Patents by Inventor WEI-CHAO WANG

WEI-CHAO WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HIGH FREQUENCY EASY MELTING MULTIPLE LAYERED STRUCTURE
    Publication number: 20210395573
    Abstract: The present invention is related to a high frequency easy melting multiple layered structure, which includes a high frequency easy melting coating layer; a high frequency easy melting adhesive layer installed below the high frequency easy melting coating layer and a high frequency easy melting thermoplastic polyurethane (TPU) substrate placed below the high frequency easy melting adhesive layer. They serve to reduce the energy and time period in the high frequency melting and connection so as to promote producing speed and capacity effectively.
    Type: Application
    Filed: June 19, 2020
    Publication date: December 23, 2021
    Inventors: CHIH YI LIN, KUO KUANG CHENG, CHIEN CHIA HUANG, CHIA HO LIN, CHIEN MIN WU, WEI CHAO WANG
  • Electrical contact material of silver matrix capable of resisting arc erosion and containing no cadmium-composite
    Patent number: 8603366
    Abstract: In an electric contact material of silver matrix capable of resisting arc erosion and containing no cadmium-composite, an Ag—(SnO2+In2O3) composite containing 9˜11% of (SnO2+In2O3) or an Ag—Cu oxide, composite containing 15˜25% of Cu oxide is used. The electrical contact material has a contact resistance of 5˜60 milliohms (mohm) and an arc erosion resistance capability up to 2*103˜10*103 times provided that the Vickers hardness (Hv) of the material is 100˜150, the measured current is 1˜5 amperes, and the measured voltage is 10˜20 volts. Two electrical contacts maintain an arc erosion resisting capability at the condition of a low contact resistance when the electrical contact material is formed on a surface of a metal substrate of an electric connector.
    Type: Grant
    Filed: November 29, 2010
    Date of Patent: December 10, 2013
    Assignee: C.C.P. Contact Probes Co., Ltd.
    Inventors: Chin-Wei Hung, Wen-Yuan Chiang, Wei-Chu Chen, Chih-Jung Wang, Wen-Ying Cheng, Bor-Chen Tsai, Wei-Chao Wang
  • ELECTRICAL CONTACT MATERIAL OF SILVER MATRIX CAPABLE OF RESISTING ARC EROSION AND CONTAINING NO CADMIUM-COMPOSITE
    Publication number: 20120132869
    Abstract: In an electric contact material of silver matrix capable of resisting arc erosion and containing no cadmium-composite, an Ag—(SnO2+In2O3) composite containing 9˜11% of (SnO2+In2O3) or an Ag—Cu oxide, composite containing 15˜25% of Cu oxide is used. The electrical contact material has a contact resistance of 5˜60 milliohms (mohm) and an arc erosion resistance capability up to 2*103˜10*103 times provided that the Vickers hardness (Hv) of the material is 100˜150, the measured current is 1˜5 amperes, and the measured voltage is 10˜20 volts. Two electrical contacts maintain an arc erosion resisting capability at the condition of a low contact resistance when the electrical contact material is formed on a surface of a metal substrate of an electric connector.
    Type: Application
    Filed: November 29, 2010
    Publication date: May 31, 2012
    Applicant: C.C.P. CONTACT PROBES CO., LTD.
    Inventors: CHIN-WEI HUNG, WEN-YUAN CHIANG, WEI-CHU CHEN, CHIH-JUNG WANG, WEN-YING CHENG, BOR-CHEN TSAI, WEI-CHAO WANG