Patents by Inventor Wei Cheat Lee

Wei Cheat Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesion Enhancing Structures for a Package
    Publication number: 20200043876
    Abstract: A package includes an electronic chip having a pad. The pad is at least partially covered with adhesion enhancing structures. The pad and the adhesion enhancing structures have at least aluminium in common.
    Type: Application
    Filed: July 24, 2019
    Publication date: February 6, 2020
    Inventors: Evelyn Napetschnig, Wei Cheat Lee, Wei Lee Lim, Frank Renner, Michael Rogalli