Abstract: Multiple chip module (MCM) structures are described. In an embodiment, a module includes a first and second components on the top side of a module substrate, a stiffener structure mounted on the top side of the module substrate, and a lid mounted on the stiffener structure and covering the first component and the second component. The stiffener is joined to the lid within a trench formed in a roof of the lid.

Abstract: A package structure includes a first semiconductor die, a second semiconductor die, an insulating encapsulant and a redistribution layer. The insulating encapsulant laterally surrounds the first semiconductor die and the second semiconductor die, wherein the insulating encapsulant includes a first portion sandwiched in between the first semiconductor die and the second semiconductor die, the first portion has a first recessed part adjacent to an edge of the first semiconductor die, and a second recessed part adjacent to an edge of the second semiconductor die. The redistribution layer is disposed on and electrically connected to the first semiconductor die and the second semiconductor die.

Abstract: A p-GaN high-electron-mobility transistor, includes a substrate, a channel layer stacked on the substrate, a supply layer stacked on the channel layer, a first doped layer stacked on the supply layer, a second doped layer stacked on the first doped layer, and a third doped layer stacked on the second doped layer. A doping concentration of the first doped layer and the doping concentration of the third doped layer are lower than a doping concentration of the second doped layer. A gate is located on the third doped layer, and a source and a drain are electrically connected to the channel layer and the supply layer, respectively.

Abstract: A portable robotic semiconductor pod loader may detect, with at least one sensor, receipt of a semiconductor pod on a load port of the portable robotic semiconductor pod loader. The at least one sensor is supported by the load port. The portable robotic semiconductor pod loader may cause a robot, of the portable robotic semiconductor pod loader, to align with the semiconductor pod provided on the load port. The portable robotic semiconductor pod loader may cause the robot to attach to the semiconductor pod, and may cause the robot to provide the semiconductor pod from the load port to a staging area of a semiconductor processing tool.

Abstract: An electronic device may have a hinge that allows the device to be flexed about a bend axis. A display may span the bend axis. The device may have a stainless steel and/or carbon fiber reinforced polymer layer with slots. The slots may overlap the bend axis. The slots may have at least one property that varies in a non-linear manner as a function of position on the layer. The device may include an adhesive layer with a cutout that overlaps the slots. An interface that defines the cutout may have a plurality of recesses with varying depths. A flexible printed circuit may be attached to an edge of the display panel. The display cover layer may overlap a bonding region between the flexible printed circuit and the edge of the display panel. A UV-curable gap filler may be interposed between the flexible printed circuit and the display cover layer.

Abstract: A slide rail mechanism is provided and includes a supporting member, a slide rail assembly and a rolling member. The slide rail assembly and the supporting member are displaceable relative to each other. The rolling member is arranged on one of the slide rail assembly and the supporting member. The slide rail assembly is configured to engage with the supporting member via the rolling member.

Abstract: A slide rail assembly includes a first rail, a second rail, a working mechanism, an engaging member and an operating member. The second rail is movable relative to the first rail. The working mechanism and the engaging member are arranged on the second rail. When the second rail is moved to a predetermined position along a predetermined direction relative to the first rail, the working mechanism in a first state is configured to be blocked by a blocking feature of the first rail. When the operating member is moved from a first operating position to a second operating position, the working mechanism is driven to switch to a second state to be no longer blocked by the blocking feature. When the operating member is located at the second operating position, the operating member is engaged with the engaging member to be held at the second operation position.

Abstract: A slide rail assembly includes a supporting frame, a first rail, a second rail and a third rail. The first rail is movable relative to the supporting frame. The second rail is movable relative to the first rail. The third rail is movable relative to the second rail, and the second rail is movably mounted between the first rail and the third rail. The first rail can be moved to a second predetermined position from a first predetermined position in a retracting direction relative the supporting frame. The first rail can be retained at the second predetermined position so as to shorten a length of the slide rail assembly such that the third rail can be detached from the second rail easily in a limited environment.

Abstract: A slide rail mechanism is provided and includes a supporting frame and a slide rail assembly. The supporting frame includes a disengaging feature. The slide rail assembly is movable with respect to the supporting frame. The slide rail assembly includes a first rail and a second rail. The second rail and the first rail displace synchronously during a displacement of the second rail with respect to the supporting frame away from a first predetermined position along a first predetermined direction. The disengaging feature of the supporting frame is configured to terminate a displacement synchronization between the second rail and the first rail when the second rail and the first rail are synchronously displaced to a second predetermined position along the first predetermined direction.

