Patents by Inventor Wei An

Wei An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12067717
    Abstract: A medical image analyzing system and a medical image analyzing method are provided and include inputting at least one patient image into a first model of a first neural network module to obtain a result having determined positions and ranges of an organ and a tumor of the patient image; inputting the result into a plurality of second models of a second neural network module, respectively, to obtain a plurality of prediction values corresponding to each of the plurality of second models and a model number predicting having cancer in the plurality of prediction values; and outputting a determined result based on the model number predicting having cancer and a number threshold value. Further, processes between the first model and the second models can be automated, thereby improving identification rate of pancreatic cancer.
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: August 20, 2024
    Assignee: National Taiwan University
    Inventors: Wei-Chung Wang, Wei-Chih Liao, Kao-Lang Liu, Po-Ting Chen, Po-Chuan Wang, Ting-Hui Wu
  • Patent number: 12069303
    Abstract: An encoder capable of properly handling an image to be encoded or decoded includes processing circuitry and memory connected to the processing circuitry. Using the memory, the processing circuitry: obtains parameters including at least one of (i) one or more parameters related to a first process for correcting distortion in an image captured with a wide angle lens and (ii) one or more parameters related to a second process for stitching a plurality of images; generates an encoded image by encoding a current image to be processed that is based on the image or the plurality of images; and writes the parameters into a bitstream including the encoded image.
    Type: Grant
    Filed: September 6, 2023
    Date of Patent: August 20, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA
    Inventors: Chong Soon Lim, Han Boon Teo, Takahiro Nishi, Tadamasa Toma, Ru Ling Liao, Sughosh Pavan Shashidhar, Hai Wei Sun
  • Patent number: 12067898
    Abstract: In one embodiment, an apparatus comprises a memory and a processor. The memory is to store sensor data, wherein the sensor data is captured by a plurality of sensors within an educational environment. The processor is to: access the sensor data captured by the plurality of sensors: identify a student within the educational environment based on the sensor data: detect a plurality of events associated with the student based on the sensor data, wherein each event is indicative of an attention level of the student within the educational environment: generate a report based on the plurality of events associated with the student; and send the report to a third party associated with the student.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: August 20, 2024
    Assignee: Intel Corporation
    Inventors: Shao-Wen Yang, Addicam V. Sanjay, Karthik Veeramani, Gabriel L Silva, Marcos P. Da Silva, Jose A. Avalos, Stephen T. Palermo, Glen J. Anderson, Meng Shi, Benjamin W. Bair, Pete A. Denman, Reese L. Bowes, Rebecca A. Chierichetti, Ankur Agrawal, Mrutunjayya Mrutunjayya, Gerald A. Rogers, Shih-Wei Roger Chien, Lenitra M. Durham, Giuseppe Raffa, Irene Liew, Edwin Verplanke
  • Patent number: 12068259
    Abstract: A semiconductor device package includes a substrate having a surface, a conductive element disposed on the surface of the substrate, and an encapsulant disposed on the surface of the substrate and covering the conductive element. The conductive element has an upper surface facing away from the substrate and exposed from the encapsulant. Further, a roughness of the upper surface of the conductive element is greater than a roughness of a side surface of the conductive element.
    Type: Grant
    Filed: March 14, 2023
    Date of Patent: August 20, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Wei Da Lin, Meng-Jen Wang, Hung Chen Kuo, Wen Jin Huang
  • Patent number: 12067690
    Abstract: An image processing method is provided. The method includes: encoding an input image based on an attention mechanism to obtain an encoding tensor set and an attention map set of the input image; obtaining an encoding result of the input image according to the encoding tensor set and the attention map set, the encoding result of the input image recording an identity feature of a human face in the input image; encoding an expression image to obtain an encoding result of the expression image, the encoding result of the expression image recording an expression feature of a human face in the expression image; and generating an output image according to the encoding result of the input image and the encoding result of the expression image, the output image having the identity feature of the input image and the expression feature of the expression image.
