Abstract: Pharmaceutical compositions and dosage forms of dimethyl fumarate containing low levels of certain impurities are disclosed.

Abstract: A graphene heat-dissipation LED lamp, comprising an LED light source module, a power supply module, a lamp housing (9) and a waterproof power strip (22). The LED light source module is connected to the power supply module by means of the power strip (22) to form an LED module assembly. A graphene heat-conducting material is added to the LED module, so that the heat conduction efficiency is improved and the service life is prolonged. In addition, the lighting performance of the LED lamp is further improved. By configuring independent modules and using a quick connector, the LED lamp can be quickly mounted without a disassembling tool.

Abstract: A rechargeable manganese battery includes: (1) a first electrode including a porous, conductive support; (2) a second electrode including a catalyst support and a catalyst disposed over the catalyst support; and (3) an electrolyte disposed between the first electrode and the second electrode to support reversible precipitation and dissolution of manganese at the first electrode and reversible evolution and oxidation of hydrogen at the second electrode.

Abstract: A package structure includes at least one semiconductor die, an insulating encapsulant, an isolation layer and a redistribution layer. The at least one first semiconductor die has a semiconductor substrate and a conductive post disposed on the semiconductor substrate. The insulating encapsulant is partially encapsulating the first semiconductor die, wherein the conductive post has a first portion surrounded by the insulating encapsulant and a second portion that protrudes out from the insulating encapsulant. The isolation layer is disposed on the insulating encapsulant and surrounding the second portion of the conductive post. The redistribution layer is disposed on the first semiconductor die and the isolation layer, wherein the redistribution layer is electrically connected to the conductive post of the first semiconductor die.

Abstract: A lighting bulb according to embodiments of the disclosure comprises a light source assembly, a base and a transparent top cap. The light source assembly has a carrier plate, a first plurality of light-emitting units and a second plurality of light-emitting units. The carrier plate has first and second surfaces. The base is for fixing the carrier plate to have the first surface facing to a first direction and the second surface facing to a second direction opposite to the first direction. The transparent top cap has an inner surface facing to a third direction perpendicular to the first and second directions. The first and second plurality of light-emitting units are located between the transparent top cap and the base.

Abstract: A compressed gas supplier has a power-free decompression device and an expansion chamber. The power-free decompression device decompresses a gas in a high-pressure source into a decompressed gas. The expansion chamber connects to the power-free decompression device and receives and stores the decompressed gas. The pneumatic tool is driven by the decompressed gas in the expansion chamber. Thus, the compressed gas supplier for the pneumatic tool is small and easy to be carry. In addition, the decompressed gas stored in the expansion chamber is also benefit for supplying decompressed gas to the pneumatic tool that needs much gas to drive.

Abstract: Methods and apparatus are disclosed for manufacturing metal contacts under ground-up contact pads within a device. A device may comprise a bottom metal layer with a bottom metal contact, a top metal layer with a top metal contact, and a plurality of middle metal layers. Any given metal layer of the plurality of middle metal layers comprises a metal contact, the metal contact is substantially vertically below the top metal contact, substantially vertically above the bottom metal contact, and substantially vertically above a metal contact in any metal layer that is below the given metal layer. The metal contacts may be of various and different shapes. All the metal contacts in the plurality of middle metal layers and the bottom metal contact may be smaller than the top metal contact, therefore occupying less area and saving more area for other functions such as device routing.

Abstract: A semiconductor device and method that utilize a surface device are provided. In an embodiment a fuse line comprises an underbump metallization which has two separate, electrically isolated parts. The two parts are bridged by an external connector, such as a solder ball in order to electrically connect the surface device. When, after testing, the surface device is determined to be defective, the fuse line may be disconnected by removing the external connector from the two separate parts, electrically isolating the surface device. In another embodiment the surface is located beneath a package within an integrated fan out package or is part of a multi-fan out package.

Abstract: Packages and packaging methods for semiconductor devices, and packaged semiconductor devices are disclosed. In some embodiments, a package for a semiconductor device includes a molding compound and a plurality of through-vias disposed in the molding compound. The package includes an interconnect structure disposed over the plurality of through-vias and the molding compound. The interconnect structure includes a metallization layer. The metallization layer includes a plurality of contact pads and a fuse.

Abstract: In some embodiments, an input device includes a housing having a top surface, a touch sensor disposed on the top surface of the housing, and a processor disposed in the housing. The touch sensor can be configured to detect a contact by a hand on the top surface of the housing and generate touch data corresponding to the detected contact by the hand. The processor can be configured to control operation of the touch sensor and receive the touch data, determine an orientation of the hand with respect to the housing based on the touch data, and calibrate a detected movement of the input device based on the determined orientation of the hand with respect to the housing. An image sensor and/or one or more IMUs can be used to detect 2D and/or 3D movement of the input device.

