Patents by Inventor Wei An

Wei An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210058889
    Abstract: This disclosure provides systems, methods and apparatuses for wireless communication that may allow a user equipment (UE) to determine its relative position and distances to other UEs more accurately than standard vehicle-to-everything (V2X) communications allow. In some implementations, a UE (or other wireless communication device) participating in a positioning operation may transmit and receive positioning signals on an unlicensed radio band, and may transmit and receive non-positioning signals on a V2X channel (or on another suitable channel) of a radio access network (RAN). The positioning signals may include positioning reference signals (PRSs) associated with observed time difference of arrival (OTDOA) positioning operations, ranging signals associated with round-trip time (RTT) positioning operations, or other suitable signals from which the position of the UE can be determined.
    Type: Application
    Filed: August 10, 2020
    Publication date: February 25, 2021
    Inventors: Xiaoxia ZHANG, Srinivas YERRAMALLI, Taesang YOO, Junyi LI, Yongbin WEI, Sudhir Kumar BAGHEL, Shailesh PATIL, Kapil GULATI, Chang-Sik CHOI
  • Publication number: 20210056249
    Abstract: A semiconductor cell structure includes four transistors, two gate-strips, four pairs of conductive segments, and a plurality of horizontal routing lines. Each of the two gate-strips intersects a first-type active zone and a second-type active zone. A first conductive segment is configured to have a first supply voltage. A second conductive segment is configured to have a second supply voltage. The first gate-strip is conductively connected to the second conductive segment. Each of the horizontal routing lines intersects one or more conductive segments over one or more corresponding intersections while conductively isolated from the one or more conductive segments at each of the one or more corresponding intersections.
    Type: Application
    Filed: October 27, 2020
    Publication date: February 25, 2021
    Inventors: Shun Li CHEN, Li-Chun TIEN, Ting Yu CHEN, Wei-Ling CHANG
  • Publication number: 20210052347
    Abstract: A smart marking system for a surgical video and a method thereof are disclosed. The image recognition is performed for each surgical video to generate object information corresponding to each surgical video. The object information is used as feature data of the surgical video corresponding thereto. After a video to be analyzed is loaded, eigenvalue analysis and statistics are performed according to the video to be analyzed and all the feature data to calculate a similarity rate between the video to be analyzed and each surgical video. A surgical name corresponding to the surgical video with the highest similarity rate is selected to mark as a surgical name corresponding to the video to be analyzed. The video to be analyzed and the surgical name corresponding thereto are stored in a database as the surgical video. Thus, the efficiency of marking the surgical videos is improved.
    Type: Application
    Filed: August 22, 2019
    Publication date: February 25, 2021
    Inventors: Wei Min LIU, Yu Chieh LEE, Yi Ta SHEN
  • Publication number: 20210057211
    Abstract: Methods and structures includes providing a substrate, forming a prelayer over a substrate, forming a barrier layer over the prelayer, and forming a channel layer over the barrier layer. Forming the prelayer may include growing the prelayer at a graded temperature. Forming the barrier layer is such that the barrier layer may include GaAs or InGaAs. Forming the channel layer is such that the channel layer may include InAs or an Sb-based heterostructure. Thereby structures are formed.
    Type: Application
    Filed: November 10, 2020
    Publication date: February 25, 2021
    Inventors: Hung-Wei Yu, Yi Chang, Tsun-Ming Wang
  • Publication number: 20210057206
    Abstract: A method includes providing a first plate including a first surface, a second surface opposite to the first surface, and a first recess indented from the first surface towards the second surface; providing a semiconductor structure including a third surface, a fourth surface opposite to the third surface, and a first sidewall extending between the third surface and the fourth surface; placing the semiconductor structure over the first plate; and disposing a priming material over the third surface of the semiconductor structure, wherein a peripheral portion of the fourth surface of the semiconductor structure is in contact with the first surface of the first plate upon the disposing of the priming material.