Abstract: A cell array structure includes a first resistive memory cell. The first resistive memory cell includes a well region, a first doped region, a merged region, a first gate structure, a second gate structure and a first metal layer. The first doped region is formed under a surface of the well region. The merged region is formed under the surface of the well region. The first gate structure is formed over the surface of the well region between the first doped region and the merged region. The first gate structure includes a first insulation layer and a first conductive layer. The second gate structure is formed over the merged region. The second gate structure includes a second insulation layer and a second conductive layer. The first metal layer is connected with the first doped region.

Abstract: A forming control method for a resistive random-access memory cell array is provided. While a forming action of the resistive random-access memory cell array is performed, a verification action is performed to judge whether the forming action on the resistive random-access memory cells has been successfully done. By properly changing a forming voltage or a pulse width, the forming actions on all of the resistive random-access memory cells of the resistive random-access memory cell array can be successfully done.

Abstract: A slide rail assembly comprises a first rail, a second rail and a handle. When the handle is moved from a first operating position to a second operating position, the handle is configured to unlock the second rail relative to the first rail at a predetermined position.

Abstract: A slide rail mechanism includes a slide rail assembly and an auxiliary rail member. The slide rail assembly includes two slide rails. The auxiliary rail member is movably mounted to a first one of the two slide rails. When a second one of the two slide rails is detached from the first one of the two slide rails along an open direction, the auxiliary rail member is able to be moved from a retracted position to a predetermined extended position along the open direction relative to the first one of the two slide rails. The second one of the two slide rails is configured to carry a first carried object, and the auxiliary rail member is configured to carry a second carried object.

Abstract: A slide rail assembly includes a supporting frame, a first rail, a second rail and a third rail. The first rail is movable relative to the supporting frame. The second rail is movable relative to the first rail. The third rail is movable relative to the second rail, and the second rail is movably mounted between the first rail and the third rail. The first rail can be moved to a second predetermined position from a first predetermined position in a retracting direction relative the supporting frame. The first rail can be retained at the second predetermined position so as to shorten a length of the slide rail assembly such that the third rail can be detached from the second rail easily in a limited environment.

Abstract: A slide rail assembly includes a supporting frame, a first rail, a second rail and a third rail. The first rail is movable relative to the supporting frame. The second rail is movable relative to the first rail. The third rail is movable relative to the second rail. When the slide rail assembly is at an extending state, the first rail is located at a predetermined position relative to the supporting frame, the second rail is located at an extended position relative to the first rail, the third rail is located at an opened position relative to the second rail and a rear rail section of the third rail is overlapped with a front rail section of the first rail.

Abstract: An antioxidant conductive thermal paste and a method of manufacturing the same are provided. The antioxidant conductive thermal paste includes a reactive monomer, a thermosetting resin, a polymerization inhibitor, an electrically conductive filler, and a thixotropic agent. The method consists of the steps of mixing a reactive monomer, a thermosetting resin, and a polymerization inhibitor evenly to get a first polymer mixture, and adding an electrically conductive filler and a thixotropic agent into the first polymer mixture in turn and blending the mixture evenly to obtain an antioxidant conductive thermal paste with good adherence, high electrical conductivity, high thermal conductivity, improved thermal-mechanical fatigue resistance or mechanical fatigue resistance.

Abstract: A slide rail assembly includes a first rail, a second rail, and an auxiliary member. The first rail includes a passage, and the passage includes a passage opening. The second rail is inserts in the passage from the passage opening through being guided by the auxiliary member.

Abstract: A slide rail assembly includes a first rail, a second rail, a slide-facilitating device, and a working member. The second rail is movably mounted in a channel of, and is displaceable with respect to, the first rail. The slide-facilitating device is movably mounted between the rails and includes an engaging feature. The working member is provided on the first rail and includes a main body portion, an elastic portion for supporting the main body portion, and a predetermined portion connected to the main body portion. The first rail includes a supporting portion for supporting the elastic portion of the working member. The engaging feature is engaged with the predetermined portion of the working member when the slide-facilitating device is at a predetermined position.