    Type: Grant
    Filed: October 8, 2021
    Date of Patent: August 20, 2024
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Tianyu Sun, Haozhi Huang, Wei Liu
  • Patent number: 12067643
    Abstract: Systems, methods, and non-transitory computer-readable media can obtain data associated with a computer-based experience. The computer-based experience can be based on interactive real-time technology. At least one virtual camera can be configured within the computer-based experience in an animation creation application. A plurality of shots that correspond to two-dimensional content can be generated from an edit cut of content captured by the at least one virtual camera in the animation creation application. Data associated with a two-dimensional version of the computer-based experience can be generated in a real-time engine based on the plurality of shots. The two-dimensional version can be rendered based on the generated data.
    Type: Grant
    Filed: October 22, 2020
    Date of Patent: August 20, 2024
    Assignee: Baobab Studios Inc.
    Inventors: Mikhail Stanislavovich Solovykh, Wei Wang, Nathaniel Christopher Dirksen, Lawrence David Cutler, Apostolos Lerios
  • Patent number: 12069772
    Abstract: A method of allocating resources in a mobile telecommunications system, the resources being for a relay node to operate as a terminal-to-terminal relay for a device-to-device communication between a first terminal and a second terminal. The method includes: allocating first resources for the first terminal to communicate via the relay node for the device-to-device communication; allocating second resources for the second terminal to communicate via the relay node for the device-to-device communication; notifying the first terminal of the allocated first resources; notifying the second terminal of the allocated second resources; and the first and second terminals exchanging messages for the device-to-device communication via the relay node and using the first and second resources, respectively.
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: August 20, 2024
    Assignee: SONY GROUP CORPORATION
    Inventors: Yuxin Wei, Hideji Wakabayashi, Shinichiro Tsuda
  • Patent number: 12068252
    Abstract: The present disclosure describes a method for the fabrication of ruthenium conductive structures over cobalt conductive structures. In some embodiments, the method includes forming a first opening in a dielectric layer to expose a first cobalt contact and filling the first opening with ruthenium metal to form a ruthenium contact on the first cobalt contact. The method also includes forming a second opening in the dielectric layer to expose a second cobalt contact and a gate structure and filling the second opening with tungsten to form a tungsten contact on the second cobalt contact and the gate structure. Further, the method includes forming a copper conductive structure on the ruthenium contact and the tungsten contact, where the copper from the copper conductive structure is in contact with the ruthenium metal from the ruthenium contact.
    Type: Grant
    Filed: July 28, 2022
    Date of Patent: August 20, 2024
    Inventors: Cheng-Wei Chang, Chien-Shun Liao, Sung-Li Wang, Shuen-Shin Liang, Shu-Lan Chang, Yi-Ying Liu, Chia-Hung Chu, Hsu-Kai Chang
  • Patent number: 12069644
    Abstract: The embodiments of the present disclosure provide a method for transmitting data, a base station, a terminal, a system, and a computer-readable storage medium. In the method for transmitting data, a base station sends control information to a terminal over a PDCCH, starts to receive a feedback signal which is sent by the terminal after decoding the control information, and sends information to the terminal after receiving the feedback signal.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: August 20, 2024
    Assignee: XI'AN ZHONGXING NEW SOFTWARE CO., LTD.
    Inventors: Minggang Gao, Qingyu Ni, Xuemei Ding, Mingye Wei
  • Patent number: 12068411
    Abstract: A semiconductor device includes: a substrate having a groove formed on a main surface; a drift region of a first conductivity type, the drift region having a portion disposed at a bottom part; a well region of a second conductivity type, the well region being disposed in one sidewall to be connected to the drift region; a first semiconductor region of the first conductivity type, the first semiconductor region being disposed on a surface of the well region in the sidewall to be away from the drift region; a second semiconductor region of the first conductivity type, the second semiconductor region being disposed to be opposed to the well region via the drift region; and a gate electrode opposed to the well region, the gate electrode being disposed in a gate trench that has an opening extending over the upper surfaces of the well region and the first semiconductor region.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: August 20, 2024
    Assignees: NISSAN MOTOR CO., LTD., RENAULT S. A. S.
