Abstract: The present invention relates to an FPC connector housing, more particular to a DDRS connector housing. The invention also relates to a method for producing the connector housing as well as to a cavity mold suitable for the production of the connector housing. The cavity mold comprises a double gating system with centrally positioned injection gates. The connector housing can be used in a connector for mounting on a flexible printed circuit (FPC) assembled in various kinds of electrical and/or electronic devices.

Abstract: In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed.

Abstract: Embodiments of the present disclosure are directed toward a pickhead for solder ball placement on an integrated circuit (IC) package, and associated systems and techniques. The pickhead may include a body having a bottom surface that defines a bottom plane of the pickhead. The pickhead may further include a plurality of cavities in the bottom surface to hold respective solder balls to be placed on the IC package. Individual cavities of the plurality of cavities may be recessed from the bottom surface by different recess amounts to provide different extensions of the solder balls with respect to the bottom plane. Other embodiments may be described and/or claimed.

Abstract: In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed.

Abstract: In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed.

Abstract: In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed.

Abstract: A social marketing network (5) for marketing digital content (6, 7, 8) the network (5) comprising: a first shop (10) to sell particular digital content (6, 7, 8); a plurality of second shops (15, 20, 25) to sell the particular digital content (6, 7, 8), the second shops (15, 20, 25) being affiliated to the first shop (10) and classified in levels relative to the first shop (10); wherein the particular digital content (6, 7, 8) is available for re-sale at any shop (10, 15, 20, 25) within the social marketing network (5) and the revenue earned by the first shop (10) is determined by a predetermined commission scale based on the level of the shop (10, 15, 20, 25) which sold the particular digital content (6, 7, 8) relative to the first shop (10).

Abstract: A B-subunit of a protein toxin selected from the B-subunit of E. coli heat-labile enterotoxin (EtxB) and the B-subunit of Vibrio cholerae toxin (CtxB) has a therapeutic effect against cell surface-expressed viral antigens and tumour antigens. In particular, the protein toxin may be used to treat an animal body, including human, suffering from a disease or condition associated with Epstein Barr Virus or suffering from neoplasia. The therapeutic agent may, additionally, comprise a cell surface-expressed antigen, for instance an Epstein Barr Virus latent membrane protein.