    Type: Application
    Filed: August 23, 2019
    Publication date: February 25, 2021
    Inventors: YUNG-YAO LEE, CHEN YI HSU, WEI-HSIANG TSENG
  • Publication number: 20210057902
    Abstract: A power protection method for an electronic device includes supplying power to an electronic device through a power supply path, detecting a positive current of the power path, detecting a negative current of the power path, comparing a current amount of the positive current with a current amount of the negative current, and disconnecting the power path when the current amount of the positive current is not equal to the current amount of the negative current.
    Type: Application
    Filed: August 23, 2019
    Publication date: February 25, 2021
    Inventors: Li-Shing Chen, Yng-Wei Lee
  • Publication number: 20210056481
    Abstract: A system and method are presented for generating staffing requirements for deferred work in a contact center environment. In an embodiment, a simulation of deferred work performance is used to generate staffing requirement. Information, such as volume offered, expected handle time, available staff distributed throughout the intervals over a period of time, etc., are utilized for determining service performance metrics. The simulation accounts for transient data (e.g., number of deferred work handled or completed, number of backlog from an interval to the next, starting number of deferred work in the system, etc.) and determines performance metrics using that transient data.
    Type: Application
    Filed: November 5, 2020
    Publication date: February 25, 2021
    Applicant: GENESYS TELECOMMUNICATIONS LABORATORIES, INC.
    Inventors: BAYU AJI WICAKSONO, ANDY RAPHAEL GOUW, WEI XUN TER
  • Publication number: 20210057559
    Abstract: An integrated circuit (IC) structure with a nanowire power switch device and a method of forming the IC structure are disclosed. The method includes forming a first layer of metal lines of a first back end of line (BEOL) interconnect structure and forming a semiconductor nanowire structure on a first metal line of the first layer of metal lines. The BEOL interconnect structure is formed on a front end of line (FEOL) device layer having multiple active devices. The method further includes forming a first dielectric layer wrapped around the semiconductor nanowire structure, forming a metal layer on the dielectric layer and on a second metal line of the first layer of metal lines, and forming a second layer of metal lines of a second BEOL interconnect structure on the semiconductor nanowire structure. The first and second metal lines are electrically isolated from each other.
    Type: Application
    Filed: August 23, 2019
    Publication date: February 25, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Li-Yang Chuang, Ching-Wei Tsai, Wang-Chun Huang, Kuan-Lun Cheng
  • Publication number: 20210057384
    Abstract: Semiconductor packages and methods of forming the same are provided. One of the semiconductor packages includes a first semiconductor die, an adhesive layer, a second semiconductor die and an underfill. The first semiconductor die includes a first surface, and the first surface includes a central region and a peripheral region surrounding the central region. The adhesive layer is adhered to the peripheral region and exposes the central region. The second semiconductor die is stacked over the first surface of the first semiconductor die. The underfill is disposed between the first semiconductor die and the second semiconductor die.
    Type: Application
    Filed: August 22, 2019
    Publication date: February 25, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chin-Fu Kao, Chih-Yuan Chien, Li-Hui Cheng, Szu-Wei Lu
  • Publication number: 20210058826
    Abstract: Various embodiments herein provide techniques for integrated access and backhaul (IAB) nodes. For example, embodiments include techniques associated with: rate-proportional routing for network coding; utilizing multiple routes in IAB networks; user equipment (UE) and parent selection for efficient topology in IAB networks; establishing efficient IAB topologies; and/or adaptive coded-forwarding for network coding. Other embodiments may be described and claimed.
    Type: Application
    Filed: September 8, 2020
    Publication date: February 25, 2021
    Inventors: Wei Mao, Murali Narasimha, Jaemin Han, Meryem Simsek, Hosein Nikopour, Sudeep Palat, Navid Naderializadeh
  • Publication number: 20210052364
    Abstract: The invention discloses a stent graft used for interventional treatment of abdominal aortic disease, comprising a tube body composed of a tubular covering and a plurality of annular stents, and the tube body comprises a first tube body and a second tube body that arranged in sequence from the proximal end to the distal end, wherein the diameter of the first tube body is greater than diameter of the second tube body; the first tube body and the second tube body are connected by a transition section as a whole; the diameter at central part of the transition section is smaller than the diameter of the proximal end of the transition section and the diameter of the distal end of the transition section; a plurality of fenestrations are disposed on the first tube body and the transition section.