    Inventors: Toshiharu Marui, Tetsuya Hayashi, Keiichiro Numakura, Wei Ni, Ryota Tanaka, Keisuke Takemoto
  • Patent number: 12069375
    Abstract: A multi-channel video recording method comprises: starting, by an electronic device, a camera; acquiring images by using a first camera lens and a second camera lens in a plurality of camera lenses; displaying a preview interface, where the preview interface includes a first image and a second image; the first image is an image acquired by the first camera lens, the second image is from the second camera lens, and the second image corresponds to a central area of an image acquired by the second camera lens; and the first image is located in a first area in the preview interface, and the second image is located in a second area in the preview interface; starting video recording after detecting a video recording instruction operation of a user; and displaying a shooting screen, where the shooting screen includes the first area and the second area.
    Type: Grant
    Filed: August 18, 2023
    Date of Patent: August 20, 2024
    Assignee: HONOR DEVICE CO., LTD.
    Inventors: Yuanyou Li, Wei Luo, Jieguang Huo
  • Patent number: 12069882
    Abstract: The present disclosure provides an organic light emitting display panel and an organic light emitting display apparatus. The organic light emitting display panel includes an array substrate, a color filter substrate and a transparent filling layer; the array substrate includes a substrate and an organic light emitting layer and a thin film encapsulation layer sequentially formed on the substrate, and the color filter substrate includes a cover plate and a color filter layer and an organic protective layer sequentially formed on the cover plate; the array substrate and the color filter substrate are disposed opposite to each other, the organic light emitting layer includes a plurality of OLED pixel units, the color filter layer includes a plurality of color-resist units; wherein, the transparent filling layer is disposed in a gap between the array substrate and the color filter substrate for reducing light deflection.
    Type: Grant
    Filed: December 15, 2021
    Date of Patent: August 20, 2024
    Assignee: Everdisplay Optronics (Shanghai) Co., Ltd.
    Inventors: Yanhu Li, Biming Wei, Huan Zheng, Wei Liu, Liang Xu, Hsin Chih Lin, Haiyan Hao
  • Patent number: 12067977
    Abstract: The present disclosure discloses a speech recognition method and apparatus, and relates to the field of speech and deep learning technologies. A specific implementation scheme involves: acquiring candidate recognition results with first N recognition scores outputted by a speech recognition model for to-be-recognized speech, N being a positive integer greater than 1; scoring the N candidate recognition results based on pronunciation similarities between candidate recognition results and pre-collected popular entities, to obtain similarity scores of the candidate recognition results; and integrating the recognition scores and the similarity scores of the candidate recognition results to determine a recognition result corresponding to the to-be-recognized speech from the N candidate recognition results. The present disclosure can improve recognition accuracy.
    Type: Grant
    Filed: March 2, 2022
    Date of Patent: August 20, 2024
    Assignee: BEIJING BAIDU NETCOM SCIENCE TECHNOLOGY CO., LTD.
    Inventors: Liao Zhang, Yinlou Zhao, Zhengxiang Jiang, Xiaoyin Fu, Wei Wei
  • Patent number: 12067935
    Abstract: A display compensating method, display compensating device, and display device are provided, which relates to field of display and addresses the issues of poor screen uniformity, grayscale relationship change of sub-pixel due to ambient temperature change, and display screen brightness affected by ageing offset of threshold voltage corresponding to the sub-pixel. The display compensating method is applied to the display device, including: converting a received grayscale signal into a brightness signal; performing an optical compensation on a display brightness of the display device based on the brightness signal; converting a corresponding brightness signal on which the optical compensation is performed into a voltage signal; compensating for a threshold voltage corresponding to each sub-pixel in the display device based on the voltage signal; and compensating for operating parameters of the display device for the display device at different operating temperatures.
