Abstract: The present invention relates to the technical field of catalyst preparation, and discloses a preparation method of a Ziegler-Natta catalyst. The method includes the following steps: subjecting magnesium halide, alcohol and an electron donor to a first contact reaction in the presence of an inert solvent to obtain a magnesium halide alcoholate and performing first cooling; subjecting titanium halide to second cooling; subjecting the cooled titanium halide, the cooled product containing the magnesium halide alcoholate and an electron donor to a second contact reaction; filtering the product of the second contact reaction to obtain the Ziegler-Natta catalyst; and subjecting the Ziegler-Natta catalyst and the heated titanium halide to a third contact reaction. The method has the advantages such as short cycle, high efficiency, etc., being suitable to industrial production.

Abstract: A membrane structure includes a plurality of first refraction films and a plurality of second refraction films. The second refraction films and the first refraction films are alternately stacked. A transparent substrate including the membrane structure is disclosed. The membrane structure can effectively reduce the reflectance of light.

Abstract: A cooling system includes a control device, an ice water unit, a cooling tower, and an ice water storage tank. The ice water unit, the ice water storage tank, and the data center are coupled through a pipeline. According to a first condition, the ice water unit provides cooling water to the data center. According to a second condition, the ice water unit provides cooling water to the data center and the ice water storage tank. According to a third condition, the ice water storage tank provides cooling water to the data center and the ice water unit refills cooling water to the ice water storage tank, and heated water of the data center flows to the ice water unit.

Abstract: The present disclosure provides a wire and arc additive manufacturing (WAAM) method for a titanium alloy. The method includes the following steps: step 1: performing a WAAM process assisted by cooling and rolling; step 2: milling side and top surfaces of an additive part; step 3: performing, by friction stir processing (FSP) equipment, an FSP process on the additive part, and applying cooling and rolling to a side wall of the additive part through a cooling and rolling device during the FSP process; step 4: finish-milling the top surface of the additive part for a WAAM process in the next step; and step 5: repeating the above steps cyclically until final forming of the part is finished. This WAAM method completely breaks dendritic structures and refines grains in the WAAM process of the titanium alloy, thereby effectively repairing defects such as pores and cracks.

Abstract: New 2xxx aluminum alloys having are disclosed. The new 2xxx aluminum alloys generally include 2.5-3.9 wt. % Cu, 0.82-1.20 wt. % Li, 0.5-2.0 wt. % Zn, 0.10-0.60 wt. % Mn, 0.05-0.35 wt. % Mg, from 0.05 to 0.50 wt. % of at least one grain structure control element, wherein the at least one grain structure control element is selected from the group consisting of Zr, Sc, Cr, V, Hf, other rare earth elements, and combinations thereof, up to 0.22 wt. % Ag, up to 0.15 wt. % Fe, up to 0.12 wt. % Si, and up to 0.15 wt. % Ti, the balance being aluminum, incidental elements and impurities. The new 2xxx aluminum alloys may realize an improved combination of two or more of strength, fracture toughness, elongation, and corrosion resistance.

Abstract: Provided is an insulating coating device for an electric wire, including a pressing pipe. The pressing pipe includes two first pressing parts which are configured to divide the pressing pipe into two parts along a longitudinal cross section of the pressing pipe, an inner wall of the pressing pipe is provided with an air bag, and the air bag is provided with an air pipe joint which penetrates to an outside of the pressing pipe. In the insulating coating device for the electric wire, a self-curing insulating material is coated on joints of the electric wires, the air bag is used to squeeze the self-curing insulating material such that the self-curing insulating material is shaped and compacted, so that cavities generated in a coating process is reduced, and the self-curing insulating material is uniformly attached to the joints of the electric wires.

Abstract: A display panel includes a substrate, and a pixel defining layer and a cathode layer that are laminated on the substrate. The pixel defining layer includes a plurality of strip-shaped first pixel defining structures and a plurality of strip-shaped second pixel defining structures. A slope angle of the second pixel defining structure is greater than a slope angle of the first pixel defining structure, and the second pixel defining structure is configured to separate portions of the cathode layer on two sides of the second pixel defining structure.

Abstract: This application discloses a method for predicting an attribute of a target object based on machine learning and a related device, which belong to the field of data prediction technologies. According to the method, a global feature of the target object is determined based on a rule feature representing historical and future change rules of a detection feature, and the global feature is refined to obtain at least one local feature of the target object, so that the refined local feature can better reflect the feature of the target object, and the attribute of the target object is further predicted based on the local feature, thereby improving the precision of the predicted attribute. When the attribute of the target object is a predicted diagnosis result, the precision of the predicted diagnosis result can be improved.

Abstract: The present invention relates to a method and device for message transmission. The method comprises: when buffer overflow is found out, generating a request message, the request message carrying information related to a transmission rate; and sending the request message to a base station. The present invention solves a problem of buffer overflow by reducing the transmission rate and is particularly suitable for the buffer overflow condition caused by the unmatched transmission rate.

Abstract: A method for transmitting data includes: sending, by a server, a first message to a target terminal in response to determining that target data corresponding to the target terminal is long data, wherein the first message is intended to instruct the target terminal to enable a long data transmission mode before a first moment, and the long data is data untransmittable between a terminal and a gateway within one time slot; and sending, by the server, a second message to a first gateway, wherein the second message is intended to instruct the first gateway to enable the long data transmission mode before the first moment to receive the target data from the server, and the target data is sent to the target terminal from the first moment.

