Abstract: A powder metallurgical method for fabricating a high-density soft magnetic metallic material comprises steps of providing an initial powder; using a spray drying process to fabricate the initial powder into a spray-dried powder; placing the spray-dried powder in a mold and compacting the spray-dried powder under a compacting pressure and a compacting temperature to form a green compact; and sintering the green compact at a sintering temperature to form a soft magnetic metallic material. The spray-dried powder, which is fabricated by the spray drying process, has superior flowability, compactability and compressibility and is suitable for the press-and-sinter process. The soft magnetic metallic material fabricated by the present invention is outstanding in sintered density and magnetic performance. The present invention adopts the inexpensive press-and-sinter process and has a low fabrication cost.

Abstract: An expanding and retracting structure for a control shaft of a bicycle mounted on a cylinder member includes a positioning member, and an engaging member, the positioning member and the engaging member being disposed on a top end of the cylinder member, the engaging member being a locking loop to be quickly retracted or expanded its inner diameter and to move the positioning member, in the cylinder member being fixed a bolt element; a screw screwed in the bolt element and having a tab mounted on a top portion thereof; a shaft member pivotally connecting with the screw, and the screw and the shaft member being insert into the cylinder member, the shaft member including a positioning slot to insert the positioning member, at a predetermined position of the shaft member being connected a connecting tube.

Abstract: A chip carrier for accommodating a passive component is proposed, allowing at least a chip to be electrically connected to the chip carrier. At least a pair of spaced-apart solder pads are formed on the chip carrier in no interference with the electrical connection between the chip and the chip carrier. A passive component is bonded at its two ends onto the solder pads by solder paste that electrically connects the passive component to the chip carrier. A recessed portion formed between the pair of the solder pads, is associated with a bottom surface of the passive component to form a passage, allowing a resin material for encapsulating the passive component or the chip to pass through and fill the passage, whereby the filled passage can prevent bridging of the solder paste and short circuit of the passive component from occurrence, thereby making yield of fabricated products desirably improved.

Abstract: A semiconductor package structure having universal lead frame and heat sink comprises a chip, a lead frame, a heat sink, a bonding wire, and a molding compound. The leads of the lead frame approaches toward the center portion of the lead frame in order to adapt to various sizes of the chip. The heat sink is mounted on and connected to the leads of the lead frame, and the periphery of the heat sink overlaps the front end of the leads wherein the dimension of the heat sink is not smaller than the size of the chip. The chip is disposed on the heat sink that is also functioned as die pad. The chip is electrically connected to the leads by a bonding wire that is designed to be the shortest. An “electrically insulative, and thermally conductive layer” is employed for bonding the heat sink to the lead frame.

Abstract: A semiconductor package structure having universal lead frame and heat sink comprises a chip, a lead frame, a heat sink, a bonding wire, and a molding compound. The leads of the lead frame approaches toward the center portion of the lead frame in order to adapt to various sizes of the chip. The heat sink is mounted on and connected to the leads of the lead frame, and the periphery of the heat sink overlaps the front end of the leads wherein the dimension of the heat sink is not smaller than the size of the chip. The chip is disposed on the heat sink that is also functioned as die pad. The chip is electrically connected to the leads by a bonding wire that is designed to be the shortest. An “electrically insulative, and thermally conductive layer” is employed for bonding the heat sink to the lead frame.