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: August 20, 2024
    Assignees: Beijing BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Yifan Hou, Tiankuo Shi, Zhihua Ji, Xiaomang Zhang, Xin Duan, Wei Sun, Tao Yang, Chenxi Zhao, Xiangjun Peng, Shuo Zhang, Minglei Chu, Yan Sun, Yanhui Xi
  • Patent number: 12066670
    Abstract: An optical module includes a shell, a circuit board, at least one of a light-transmitting chip or a light-receiving chip, a lens assembly, an optical fiber ferrule assembly and a fixing plate. The circuit board is disposed in the shell. The light-transmitting chip and/or the light-receiving chip is disposed on the circuit board. The lens assembly is disposed on the circuit board, covers the light-transmitting chip and/or the light-receiving chip, and is configured to change a propagation direction of an optical signal incident into the lens assembly. The optical fiber ferrule assembly is connected to the lens assembly, and is configured to transmit an optical signal incident into the optical fiber ferrule assembly. The fixing plate is configured to fix the optical fiber ferrule assembly to the lens assembly.
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: August 20, 2024
    Assignee: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.
    Inventors: Wei Cui, Xuxia Liu, Baofeng Si, Xiaolei Ma, Sigeng Yang
  • Patent number: 12067267
    Abstract: A system includes a semiconductor device configured to store data and a controller communicatively coupled to the semiconductor device. The semiconductor device and the controller are configured to; in response to determining that particular data stored in the semiconductor device satisfies a reliability condition, obtain first readout data by reading the particular data at a first read voltage, and obtain second readout data by reading the particular data at a second read voltage. The second read voltage is different from the first read voltage. The semiconductor device and the controller are configured to compare the first readout data and the second readout data and obtain a comparison result; and, based on the comparison result, determine whether to perform an error correction process on the particular data.
    Type: Grant
    Filed: December 16, 2022
    Date of Patent: August 20, 2024
    Assignee: Macronix International Co., Ltd.
    Inventors: Shih-Chou Juan, Wei-Yan Jang
  • Patent number: 12068167
    Abstract: A method includes patterning a mandrel layer over a target layer to form first mandrels and second mandrels, the first mandrels having a larger width than the second mandrels. A spacer layer is formed over the first mandrels and the second mandrels, and altered so that a thickness of the spacer layer over the first mandrels is greater than a thickness of the spacer layer over the second mandrels. Spacers are formed from the spacer layer which have a greater width adjacent the first mandrels than the spacers which are adjacent the second mandrels. The spacers are used to etch a target layer.
    Type: Grant
    Filed: May 12, 2023
    Date of Patent: August 20, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Kuan-Wei Huang, Yu-Yu Chen, Jyu-Horng Shieh
  • Patent number: 12068218
    Abstract: A package structure includes a semiconductor package, a thermal conductive gel, a thermal conductive film and a heat spreader. The thermal conductive gel is disposed over the semiconductor package. The thermal conductive film is disposed over the semiconductor package and the thermal conductive gel. A thermal conductivity of the thermal conductive film is different from a thermal conductivity of the thermal conductive gel. The thermal conductive film is surrounded by the heat spreader.
    Type: Grant
    Filed: February 7, 2022
    Date of Patent: August 20, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Pu Wang, Chin-Fu Kao, Szu-Wei Lu
  • Patent number: 12064268
    Abstract: A method for medical imaging is provided. The method may include automatically determining that a positioning procedure of a subject has been finished based on image data of the subject captured by an image capturing device. The method may also include obtaining status information of a medical device. The method may further include causing the medical device to perform a scan on the subject based on a determination result that the positioning procedure of the subject has been finished, the status information of the medical device, and a starting signal of the scan.
    Type: Grant
    Filed: March 16, 2021
    Date of Patent: August 20, 2024
    Assignee: SHANGHAI UNITED IMAGING HEALTHCARE CO., LTD.
    Inventors: Wei Li, Yongqin Xiao, Ziyan Wu
  • Patent number: D1039361
    Type: Grant
    Filed: November 8, 2023
    Date of Patent: August 20, 2024
    Assignee: ASSA ABLOY Americas Residential Inc.
    Inventors: Yos Singtoroj, Wei Hsu, Elliott Schneider