Abstract: A solid dosage form for injection and a method of making said dosage form wherein the dosage form has a moisture content of 5% (w/w) or less. The solid dosage form comprises a dried matrix including a first excipient and 0.01 to 50 (w/w) or more than 50% and up to 80% (w/w) of a therapeutic peptide; and one or more additional excipients and at least 5% (w/w) of CMC, based on the total weight of the solid dosage form, wherein the dosage form has a width of 0.5 mm to 2 mm.

Abstract: In an embodiment, a method of forming a semiconductor device includes forming a dummy gate stack over a substrate; forming a first spacer layer over the dummy gate stack; oxidizing a surface of the first spacer layer to form a sacrificial liner; forming one or more second spacer layers over the sacrificial liner; forming a third spacer layer over the one or more second spacer layers; forming an inter-layer dielectric (ILD) layer over the third spacer layer; etching at least a portion of the one or more second spacer layers to form an air gap, the air gap being interposed between the third spacer layer and the first spacer layer; and forming a refill layer to fill an upper portion of the air gap.

Abstract: An information handling system (IHS) may include a configuration sensor for sensing a physical configuration of the IHS, a first proximity sensor probe for sensing whether a first biological entity element is proximate to a first antenna, a second proximity sensor probe for sensing whether a second biological entity element is proximate to a second antenna, and a third proximity sensor probe for sensing whether a third biological entity element is proximate to a third antenna. The IHS is adapted to reconfigure use of at least two of the first antenna, the second antenna, and the third antenna in response to the sensing of at least one of the first proximity sensor probe, the second proximity sensor probe, and the third proximity sensor.

Abstract: A driver, a display device, and an optical compensation method thereof are provided. The display panel includes sub-pixels arranged in an array. The method includes: receiving an initial gray level of each sub-pixel of a picture to be displayed; determining whether each sub-pixel satisfies a preset determination condition based on the initial gray level of each sub-pixel; if an absolute value of a difference between the initial gray levels of two sub-pixels electrically connected to a same data line and located in two adjacent rows is greater than a preset threshold, it is determined that a sub-pixel in a next row satisfies the preset determination condition; and, in response to determining that a sub-pixel satisfies the preset determination condition, acquiring a first compensation parameter of the sub-pixel, and compensating the initial gray level of the sub-pixel based on the acquired first compensation parameter.

Abstract: A memory cell includes a thin film transistor over a semiconductor substrate. The thin film transistor includes a memory film contacting a word line; and an oxide semiconductor (OS) layer contacting a source line and a bit line, wherein the memory film is disposed between the OS layer and the word line; and a dielectric material separating the source line and the bit line. The dielectric material forms an interface with the OS layer. The dielectric material comprises hydrogen, and a hydrogen concentration at the interface between the dielectric material and the OS layer is no more than 3 atomic percent (at %).

Abstract: A drive device for an electric curtain is provided which comprises an integrally-formed plastic housing and a drawer frame which is disposed in the plastic housing; a drive motor and a control board are mounted on the drawer frame; in the drive device of the present invention, the integrally-formed plastic housing replaces the existing aluminum profile to solve the safety problems of short circuiting, electric conduction and firing due to aluminum scraps left in the housing; such that the entire external structure of the drive device has no section difference and color difference, and there is no broken joint formed at the connection with the plastic end cover, satisfying the market requirements. Furthermore, in the drive device, the drawer frame is slidably disposed in the plastic housing and the drive motor and the control board are supported on the drawer frame, facilitating device assembly and production efficiency.

Abstract: A method, a terminal, and a storage medium are provided for controlling a functional circuit. In the method, the terminal acquires sensor data information of a sensor. Further, the terminal wakes up the functional circuit in the terminal to receive an ultrasonic signal in response to determining that the acquired sensor data information meets a preset condition.

Abstract: The present disclosure provides a flexible organic light emitting diode display panel and a method for fabricating the same. The flexible organic light emitting diode display panel includes a substrate, a first inorganic layer doped with a soft metal, an organic layer, and a second inorganic layer doped with the soft metal. The substrate comprises a flexible substrate, a thin film transistor array and an organic light emitting diode device stacked in sequence from bottom to top. The first inorganic layer doped with a soft metal is disposed on the substrate. The organic layer is disposed on the first inorganic layer. The second inorganic layer doped with the soft metal is disposed on the organic layer. The present invention can improve bending performance of the flexible organic light emitting diode display panel.

Abstract: A circuit board includes first circuit substrate and second circuit substrate; first circuit substrate includes: a first base layer arranged on the first circuit layer and a plurality of first conductive bodies on the substrate layer; the first circuit layer includes a hot pressing area and a non-hot pressing area except the hot pressing area. One end of the first conductive body is electrically connected to the hot pressing area and the other end is exposed to the first base layer; second circuit substrate includes: a second base layer, a second base layer arranged on the second circuit layer and a plurality of second conductive bodies; one end of the second conductive body is electrically connected to the second circuit layer, and the other end is exposed on the second base layer; The body is electrically connected to the second conductive body.

Abstract: A card connector includes a transmission conductor assembly. The transmission conductor assembly includes a first conductor group and a second conductor group. The first conductor group includes a backup transmission conductor, first and second signal transmission conductors, an inspection signal transmission conductor, first to seventh grounding transmission conductors, a command reset transmission conductor, first to sixth differential transmission conductors, first and second power transmission conductors, and a write-protection transmission conductor, each of which has two ends respectively forming a spring section and a soldering section. The second conductor group includes eighth to tenth grounding transmission conductors, seventh to tenth differential transmission conductors, and a third power transmission conductor each of which has two ends respectively forming a spring section and a soldering section.