Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a fixed portion, a movable portion, a first driving assembly, and a positioning element. The movable portion is movably disposed on the fixed portion and comprises an optical element, wherein the optical element moves in the first direction. The first driving assembly is at least partially disposed on the fixed portion. The positioning element is rotatably disposed on the fixed portion or the movable portion, wherein when the first driving assembly is not activated, the positioning element is used to limit the position of the movable portion relative to the fixed portion to a limit position.

Abstract: A package includes a carrier substrate, a first die, and a second die. The first die includes a first bonding layer, a second bonding layer opposite to the first bonding layer, and an alignment mark embedded in the first bonding layer. The first bonding layer is fusion bonded to the carrier substrate. The second die includes a third bonding layer. The third bonding layer is hybrid bonded to the second bonding layer of the first die.

Abstract: Disclosed herein are novel cytotoxic compounds, and cytotoxic conjugates comprising these cytotoxic compounds and cell-binding agents. More specifically, this disclosure relates to novel camptothecin derivatives thereof, intermediates thereof, conjugates thereof, and pharmaceutically acceptable salts thereof, which are useful as medicaments, in particular as anti-proliferative agents (anticancer agents).

Abstract: The manufacturing method for ITO common electrode on CF substrate side of the present invention, after diving entire surface of the ITO film into multiple ITO blocks, performing a laser cutting again along the uniform film thickness portion at the periphery of the entire surface of the ITO film, and a laser cutting path at the uniform film thickness portion at the periphery of the entire surface of the ITO film form a closed pattern such that the connection of each ITO block at the uneven thickness portion of the periphery of the entire surface of the ITO film can be completely cut off, and the multiple ITO blocks located in the closed pattern constitute the ITO common electrode on the CF substrate side, thereby the insulation between the multiple ITO blocks is improved, ensuring that different ITO blocks can independently inputted with different Curing signals without affecting each other.

Abstract: Systems and methods for provisioning secure programmable logic devices (PLDs) are disclosed. An example secure PLD provisioning system includes an external system comprising a processor and a memory and configured to be coupled to a secure PLD through a configuration input/output (I/O) of the secure PLD. The external system is configured to generate a locked PLD comprising the secure PLD based, at least in part, on a request from a secure PLD customer, wherein the request from the secure PLD customer comprises a customer public key; and to provide a secured unlock package for the locked secure PLD. The external system may also be configured to provide an authenticatable key manifest comprising a customer programming key token and a corresponding programming public key associated with the locked secure PLD, wherein the authenticatable key manifest is signed using a programming private key generated by the locked secure PLD.

Abstract: A semiconductor device includes a first fin, a first continuous fin and continuous gates. The first fin is formed on a substrate, and includes first and second portions that are spaced apart by a first recess. A side of the first portion and a side of the second portion are located at two sides of the first recess, respectively. The first continuous fin is formed on the substrate, and extends along the first portion, the first recess and the second portion. The continuous gates are formed on the substrate, and arranged to intersect the first continuous fin and the first fin in a layout view. A first number of the continuous gates are disposed across the first recess and each of the first number of the continuous gates is disposed between the two sides of the first recess in a layout view. A method is also disclosed herein.

Abstract: A semiconductor device includes a gate structure, a source/drain, a first via that is disposed over the gate structure and the source/drain, and a first metal line having a more elevated vertical position than the first via in a cross-sectional view. The first via is electrically coupled to both the gate structure and the source/drain. The first metal line and the first via each extends in a first direction. A first distance separates the metal line from the via in a second direction different from the first direction. The first metal line includes a protruding portion that protrudes outwardly in the second direction.

Abstract: A system including neural network that use deep learning for object detection allows users to interact with images of their face and, in particular, interact with different face landmarks as an input channel for interaction with smart devices. That is, the face is employed as a touch surface for interactions with a device.

Abstract: Heteroaryl pyridone and aza-pyridone compounds are provided, including stereoisomers, tautomers, and pharmaceutically acceptable salts thereof, useful for inhibiting Btk kinase, and for treating immune disorders such as inflammation mediated by Btk kinase. Methods of using heteroaryl pyridone and aza-pyridone compounds for in vitro, in situ, and in vivo diagnosis, and treatment of such disorders in mammalian cells, or associated pathological conditions, are disclosed.

Abstract: In an approach for detecting key messages for a video, a processor builds a role model based on data from one or more data sources, with an identification feature of each role in a video. A processor samples a plurality of frames of the video. A processor identifies a key object presented in the plurality of frames. The key object is a role in the video. A processor recognizes a movement scenario associated with the role. A processor dynamically updates the role model based on the movement scenario. A processor identifies a role name based on the movement scenario. A processor generates a description script associated with the movement scenario for the role. A processor outputs the description script.

Abstract: A light emitting diode device includes a light emitting epitaxial layered structure and a current spreading layer formed on the light emitting epitaxial layered structure. The current spreading layer has a top surface and a bottom surface that are respectively distal from and proximal to the light emitting epitaxial layered structure, and a peripheral surface that interconnects the top surface and the bottom surface and that is formed with a first patterned structure. The peripheral surface and the bottom surface cooperatively define an interior angle included therebetween which is greater than 90° and smaller than 180°.

