Patents by Inventor Wei-An HSIEH

Wei-An HSIEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11041708
    Abstract: An angle sensing device including a first object, a second object, a magnetic field source, and a first magnetic sensor is provided. The second object is adapted to be rotated with respect to the first object, so that an inclined angle of the second object with respect to the first object is changed. The magnetic field source is connected to the second object. The first magnetic sensor is connected to the first object, and configured to sense a magnetic field generated by the magnetic field source. When the second object is rotated with respect to the first object, the magnetic field sensed by the first magnetic sensor changes, so that an output signal of the first magnetic sensor corresponding to the magnetic field changes.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: June 22, 2021
    Assignee: iSentek Inc.
    Inventors: Wei-An Hsieh, Fu-Te Yuan, Yen-Chi Lee
  • Publication number: 20200132433
    Abstract: An angle sensing device including a first object, a second object, a magnetic field source, and a first magnetic sensor is provided. The second object is adapted to be rotated with respect to the first object, so that an inclined angle of the second object with respect to the first object is changed. The magnetic field source is connected to the second object. The first magnetic sensor is connected to the first object, and configured to sense a magnetic field generated by the magnetic field source. When the second object is rotated with respect to the first object, the magnetic field sensed by the first magnetic sensor changes, so that an output signal of the first magnetic sensor corresponding to the magnetic field changes.
    Type: Application
    Filed: October 2, 2019
    Publication date: April 30, 2020
    Applicant: iSentek Inc.
    Inventors: Wei-An Hsieh, Fu-Te Yuan, Yen-Chi Lee
  • Patent number: 10416566
    Abstract: A method to improve a lithographic process of imaging a portion of a design layout onto a substrate using a lithographic apparatus, the method including: computing a multi-variable cost function, the multi-variable cost function being a function a plurality of design variables that represent characteristics of the lithographic process; and reconfiguring one or more of the characteristics of the lithographic process by adjusting one or more of the design variables until a certain termination condition is satisfied; wherein a bandwidth of a radiation source of the lithographic apparatus is allowed to change during the reconfiguration.
    Type: Grant
    Filed: November 30, 2016
    Date of Patent: September 17, 2019
    Assignees: ASML NETHERLANDS B.V., CYMER, LLC
    Inventors: Willard Earl Conley, Wei-An Hsieh, Tsann-Bim Chiou, Cheng-Hsien Hsieh
  • Publication number: 20180356734
    Abstract: A method to improve a lithographic process of imaging a portion of a design layout onto a substrate using a lithographic apparatus, the method including: computing a multi-variable cost function, the multi-variable cost function being a function a plurality of design variables that represent characteristics of the lithographic process; and reconfiguring one or more of the characteristics of the lithographic process by adjusting one or more of the design variables until a certain termination condition is satisfied; wherein a bandwidth of a radiation source of the lithographic apparatus is allowed to change during the reconfiguration.
    Type: Application
    Filed: November 30, 2016
    Publication date: December 13, 2018
    Applicants: CYMER, LLC, ASML NETHERLANDS B.V.
    Inventors: Willard Earl CONLEY, Wei-An HSIEH, Tsann-Bim CHIOU, Jason SHIEN