Patent: December 23, 2014Assignee: STMicroelectronics Pte Ltd.Inventors: Kah Wee Gan, Yaohuang Huang, Yonggang Jin