Abstract: Systems and methods for asset management for secure programmable logic devices (PLDs) are disclosed. An example system includes a secure PLD including programmable logic blocks (PLBs) arranged in PLD fabric of the secure PLD, and a configuration engine configured to program the PLD fabric according to a configuration image stored in non-volatile memory (NVM) of the secure PLD and/or coupled through a configuration input/output (I/O) of the secure PLD. The secure PLD is configured to receive a secure PLD asset access request from the PLD fabric or an external system coupled to the secure PLD through the configuration I/O, and to perform a secure PLD asset update process corresponding to the secure PLD asset access request, where the performing the asset update process is based on a lock status associated with a secure PLD asset corresponding to the secure PLD asset access request.

Abstract: A package substrate includes a substrate, an insulating protective layer and an interposer. The substrate has a first surface and a second surface opposing to the first surface. The substrate includes a plurality of first conductive pads embedded in the first surface. The insulating protective layer is disposed on the first surface of the substrate. The insulating protective layer has an opening for exposing the first conductive pads embedded in the first surface of the substrate. The interposer has a top surface and a bottom surface opposing to the top surface. The interposer includes a plurality of conductive vias and a plurality of second conductive pads located on the bottom surface. The interposer is located in a recess defined by the opening of the insulating protective layer and the first surface of the substrate. Each of the second conductive pads is electrically connected to corresponding first conductive pad.

Abstract: In one embodiment, a method includes receiving a trigger to dynamically modify a serving site of a communication endpoint, wherein the communication endpoint is registered to receive digital communication service from a first serving site. The method further includes determining a stored serving-site selection policy applicable to the communication endpoint. The method also includes selecting a second serving site for the communication endpoint based, at least part, on a stored serving-site selection policy. Also, the method includes determining endpoint-configuration requirements of the second serving site. Furthermore, the method includes dynamically generating endpoint configurations that satisfy the endpoint-configuration requirements of the second serving site. Moreover, the method includes writing the generated endpoint configurations to the communication endpoint.

Abstract: A backlight module is adapted to an illuminated keyboard. The backlight module includes a light source assembly and a light guide film. The light guide film has a top surface, a bottom surface, a through hole, a light-incident pattern and a light-exit pattern. The light source assembly includes a light-emitting component configured to emit light toward the through hole. A size of the through hole is smaller than a size of the light-emitting component. The light-incident pattern is located on at least one of the top surface and the bottom surface. The light-exit pattern is located on the bottom surface. A distance from the through hole to the light-exit pattern is greater than a distance from the through hole to the light-incident pattern.

Abstract: The invention provides compounds having the general Formula (I); and pharmaceutically acceptable salts thereof; wherein the variables RA, RAA, subscript n, subscript q, ring A, X2, L, subscript m, X1, R1, R2, R3, R4, R5, D and E have the meaning as described herein, and compositions containing such compounds and methods for using such compounds and compositions.

Abstract: Various examples are directed to systems and methods for searching application rules. A rule management system may access application rule data describing a first application rule and generate a first textual summary of the first application rule. The rule management system may encode the first textual summary to generate a first rule vector. The rule management system may receive a application rule query. The application rule query may include a query description. The rule management system may encode the query description to generate a first query vector and select the first application rule as responsive to the application rule query using the first rule vector and the first query vector. The rule management system may return the first application rule in response to the application rule query.

Abstract: A semiconductor device includes a gate structure disposed over a channel region, a source/drain epitaxial layer disposed at a source/drain region, a nitrogen containing layer disposed on the source/drain epitaxial layer, a silicide layer disposed on the nitrogen containing layer, and a conductive contact disposed on the silicide layer.

Abstract: A package structure including a first semiconductor die, a second semiconductor die, a molding compound, a bridge structure, through insulator vias, an insulating encapsulant, conductive bumps, a redistribution layer and seed layers is provided. The molding compound encapsulates the first and second semiconductor die. The bridge structure is disposed on the molding compound and electrically connects the first semiconductor die with the second semiconductor die. The insulating encapsulant encapsulates the bridge structure and the through insulator vias. The conductive bumps are electrically connecting the first and second semiconductor dies to the bridge structure and the through insulator vias. The redistribution layer is disposed on the insulating encapsulant and over the bridge structure. The seed layers are respectively disposed in between the through insulator vias and the redistribution layer.

Abstract: The present disclosure discloses a proportional valve body, a proportional valve and a manufacturing method for a proportional valve body. The proportional valve body comprises a body extending in an axial direction, the body being provided with a first cavity and a second cavity penetrating therethrough in the axial direction and isolated from each other; the body being further provided with a first through hole penetrating through an outer wall of the body, the first hole being communicated with the first cavity and isolated from the second cavity. In the present disclosure, the first cavity and the second cavity of the proportional valve body penetrate through the body in the axial direction, thus the general structure of the proportional valve body can be obtained by means of extrusion molding. Extrusion molding has the advantages of easy operation, high productivity, and high utilization ratio of raw materials.