    Type: Application
    Filed: December 27, 2018
    Publication date: February 25, 2021
    Inventors: Wei GUO, Yongsheng WANG, Anwei LI
  • Publication number: 20210058926
    Abstract: To configure an IAB node for DU function and MT function resource transitions within an IAB network, the processing circuitry is to detect using allocated resources, a plurality of resource transitions in adjacent slots between transmission or reception of data on a parent backhaul link. The processing circuitry determines based on sub-carrier spacing (SCS) associated with the allocated resources, a guard symbol table with a number of desired guard symbols for each of the plurality of resource transitions. The number of desired guard symbols are for insertion during the transmission or reception of the data on the parent backhaul link to avoid overlapping of the allocated resources for the parent backhaul link and allocated resources for the DU function during the plurality of resource transitions.
    Type: Application
    Filed: November 5, 2020
    Publication date: February 25, 2021
    Inventors: Qian Li, Lili Wei, Geng Wu
  • Publication number: 20210053966
    Abstract: The present invention belongs to the field of diagnosis and treatment of tumors, and relates to a HIF-2? small-molecule inhibitor and use thereof in treatment of tumors such as breast cancer and ovarian cancer. The small-molecule inhibitor is a compound represented by formula (I) or a stereoisomer, pharmaceutically acceptable salt, solvate or prodrug of the compound represented by formula (I). The small-molecule inhibitor mainly inhibits the proliferation of tumor cells by inhibiting HIF-2? protein, and can also inhibit the growth of CSCs with high expression of HIF-2?. The small-molecule inhibitor can be used as a novel anti-tumor drug to completely eliminate tumors and stem cells, and has broad application prospects.
    Type: Application
    Filed: January 25, 2019
    Publication date: February 25, 2021
    Inventors: MINJIE WEI, YUANYUAN YAN, MIAO HE, YINUO LIU, LIWEN ZHANG
  • Publication number: 20210057320
    Abstract: A method of preparing a package structure is provided, which includes providing a carrier plate including a supporting layer, a first release layer, and a first metal layer; forming a first dielectric layer over the first metal layer, the first dielectric layer having a plurality of holes, each of the holes having an end portion substantially coplanar with each other at a same plane; forming a plurality of conductive protrusions filling the holes, each of the conductive protrusions having a first end and a second end opposite thereto; forming a circuit layer structure including at least one circuit layer and at least one second dielectric layer, the circuit layer being connected to the second end, the second dielectric layer being disposed over the circuit layer; removing the carrier plate; and removing a portion of the first dielectric layer to expose the conductive protrusions. A package structure is also provided.
    Type: Application
    Filed: November 21, 2019
    Publication date: February 25, 2021
    Inventors: Fu-Yang Chen, Chun-Hsien Chien, Cheng-Hui Wu, Wei-Ti Lin
  • Publication number: 20210058786
    Abstract: Example authentication methods and apparatus are described. One example method is applied to an identity management entity, and the identity management entity is deployed in a core network control plane of a Long-Term Evolution (LTE) network. The method includes receiving a certificate request message from terminal equipment and generating a digital certificate for the terminal equipment. An identity request message carrying the digital certificate is sent to an identity proxy entity, where the identity proxy entity is deployed in a blockchain network, and the identity request message is used to obtain a blockchain identity for the terminal equipment.
    Type: Application
    Filed: November 5, 2020
    Publication date: February 25, 2021
    Inventors: Hui YANG, Jingwen NAN, Wei BAI, Yizhen WU
  • Publication number: 20210053033
    Abstract: The present disclosure provides a method for operating a three-way catalyst system at high temperatures. The method includes passing a high-temperature exhaust stream exiting an engine over a thermally stable three-way catalyst system including a metal oxide support; two or more catalytically active metals disposed on the support; and a porous metal oxide coating disposed on one or more exposed surfaces of the support. At least one of the catalytically active metals may be platinum (Pt). The method further includes reducing an amount of the nitrogen oxides (NOx), carbon monoxide (CO), and non-methane hydrocarbons (HCs) in an effluent stream exiting the thermally stable three-way catalyst system so that the effluent stream has a combined amount of nitrogen oxides (NOx) and non-methane hydrocarbons (HCs) of less than or equal to about 30 mg/mile and less than or equal to about 0.5 g/mile of carbon monoxide (CO).