Abstract: Operations in fabricating a Fin FET include providing a substrate having a fin structure, where an upper portion of the fin structure has a first fin surface profile. An isolation region is formed on the substrate and in contact with the fin structure. A portion of the isolation region is recessed by an etch process to form a recessed portion and to expose the upper portion of the fin structure, where the recessed portion has a first isolation surface profile. A thermal hydrogen treatment is applied to the fin structure and the recessed portion. A gate dielectric layer is formed with a substantially uniform thickness over the fin structure, where the recessed portion is adjusted from the first isolation surface profile to a second isolation surface profile and the fin structure is adjusted from the first fin surface profile to a second fin surface profile, by the thermal hydrogen treatment.

Abstract: A semiconductor structure includes a substrate, a first semiconductor fin, a second semiconductor fin, and a first lightly-doped drain (LDD) region. The first semiconductor fin is disposed on the substrate. The first semiconductor fin has a top surface and sidewalls. The second semiconductor fin is disposed on the substrate. The first semiconductor fin and the second semiconductor fin are separated from each other at a nanoscale distance. The first lightly-doped drain (LDD) region is disposed at least in the top surface and the sidewalls of the first semiconductor fin.

Abstract: Embodiments of this application disclose a cross-standard scheduling method and a base station, used for unified scheduling of UEs in different standards by using a unified scheduler, to achieve space division multiplexing of a spectrum resource, where different standards may share the spectrum resource. A unified scheduler is disposed in the base station in the embodiments of this application. The method and the base station may obtain downlink channel information of UEs operating using different standards and in overlapping coverage range. The method and the base station may determine a scheduling result using the unified scheduler based on the obtained downlink channel information of the UEs. The method and the base station may schedule the UEs based on the scheduling result.

Abstract: A method of handling communication for a communication device of a wireless communication system, wherein the communication device is configured with a plurality of frequency bands, includes the step of: receiving a downlink (DL) control signal from a network of the wireless communication system via a first frequency band among the plurality of frequency bands, wherein the DL control signal indicates whether at least one of the plurality of frequency bands is available or not available.

Abstract: A training and application method for a neural network model is provided. The training method determines the first network model to be trained and sets a downscaling layer for at least one layer in the first network model, wherein the number of filters and filter kernel of the downscaling layer are identical to those of layers to be trained in the second network model. Filter parameters of the downscaling layer are transmitted to the second network model as training information. By this training method, training can also be performed even when the scale of the layer for training in the first network model is different from that of the layers to be trained in the second network model, and the amount of lost data is small.

Abstract: There is provided a capacitive communication system including an object and a capacitive touch panel. The object includes a plurality of induction conductors configured to have different potential distributions at different time intervals by modulating respective potentials thereof. The capacitive touch panel includes a plurality of sensing electrodes configured to form a coupling electric field with the induction conductors to detect the different potential distributions at the different time intervals. When the different potential distributions match a predetermined agreement between the object and the capacitive touch panel, a near field communication is formed between the object and the capacitive touch panel.

Abstract: Aspects of the present disclosure include methods and systems for detecting light from a sample in a flow stream by multi-photon counting. Methods according to certain embodiments include irradiating a sample in a flow stream with a light source and detecting light from the sample in the flow stream and counting photons of the detected light by integrating photo-electron charge over a time interval. Methods also include irradiating a sample in a flow stream with a light source, detecting light from the sample in the flow stream and outputting a digital output signal and an analog output signal produced by the detected light. Systems for detecting light from a sample in a flow stream with a detector and counting photons by integrating photo-electron charge over a time interval are also described. Kits having a detector, a photon counter and a flow cell configured to propagate a sample in flow stream are also provided.

Abstract: The present application relates to an electronic device and communication method in a wireless communication system. The device comprises a processing circuit configured to acquire user specific information of a plurality of user equipments communicating with the electronic device and set resource allocating parameters for non-orthogonal multiplex of a set of transmission resources based on the user specific information to apply to the sparse code multiple access of at least part of the user equipments. The user specific information includes channel status of channels between the user equipments and the electronic device.

Abstract: Packaged semiconductor devices and methods of packaging semiconductor devices are disclosed. In some embodiments, a packaged semiconductor device includes an integrated circuit die and a first interconnect structure coupled to the integrated circuit die. Through-vias are also coupled to the first interconnect structure. A molding material is disposed around the integrated circuit die and the through-vias over the first interconnect structure. The molding material has a pit disposed therein. A recovery material is disposed within the pit in the molding material. A second interconnect structure is disposed over the molding material, the recovery material, the integrated circuit die, and the through-vias.

Abstract: A movable carrier includes a main body, a first wheel, a driving module, a first support member, a second wheel, a seat, a first handle and two first switches. The first wheel is pivotally connected to the main body. The driving module is disposed in the main body. The first support member is connected to the driving module. The second wheel is pivotally connected to the first support member. The seat is disposed on the main body. The first handle is pivotally connected to the seat and has a trigger portion. The first switches are disposed on the seat. When the first handle rotates with respect to the seat and the trigger portion triggers the first switch, the driving module drives the first support member to rotate with respect to the main body, so as to increase or decrease a distance between the first wheel and the second wheel.