Abstract: A system for inspecting a component, such as a die formed on a silicon wafer, is provided. The system includes a two dimensional inspection system that can locate one or more features, such as bump contacts on the die, and which can also generate feature coordinate data. The system also includes a three dimensional inspection system that is connected to the two dimensional inspection system, such as through an operating system of a processor. The three dimensional inspection system receives the feature coordinate data and generates inspection control data.

Abstract: A system for inspecting components is provided. The system includes a light source illuminating a component feature so as to create a specular or non-lambertian reflection off the component feature. An image sensor is positioned to receive the specular or non-lambertian reflection and to generate point brightness data and point position data, such as for a point of light reflected off the component feature. A height measurement system receives the point brightness data and the point position data and generates feature height data.

Abstract: A computer vision apparatus and methods for automatically inspecting 2-dimensional (2D) and 3-dimensional (3D) criteria of objects using a single camera and laser sources. A camera views the object under inspection which is illuminated by a first source of light to highlight the region of interest. This provides image data for 2d analysis by a computer coupled to the system. Subsequently, multiple laser sources mounted on a positioner provide the illumination for collecting images for 3 dimensional analysis. A computer with a monitor is connected to the camera to perform the inspection and analysis and for operator supervision of the system. Specific implementations provided refer to embodiments for inspecting packaged semiconductor devices such as Ball-Grid Arrays (BGAs) packages and Quad Flat Packages (QFPs) packages for package mark inspection, package defect inspection, and solder ball or lead defects.

Abstract: A system for transporting and inspecting, seriatim, semiconductor devices with plural prong type or solder ball type leads includes a head for transporting the semiconductor devices from one support structure, such as a tray or tube, to a second support structure, such as a tray or tape, and wherein two dimensional and three dimensional measurements of the positional accuracy of the leads is carried out during the transport process. The inspection apparatus is interposed in the transport path and includes a first optical sensor such as a CCD camera oriented to capture a two dimensional image of the semiconductor device package and compare the image with a predetermined two dimensional image store in a central processing unit (CPU).

Abstract: A lead conditioning system (10) conditions leads (74) of electronic component package (30) and includes a rotary table (16) for holding electronic component package (30) and making accessible the leads (74). A conditioning tool (20) includes conditioner arm (34) and conditioner blade (70) that selectively contacts a predetermined number of the leads (74). A manipulator (22) moves conditioning tool (20) to positions that contact a predetermined number of leads (74) to condition leads (74). A control system (24) controls the operation of manipulator (22).

Abstract: Burr inspection system (120) inspects an electrical lead for a burr (112) in association with the operation of a machine vision lead inspection system (10) and includes machine vision circuitry (50) for forming an image (70) of the electrical lead (72) using machine vision lead inspection system (10). Edge detecting instructions (120) associate with machine vision circuitry (50) for determining a plurality of edges (89, 91) associated with the electrical lead (72). Scan line determining instructions (128) calculate a plurality of scan lines (88, 90) each corresponding to the contour of a selected one of the plurality of edges (89, 91). The scan lines (88, 90) are separated from edges (88, 90) and image (70) by a preselected distance (92). Inspecting circuitry (130) inspects each scan line (88, 90) to detect whether a burr image (112) crosses the scan line (88, 90) to determine the presence of a burr on the electrical lead.