    Type: Application
    Filed: August 21, 2019
    Publication date: February 25, 2021
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Gongshin QI, Wei LI, Se H. OH, Ming YANG
  • Publication number: 20210052719
    Abstract: An antigenic short peptide includes 11 to 15 amino-acid residues and has an ability to induce antibody against influenza virus. The sequence of the antigenic peptide is selected from hemagglutinin (HA). The antigenic peptide includes the sequence of JJ (SEQ ID NO:2), JJ-1 (SEQ ID NO:3), JJ-2 (SEQ ID NO:4), JJ-3 (SEQ ID NO:5) or JJ-4 SEQ ID NO:6). A method for inducing a broad-spectrum immunity against influenza viruses includes administering a vaccine to a subject, wherein the vaccine comprises one of the above antigenic peptide.
    Type: Application
    Filed: December 29, 2017
    Publication date: February 25, 2021
    Applicant: Development Center for Biotechnology
    Inventors: Jia-Ming CHANG, Wan-Jyun WEI
  • Publication number: 20210057247
    Abstract: Systems and methods are provided for determining defects in a semiconductor structure sample that is prepared for analysis by microscopy. A semiconductor structure sample preparation and analysis system includes a semiconductor structure sample that includes a structure, a protective capping layer on the structure, and a gap filler material on the protective capping layer. A microscopy apparatus acquires an image of the semiconductor structure sample. Sample defect recognition circuitry determines the presence of a defect in the semiconductor structure sample based on the acquired image.
    Type: Application
    Filed: August 23, 2019
    Publication date: February 25, 2021
    Inventors: Shih-Wei Hung, Jang Jung Lee
  • Publication number: 20210058995
    Abstract: A method for use in a wireless telecommunications network, the mobile telecommunications network comprising: a core network; base stations supported by the core network and each providing wireless connectivity within at least one base station cell where the cells are arranged into a master cell group under control of a master base station and a secondary cell group under control of a secondary base station; and a terminal device configured to communicate wirelessly with the base stations including by the use of a split radio bearer receivable at the secondary base station for splitting between the secondary base station and the master base station before delivery to the terminal device; the method comprising: when the secondary base station exhausts a supply of unique parameter sets used in security ciphering of received split radio bearers, the secondary base station sends a notification to the master base station of a requirement to alter data handling resources allocated for handling split radio bearers re
    Type: Application
    Filed: November 9, 2020
    Publication date: February 25, 2021
    Applicant: Sony Corporation
    Inventors: Vivek Sharma, Brian Alexander Martin, Yuxin Wei, Hideji Wakabayashi, Shinichiro Tsuda
  • Publication number: 20210054087
    Abstract: The present invention relates to antibodies, e.g., full length antibodies or antigen binding fragments thereof, that specifically bind to BCMA (B-Cell Maturation Antigen) and/or CD3 (Cluster of Differentiation 3). The invention also relates to antibody conjugates (e.g., antibody-drug-conjugates) comprising the BCMA antibodies, compositions comprising the BCMA antibodies, and methods of using the BCMA antibodies and their conjugates for treating conditions associated with cells expressing BCMA (e.g., cancer or autoimmune disease). The invention further relates to heteromultimeric antibodies that specifically bind to CD3 and a tumor cell antigen, (e.g., bispecific antibodies that specifically bind to CD3 and BCMA). Compositions comprising such heteromultimeric antibodies, methods for producing and purifying such heterodimeric antibodies, and their use in diagnostics and therapeutics are also provided.
    Type: Application
    Filed: August 27, 2020
    Publication date: February 25, 2021
    Applicant: PFIZER INC.
    Inventors: Tracy Chia-Chien KUO, Javier Fernando CHAPARRO RIGGERS, Wei CHEN, Amy Shaw-Ru CHEN, Edward Derrick PASCUA, Thomas John VAN BLARCOM, Leila Marie BOUSTANY, Weihsien HO, Yik Andy YEUNG, Pavel STROP, Arvind RAJPAL