Patents by Inventor Wee Yang ONG

Wee Yang ONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Single grooved polishing pad
    Patent number: 9421669
    Abstract: A polishing pad, an apparatus for chemical mechanical polishing of semiconductor wafers and a method of making a device using the same are presented. The apparatus includes a first platform for mounting a semiconductor wafer; a second platform for mounting a polishing pad; a rotator for rotating the wafer against the polishing pad; and a diamond dresser for dressing the polishing pad. The polishing pad has a single groove of a width (w) surrounding the periphery of an undressed portion of the polishing pad thus eliminating contact of the undressed portion with the outer edge of the diamond dresser.
    Type: Grant
    Filed: July 25, 2013
    Date of Patent: August 23, 2016
    Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
    Inventor: Wee Yang Ong
  • SINGLE GROOVED POLISHING PAD
    Publication number: 20140030958
    Abstract: A polishing pad, an apparatus for chemical mechanical polishing of semiconductor wafers and a method of making a device using the same are presented. The apparatus includes a first platform for mounting a semiconductor wafer; a second platform for mounting a polishing pad; a rotator for rotating the wafer against the polishing pad; and a diamond dresser for dressing the polishing pad. The polishing pad has a single groove of a width (w) surrounding the periphery of an undressed portion of the polishing pad thus eliminating contact of the undressed portion with the outer edge of the diamond dresser.
    Type: Application
    Filed: July 25, 2013
    Publication date: January 30, 2014
    Applicant: GLOBAL FOUNDRIES Singapore Pte. Ltd.
    Inventor: Wee Yang ONG