Patents by Inventor Wee Tay

Wee Tay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit substrate and method of manufacture
    Publication number: 20070120240
    Abstract: An aspect of the present invention comprises a method of producing a circuit substrate comprising providing a substrate, coating the substrate with a conductive layer, patterning the conductive layer to form at least two circuits joined by a buss-line and forming a slot in the substrate beneath the buss-line. Another aspect of the present invention comprises a circuit substrate with at least two circuits joined by a buss-line and a slot in the substrate beneath the buss-line. Another aspect of the present invention comprises an integrated circuit package with the described circuit substrate.
    Type: Application
    Filed: November 29, 2005
    Publication date: May 31, 2007
    Inventors: Siang Foo, Wee Tay, Wai Poon